JP2020004936A5 - - Google Patents

Download PDF

Info

Publication number
JP2020004936A5
JP2020004936A5 JP2018126223A JP2018126223A JP2020004936A5 JP 2020004936 A5 JP2020004936 A5 JP 2020004936A5 JP 2018126223 A JP2018126223 A JP 2018126223A JP 2018126223 A JP2018126223 A JP 2018126223A JP 2020004936 A5 JP2020004936 A5 JP 2020004936A5
Authority
JP
Japan
Prior art keywords
hole
support substrate
active layer
insulating film
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018126223A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020004936A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2018126223A priority Critical patent/JP2020004936A/ja
Priority claimed from JP2018126223A external-priority patent/JP2020004936A/ja
Priority to PCT/JP2019/025670 priority patent/WO2020009003A1/ja
Publication of JP2020004936A publication Critical patent/JP2020004936A/ja
Publication of JP2020004936A5 publication Critical patent/JP2020004936A5/ja
Priority to US17/137,751 priority patent/US20210119001A1/en
Pending legal-status Critical Current

Links

JP2018126223A 2018-07-02 2018-07-02 半導体装置およびその製造方法 Pending JP2020004936A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018126223A JP2020004936A (ja) 2018-07-02 2018-07-02 半導体装置およびその製造方法
PCT/JP2019/025670 WO2020009003A1 (ja) 2018-07-02 2019-06-27 半導体装置およびその製造方法
US17/137,751 US20210119001A1 (en) 2018-07-02 2020-12-30 Semiconductor device and manufacturing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018126223A JP2020004936A (ja) 2018-07-02 2018-07-02 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2020004936A JP2020004936A (ja) 2020-01-09
JP2020004936A5 true JP2020004936A5 (https=) 2020-10-15

Family

ID=69059526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018126223A Pending JP2020004936A (ja) 2018-07-02 2018-07-02 半導体装置およびその製造方法

Country Status (3)

Country Link
US (1) US20210119001A1 (https=)
JP (1) JP2020004936A (https=)
WO (1) WO2020009003A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230223403A1 (en) * 2020-06-08 2023-07-13 Rohm Co., Ltd. Semiconductor device and electronic apparatus
KR20230104598A (ko) * 2020-11-09 2023-07-10 소니 세미컨덕터 솔루션즈 가부시키가이샤 촬상 장치, 촬상 장치의 제조 방법 및 전자 기기

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661190A (ja) * 1992-08-05 1994-03-04 Hitachi Ltd ドライエッチング方法
JP2003110027A (ja) * 2001-09-28 2003-04-11 Toshiba Corp 半導体装置および半導体装置の製造方法
JP3741086B2 (ja) * 2002-07-04 2006-02-01 株式会社デンソー 絶縁分離型半導体装置のための評価用半導体基板及び絶縁不良評価方法
JP2004207271A (ja) * 2002-12-20 2004-07-22 Nec Electronics Corp Ｓｏｉ基板及び半導体集積回路装置
JP2004363182A (ja) * 2003-06-02 2004-12-24 Sumitomo Mitsubishi Silicon Corp 貼り合わせ誘電体分離ウェーハおよびその製造方法
JP2009054828A (ja) * 2007-08-28 2009-03-12 Renesas Technology Corp 半導体装置およびその製造方法
US7999320B2 (en) * 2008-12-23 2011-08-16 International Business Machines Corporation SOI radio frequency switch with enhanced signal fidelity and electrical isolation
JP5766462B2 (ja) * 2011-02-24 2015-08-19 ローム株式会社 半導体装置およびその製造方法
JP2013098255A (ja) * 2011-10-28 2013-05-20 Elpida Memory Inc 半導体装置及びその製造方法

Similar Documents

Publication Publication Date Title
TWI645549B (zh) 半導體記憶裝置及其製造方法
JP5239621B2 (ja) 半導体装置の製造方法
JP2016213468A5 (https=)
JP2012060115A5 (https=)
JP2015170692A (ja) 半導体装置及びその製造方法
JP2014204047A5 (https=)
JP2017504964A5 (https=)
CN110534524A (zh) 垂直半导体装置
JP2018537859A5 (https=)
JP2015153787A5 (https=)
JP2011086941A5 (https=)
JP2015527211A5 (https=)
JP2017005117A5 (https=)
JP2019134078A5 (ja) 半導体装置の製造方法
JP2015529017A5 (https=)
JP2015506593A5 (ja) 半導体表面の粗面化方法
JP2018117070A5 (https=)
JP2020181854A5 (https=)
JP2018046053A5 (https=)
JP2020004936A5 (https=)
JP2019165093A (ja) 半導体記憶装置およびその製造方法
JP2018157022A5 (https=)
JP2016527722A5 (https=)
WO2016139727A1 (ja) 半導体記憶装置及びその製造方法
JP5975543B2 (ja) 半導体装置および半導体装置の製造方法