CN106797701B - 具有连接元件的电子的器件 - Google Patents

具有连接元件的电子的器件 Download PDF

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CN106797701B
CN106797701B CN201580055656.6A CN201580055656A CN106797701B CN 106797701 B CN106797701 B CN 106797701B CN 201580055656 A CN201580055656 A CN 201580055656A CN 106797701 B CN106797701 B CN 106797701B
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metal layer
base
connecting element
electric connection
layer
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CN106797701A (zh
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T.波伊泽
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Robert Bosch GmbH
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Robert Bosch GmbH
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Abstract

本发明涉及一种电子的器件。所述电子的器件2具有带有两个电接头4、5的电组件3，所述电接头分别构造在所述组件的彼此对置的面处。所述器件针对每个接头4、5具有至少一个能够导电的连接元件9、10，所述连接元件具有用于与电路载体22相连接的固定脚14、15。根据本发明，所述连接元件8、9至少在一个区段上具有至少两个金属层10、11、12、13，其中所述金属层分别由彼此不同的金属构成并且彼此材料锁合地连接。优选的是，所述金属层中的一个金属层12、13具有比另外的金属层10、11更大的导热性。

Description

具有连接元件的电子的器件
技术领域
本发明涉及一种电子的器件。所述电子的器件具有带有两个电接头的电组件，所述电接头分别构造在所述组件的彼此对置的面处、尤其端面处。所述器件针对每个接头具有至少一个能够导电的连接元件。所述连接元件具有用于与电路载体相连接的固定脚，其中所述连接元件与所述器件的电接头材料锁合地连接并且构造用于承载所述器件。
发明内容
根据本发明，所述连接元件至少在所述连接元件的一个区段上具有至少两个金属层，其中所述金属层分别由彼此不同的金属构成。所述金属层彼此材料锁合地连接，其中所述金属层的基层与所述接头相连接，并且在所述固定脚的区域中构造用于与电路载体进行电连接、尤其材料锁合地连接、尤其钎焊连接、烧结连接或者能够导电地粘合连接。优选的是，所述金属层的至少一个另外的金属层与所述基层在热方面或者额外地在电方面并联。优选的是，另外的金属层、尤其与所述基层材料锁合地连接的金属层具有比所述基层更大的导热性。因此，与仅仅由所述基层所构成的连接元件相比，能够有利地将由所述电子的器件所产生的损耗热量通过具有得到改进的导热性的连接元件来排出。因此，与具有由所述基层所构成的连接元件的器件相比，能够进一步有利地通过相同的器件来产生更大的损耗功率。
优选的是，所述金属层至少从用于所述器件的接头的连接直至所述固定脚尤其不中断地、材料锁合地彼此相连接。材料锁合的连接例如能够通过包层、尤其滚压包层、电镀或者阴极的喷粉（kathodisches aufstäuben）或者通过硬钎焊或者通过激光熔焊来产生。因此，所述连接元件以及因此还有所述器件能够有利地费用低廉地来提供。因此，例如为了制造所述连接元件、尤其连接角元件，能够通过以下方式来制造包括两个金属层——也就是前面所提到的基层和具有比基层更大的导热性的所述另外的金属层——的板材：所述金属层借助于包层、尤其滚压包层彼此相连接。而后，如此构造为双层的板材能够借助于冲压过程和/或形变过程来成形为弯曲的连接元件。
有利的是，为了制造具有连接元件的器件，因此不需要原则上改变制造过程，所述电子的组件具有所述连接元件。
有利的是，也就是仅仅由一个金属层所构成的连接元件能够被包括至少两个金属层的连接元件所取代。由此能够形成在热方面得到改进的器件。
优选的是，所述连接元件为此具有至少两个、仅仅两个或者三个金属层。
在一种优选的实施方式中，所述基层由包括铁的合金形成，并且具有比基层更大的导热性的所述另外的层由铜层形成。
由此，能够有利地费用低廉地提供所述器件。有利的是，在将铜用作另外的层的情况下，所述另外的金属层的层厚度仅仅需要为所述基层的层厚度的一部分，以如此引起所述连接元件的导热性的显著的改进。
优选的是，与所述基层直接连接的另外的金属层的层厚度在所述基层的层厚度的十分之一到二分之一之间。例如，作为铜层的所述另外的层的层厚度为所述基层、尤其铁合金层的层厚度的三分之一。所述基层例如由下述合金形成，所述合金包括30%到45%的镍或者额外地包括至少一种另外的合金成分并且作为其余的成分或主要成分包括铁。有利的是，由这样的合金所构成的基层具有足够好的导电性和低的热膨胀系数。这样的基层的热膨胀系数优选小于10 ppm每开尔文。
在一种优选的实施方式中，所述器件是电容器、尤其陶瓷的电容器或者薄膜电容器、例如SMD薄膜电容器（SMD=Surface-Mounted-Device：表面贴装器件）。因此，功率电容器能够有利地构造为器件，所述功率电容器与具有由仅仅一个基层所构成的连接元件的相同的功率电容器相比，能够产生并且也能够排出更大的热功率。
优选的是，所述电子的器件包括具有方形形状或者柱筒形状的电组件尤其电容器、二极管或者电阻，其中所述组件的端面分别由电接头形成。由此所述器件能够有利地以节省空间的方式利用所述连接元件与电路载体钎焊在一起。
在一种优选的实施方式中，所述组件是电阻或者二极管、尤其半导体二极管、优选功率-半导体二极管。所述电阻和/或所述二极管分别构造用于：与电路载体钎焊、尤其回流-钎焊、选择性钎焊或者波钎焊（wellenverlöten）在一起。为此，能够将所述器件以所述固定脚安放到所述电路载体上并且也安放到所述电路载体的能够导电的层、尤其印制导线上，其中所述能够导电的层已经用焊膏来压印。在随后的用于将所述器件与所述电路载体钎焊在一起的步骤中，所述电路载体能够连同所述器件——例如在回流钎焊炉中——钎焊在一起。
优选的是，所述器件构造用于与所述电路载体进行钎焊连接、优选回流-钎焊连接。通过良好地热连接到所述电路载体处这种方式，所述器件得到了良好的冷却。有利的是，所述器件、尤其前面所提到的电容器、电阻或者二极管不需要额外地通过另外的冷却体来冷却，并且因此也不需要被耦接到另外的分开的冷却体、例如具有对流散热片的铝冷却体处，以能够通过所述器件来导引更大的功率并且就这样也产生形式为损耗热量的更大的损耗功率。
与所述基层材料锁合地连接的所述另外的金属层优选是铜层、铝层或者银层。所述银层有利地具有大的导热性，使得作为银层的所述另外的金属层与铝层或者铜层相比能够构造得更薄，以将相同的热功率通过所述连接元件来输送给所述电路载体。
在所述器件的一种优选的实施方式中，所述连接元件是角元件（Winkelelement），所述角元件具有两个成形在彼此处并且以预先确定的角度相对于彼此延伸的支臂。所述连接元件的一个支臂在此形成固定脚，其中所述另外的支臂形成连接支臂，所述连接支臂与所述电接头相连接、尤其钎焊连接、借助于可传导的粘合剂能够导电地粘合连接或者熔焊连接。所述熔焊连接例如借助于电阻熔焊或者激光熔焊来产生。因此，所述器件能够有利地费用低廉地设有固定脚。
在一种优选的实施方式中，所述连接元件具有另外的金属层，所述另外的金属层由所述基层的金属构成。与基层相比具有更大的导热性的金属层——尤其根据三明治的方式——被包围在所述基层与由基层的金属所构成的所述另外的金属层之间。优选的是，由基层的金属所构成的所述另外的金属层与具有更大的导热性的所述另外的金属层材料锁合地连接。通过这种方式形成了材料锁合地连接的三明治复合结构，所述三明治复合结构有利地——例如借助于滚压包层——作为用于制造所述连接元件的未加工板材-原材料来费用低廉地提供。如此形成的连接元件有利地在温度变化时具有横向于其平面的延伸部（Erstreckung）的较小的弯曲部，就此而言，通过彼此不同的金属层的彼此不同的热膨胀系数所产生的双金属效应能够通过由基层的金属所构成的所述另外的金属层来补偿。
在另一种实施方式中，所述另外的金属层由与所述基层不同的金属构成，并且具有与所述基层的热膨胀系数相同的或者同种的热膨胀系数。因此，能够有利地在温度变化时防止所述连接元件的弯曲并且就这样防止所述连接元件从所述接头或者从所述电路载体松脱。
附图说明
下面借助于附图和另外的实施例对本发明进行描述。另外的有利的实施变型方案由在从属权利要求和在附图中所描述的特征得出。
图1示出了一种用于具有方形的电子的器件的连接装置的实施例，所述电子的器件具有布置在彼此对置的端面处的电接头，所述电接头借助于构造为双层的连接元件与电路载体钎焊连接；并且
图2示出了一种用于电子的器件的实施例，所述电子的器件具有分别带有三个金属层的连接元件。
具体实施方式
图1示意性地示出了一种用于连接装置1的实施例。所述连接装置1具有电子的器件2。所述电子的器件2在这种实施例中具有电子的组件3、在这种实施例中是电容器、尤其构造为陶瓷的电容器。所述电子的组件3具有电接头4和电接头5。所述电接头4和5分别构造为能够导电的层，所述能够导电的层将所述电子的组件3、在这种实施例中是电容器包围在彼此之间并且所述能够导电的层彼此平行地延伸。
所述器件2也具有连接元件8，其中所述连接元件8由角元件形成。所述连接元件8具有由所述连接元件8的一个支臂所形成的固定脚14和另外的支臂18，其中连接支臂18具有接触面20，所述接触面指向所述接头5，并且借助于焊剂6与所述接头5材料锁合地钎焊连接。
所述连接元件8的形成固定脚14的支臂相对于所述连接支臂18以直角延伸。
所述连接元件8在这种实施例中具有两个金属层、也就是一个基层10和一个另外的金属层12，所述两个金属层分别放在彼此上并且材料锁合地彼此连接。所述基层10与所述另外的金属层12之间的材料锁合的连接在这种实施例中借助于滚压包层来产生。
所述基层10在这种实施例中由铁-镍-合金构成，其中镍份额为42%。所述另外的金属层12在这种实施例中由铜层形成。所述另外的金属层12的厚度延伸部在这种实施例中为所述基层10的厚度延伸部的三分之一。
例如所述基层10的厚度延伸部为0.6mm，并且所述另外的金属层12、在这种实施例中是铜层的厚度延伸部为0.2mm。对于所述连接元件8的这样的层布置结构来说，与仅仅包括所述基层10的连接元件相比，能够将30%更多的热量通过所述连接元件8从所述器件2排出。
所述固定脚14在这种实施例中借助于焊剂25与电路载体22的能够导电的层23、尤其印制导线相连接。所述电路载体22在这种实施例中具有电绝缘的层45、尤其纤维加强的环氧树脂层或者陶瓷层，所述电绝缘的层与作为所述电路载体22的组成部分的能够导电的层23相连接。所述电路载体22也具有能够导电的层24、尤其印制导线，所述能够导电的层借助于焊剂26与连接元件9的固定脚15钎焊在一起，并且就这样与所述器件2的接头4能够导电地连接。所述连接元件9在这种实施例中是所述器件2的组成部分，其中所述连接元件9如所述连接元件8一样地构造。为此，所述连接元件9具有连接支臂19，所述连接支臂具有接触面21，所述接触面朝向由能够导电的层所形成的电接头4，并且借助于焊剂7与所述器件2的电接头4钎焊在一起。
在所述连接支臂19处成形了由固定脚15所形成的另外的支臂。由所述固定脚15所形成的所述支臂和所述连接支臂19分别相对于彼此以直角延伸。
所述连接元件9具有金属层，所述金属层形成基层11。所述基层11相当于所述连接元件8的基层10。在这种实施例中，借助于滚压包层材料锁合地连接的另外的金属层13、在这种实施例中是铜层与所述基层11相连接。所述另外的金属层13在这种实施例中具有下述厚度延伸部，所述厚度延伸部为所述基层11的厚度延伸部的三分之一。
为了制造所述连接装置1，能够将所述器件2安放到所述电路载体3上，其中所述电路载体3、尤其所述能够导电的层23和24能够分别用作为焊剂25或者26的焊膏来压印。
而后，所述器件2为了与所述电路载体22进行钎焊连接而能够被安放到所述电路载体22上。为此，能够将所述连接元件8的固定脚14以所述固定脚14的、在这种实施例中形成支承面的接触面16放到焊剂25上，并且能够将所述连接元件9的固定脚15以形成所述连接元件9的支承面的接触面17放到焊剂26上。
而后，为了将所述器件2与所述电路载体22钎焊在一起，能够在钎焊炉中对所述连接装置1进行回流-钎焊。
图2示意性地示出了一种用于器件40的实施例。所述器件40在这种实施例中具有电组件27。所述电组件27例如由二极管、尤其半导体二极管、电容器或者电阻形成。
所述电组件27在另一种实施方式中也能够构造为电容器、尤其构造为陶瓷的电容器或者构造为电阻。所述电组件27具有电接头28、电接头29。所述电接头28借助于焊剂43与连接元件30的连接支臂42相连接。所述连接元件30具有成形到所述连接支臂42处的、作为另外的支臂的固定脚38。所述固定脚38和所述连接支臂42在这种实施例中相对于彼此以直角延伸。
所述连接元件30在这种实施例中包括作为基层的金属层32，所述金属层与另外的金属层34材料锁合地连接，所述另外的金属层具有比所述基层32更大的导热性。具有比所述基层32更大的导电性的所述另外的金属层34与另外的金属层36材料锁合地连接，其中所述另外的金属层36由所述基层32的金属构成。因此也能够有利地对双金属效应进行补偿，所述双金属效应可能由于所述基层32和所述另外的金属层34的彼此不同的热膨胀系数而产生。
所述基层32和所述另外的金属层36在这种实施例中由铁-镍-合金构成，其中合金的镍份额为42%。具有比所述金属层32和36更大的导热性的所述另外的金属层34在这种实施例中由铜层形成。所述另外的金属层34的厚度延伸部在这种实施例中为所述基层32的厚度延伸部的1/3。所述另外的金属层36的厚度延伸部在这种实施例中为所述基层32的厚度延伸部的二分之一。
所述器件40在这种实施例中也具有另外的电接头29，所述另外的电接头借助于焊剂44与连接元件31的连接支臂41相连接。所述连接元件31具有固定脚39，所述固定脚形成所述连接元件31的支臂。所述连接元件31的固定脚39和连接支臂41分别相对于彼此以直角延伸。
所述连接元件31在这种实施例中包括作为基层33的金属层，所述金属层这种实施例中借助于滚压包层材料锁合地与另外的金属层35相连接。所述金属层33和35在这种实施例中直接放在彼此上。所述另外的金属层35在这种实施例中具有比所述基层33更大的导热性。所述另外的金属层35在这种实施例中与另外的金属层37材料锁合地连接。所述金属层33和37 ——根据三明治的方式——将所述另外的金属层35包围在彼此之间。
对于所述连接元件30来说，所述金属层32和36——根据三明治的方式——将所述另外的金属层34包围在彼此之间。所述另外的金属层35在这种实施例中构造为铜层。所述基层33和所述另外的金属层37在这种实施例中由包括42%的镍的铁合金形成。
所述连接元件30能够取代图1中的连接元件8而与所述电子的组件3并且在那里与所述电接头5钎焊连接。所述连接元件31能够取代图1中的连接元件9而与所述电子的组件3并且在那里与所述电接头4钎焊连接。所述电子的组件3由此能够取代所述连接元件8和9而具有所述连接元件30或者说31。
所述连接元件30和31的分别形成一个固定脚的支臂在这种实施例中背向彼此。在另一种实施方式中，由所述固定脚38和39所形成的支臂朝向彼此。在这种实施方式中，所述固定脚38和39分别平行于所述电子的组件27来延伸，从而在连接装置、如所述连接装置1的情况下所述固定脚38和39布置在所述电子的组件27与所述电路载体22之间。

Claims (12)

1.电子的器件（2、40），所述电子的器件包括带有两个电接头（4、5、28、29）的电组件（3、27），所述电接头（4、5、28、29）分别构造在所述电组件（3、27）的彼此对置的面处，其中所述器件（2、40）针对所述电接头（4、5、28、29）中的每个电接头具有能够导电的连接元件（8、9、30、31），其中所述连接元件具有用于与电路载体（22）进行材料锁合地电连接的固定脚（14、15、38、39），其中所述连接元件（8、9、30、31）与所述电接头（4、5、28、29）材料锁合地连接并且构造用于承载所述器件（2、40），
其特征在于，
所述连接元件（8、9、30、31）具有至少两个彼此材料锁合地连接的金属层（10、12、11、13、32、33、34、35、36、37），其中所述连接元件的基层（10、11、32、33）与所述电接头（4、5、28、29）相连接，并且在所述固定脚（14、15、38、39）的区域中构造用于与电路载体（22）进行钎焊连接，从而所述连接元件的至少一个第一金属层（12、13、34、35）与所述基层（10、11、32、33）在热方面并联，其中所述第一金属层（12、13、34、35）具有比所述基层（10、11、32、33）更大的导热性，其中所述连接元件（8、9、30、31）具有第二金属层（36、37），所述第二金属层由所述基层（10、11、32、33）的金属构成，其中具有更大的导热性的所述第一金属层被包围在所述基层（10、11、32、33）与由基层（10、11、32、33）的金属所构成的所述第二金属层（36、37）之间。
2.按权利要求1所述的器件（2、40），
其特征在于，
所述金属层（10、11、12、13、32、33、34、35、36、37）至少从用于所述器件（2、40）的电接头（4、5、28、29）的连接部分直至所述固定脚（14、15、38、39）材料锁合地彼此连接。
3.按前述权利要求中任一项所述的器件（2、40），
其特征在于，
所述基层（10、11、32、33）由包括铁的合金形成，并且具有比所述基层（10、11、32、33）更大的导热性的所述第一金属层（12、13、34、35）由铜层或者铝层形成。
4.按权利要求1或2所述的器件（2、40），
其特征在于，
所述基层（10、11、32、33）具有30%到45%之间的镍并且作为另外的成分具有铁。
5.按权利要求1或2所述的器件（2、40），
其特征在于，
与所述基层（10、11、32、33）相连接的所述第一金属层（12、13、34、35）的层厚度为所述基层（10、11、32、33）的层厚度的十分之一到二分之一之间。
6.按权利要求1或2所述的器件（2、40），
其特征在于，
所述连接元件（8、9、30、31）是角元件，所述角元件具有两个成形在彼此处并且以预先确定的角度相对于彼此延伸的支臂（14、18、15、19、38、39、41、42），其中一个支臂形成所述固定脚（14、15、38、39），并且另外的支臂（18、19、41、42）形成连接支臂，所述连接支臂与所述电接头（4、5、28、29）相连接。
7.按权利要求1或2所述的器件（2、40），
其特征在于，
材料锁合地彼此连接的所述金属层（10、12、11、13、32、33、34、35、36、37）借助于滚压包层来彼此连接。
8.按权利要求1或2所述的器件（2、40），
其特征在于，
所述电组件（3、27）是电容器。
9.按权利要求1或2所述的器件（2、40），
其特征在于，
所述电组件（3、27）是半导体二极管或者电阻。
10.按权利要求1所述的器件（2、40），
其特征在于，
所述连接元件具有用于与电路载体（22）进行钎焊连接的固定脚（14、15、38、39）。
11.按权利要求1所述的器件（2、40），
其特征在于，
具有更大的导热性的所述第一金属层根据三明治的方式被包围在所述基层（10、11、32、33）与由基层（10、11、32、33）的金属所构成的所述第二金属层（36、37）之间。
12.按权利要求8所述的器件（2、40），
其特征在于，
所述电组件（3、27）是陶瓷的电容器。
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