JP2020010004A - 抵抗器及び回路基板 - Google Patents

抵抗器及び回路基板 Download PDF

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Publication number
JP2020010004A
JP2020010004A JP2018132594A JP2018132594A JP2020010004A JP 2020010004 A JP2020010004 A JP 2020010004A JP 2018132594 A JP2018132594 A JP 2018132594A JP 2018132594 A JP2018132594 A JP 2018132594A JP 2020010004 A JP2020010004 A JP 2020010004A
Authority
JP
Japan
Prior art keywords
resistor
layer
bonding
bonding layer
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018132594A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020010004A5 (https=
Inventor
周平 松原
Shuhei Matsubara
周平 松原
仲村　圭史
Keiji Nakamura
圭史 仲村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koa Corp
Original Assignee
Koa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koa Corp filed Critical Koa Corp
Priority to JP2018132594A priority Critical patent/JP2020010004A/ja
Priority to CN201980043950.3A priority patent/CN112335000B/zh
Priority to US17/257,971 priority patent/US11282621B2/en
Priority to PCT/JP2019/024796 priority patent/WO2020012926A1/ja
Priority to DE112019003546.0T priority patent/DE112019003546T5/de
Publication of JP2020010004A publication Critical patent/JP2020010004A/ja
Publication of JP2020010004A5 publication Critical patent/JP2020010004A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/01—Mounting; Supporting
    • H01C1/012—Mounting; Supporting the base extending along and imparting rigidity or reinforcement to the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/144—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H01C3/10—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element having zig-zag or sinusoidal configuration
    • H01C3/12—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element having zig-zag or sinusoidal configuration lying in one plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Adjustable Resistors (AREA)
  • Details Of Resistors (AREA)
JP2018132594A 2018-07-12 2018-07-12 抵抗器及び回路基板 Pending JP2020010004A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018132594A JP2020010004A (ja) 2018-07-12 2018-07-12 抵抗器及び回路基板
CN201980043950.3A CN112335000B (zh) 2018-07-12 2019-06-21 电阻器及电路基板
US17/257,971 US11282621B2 (en) 2018-07-12 2019-06-21 Resistor and circuit substrate
PCT/JP2019/024796 WO2020012926A1 (ja) 2018-07-12 2019-06-21 抵抗器及び回路基板
DE112019003546.0T DE112019003546T5 (de) 2018-07-12 2019-06-21 Widerstand und Schaltungssubstrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018132594A JP2020010004A (ja) 2018-07-12 2018-07-12 抵抗器及び回路基板

Publications (2)

Publication Number Publication Date
JP2020010004A true JP2020010004A (ja) 2020-01-16
JP2020010004A5 JP2020010004A5 (https=) 2021-07-29

Family

ID=69141832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018132594A Pending JP2020010004A (ja) 2018-07-12 2018-07-12 抵抗器及び回路基板

Country Status (5)

Country Link
US (1) US11282621B2 (https=)
JP (1) JP2020010004A (https=)
CN (1) CN112335000B (https=)
DE (1) DE112019003546T5 (https=)
WO (1) WO2020012926A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12432856B2 (en) * 2021-03-29 2025-09-30 KYOCERA AVX Components Corporation Surface mount radiofrequency component
CN113380478A (zh) * 2021-06-07 2021-09-10 广东意杰科技有限公司 模块型合金片功率电阻器
DE102023000899A1 (de) * 2023-03-10 2024-09-12 Wieland-Werke Aktiengesellschaft Verfahren zur Herstellung einer Widerstandsanordnung
CN118527670B (zh) * 2024-07-19 2024-10-18 广东省科学院新材料研究所 高阻尼锰铜合金及其冷喷涂增材制造方法和应用

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62193102A (ja) * 1986-02-19 1987-08-25 松下電工株式会社 セラミツク配線基板の製法
JPH0343985A (ja) * 1989-07-12 1991-02-25 Mitsubishi Electric Corp 薄型高温ヒータおよびその製造方法
JPH07297513A (ja) * 1994-04-27 1995-11-10 Matsushita Electric Works Ltd 抵抗体付きセラミックプリント配線板及びその製造方法
JPH10241903A (ja) * 1997-02-26 1998-09-11 Susumu Kogyo Kk チップ抵抗器
JP2002075705A (ja) * 2000-08-31 2002-03-15 Toshiba Corp 抵抗体基板
JP2014204094A (ja) * 2013-04-10 2014-10-27 株式会社Ａｄｎ 抵抗器および抵抗器の製造方法
JP2015002212A (ja) * 2013-06-13 2015-01-05 ローム株式会社 チップ抵抗器、チップ抵抗器の実装構造
US20160163432A1 (en) * 2014-12-08 2016-06-09 Vishay Dale Electronics, Inc. Thermally sprayed thin film resistor and method of making
JP2017112353A (ja) * 2015-12-18 2017-06-22 サムソン エレクトロ−メカニックス カンパニーリミテッド． チップ抵抗器

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3605425A1 (de) * 1986-02-20 1987-08-27 Standard Elektrik Lorenz Ag Duennschichtschaltung und ein verfahren zu ihrer herstellung
US5468672A (en) * 1993-06-29 1995-11-21 Raytheon Company Thin film resistor and method of fabrication
US5680092A (en) * 1993-11-11 1997-10-21 Matsushita Electric Industrial Co., Ltd. Chip resistor and method for producing the same
JP3758331B2 (ja) 1997-09-18 2006-03-22 富士電機デバイステクノロジー株式会社 半導体装置用のシャント抵抗素子およびその実装方法並びに半導体装置
US6489881B1 (en) * 1999-10-28 2002-12-03 International Rectifier Corporation High current sense resistor and process for its manufacture
DE10144269A1 (de) * 2001-09-08 2003-03-27 Bosch Gmbh Robert Sensorelement zur Erfassung einer physikalischen Messgröße zwischen tribologisch hoch beanspruchten Körpern
JP3826046B2 (ja) * 2002-02-08 2006-09-27 コーア株式会社 抵抗器およびその製造方法
JP4394477B2 (ja) * 2003-03-27 2010-01-06 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合基板の製造方法
JP2005078874A (ja) * 2003-08-29 2005-03-24 Taiyosha Electric Co Ltd ジャンパーチップ部品及びジャンパーチップ部品の製造方法
CN101364462A (zh) * 2007-08-10 2009-02-11 斐成企业股份有限公司 芯片电阻器及其制法
CN101430955A (zh) * 2007-11-09 2009-05-13 国巨股份有限公司 晶片电阻元件及其制造方法
US8242878B2 (en) * 2008-09-05 2012-08-14 Vishay Dale Electronics, Inc. Resistor and method for making same
JP2010114167A (ja) * 2008-11-04 2010-05-20 Sumitomo Metal Mining Co Ltd 低抵抗チップ抵抗器及びその製造方法
KR101412951B1 (ko) * 2012-08-17 2014-06-26 삼성전기주식회사 칩 저항기 및 이의 제조 방법
JP2015170727A (ja) * 2014-03-07 2015-09-28 パナソニックＩｐマネジメント株式会社 抵抗器およびその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62193102A (ja) * 1986-02-19 1987-08-25 松下電工株式会社 セラミツク配線基板の製法
JPH0343985A (ja) * 1989-07-12 1991-02-25 Mitsubishi Electric Corp 薄型高温ヒータおよびその製造方法
JPH07297513A (ja) * 1994-04-27 1995-11-10 Matsushita Electric Works Ltd 抵抗体付きセラミックプリント配線板及びその製造方法
JPH10241903A (ja) * 1997-02-26 1998-09-11 Susumu Kogyo Kk チップ抵抗器
JP2002075705A (ja) * 2000-08-31 2002-03-15 Toshiba Corp 抵抗体基板
JP2014204094A (ja) * 2013-04-10 2014-10-27 株式会社Ａｄｎ 抵抗器および抵抗器の製造方法
JP2015002212A (ja) * 2013-06-13 2015-01-05 ローム株式会社 チップ抵抗器、チップ抵抗器の実装構造
US20160163432A1 (en) * 2014-12-08 2016-06-09 Vishay Dale Electronics, Inc. Thermally sprayed thin film resistor and method of making
JP2017112353A (ja) * 2015-12-18 2017-06-22 サムソン エレクトロ−メカニックス カンパニーリミテッド． チップ抵抗器

Also Published As

Publication number Publication date
US11282621B2 (en) 2022-03-22
US20210225562A1 (en) 2021-07-22
WO2020012926A1 (ja) 2020-01-16
DE112019003546T5 (de) 2021-03-25
CN112335000B (zh) 2022-06-14
CN112335000A (zh) 2021-02-05

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