JP2019531918A - 取引カードのためのオーバーモールド加工電子部品及びその製造方法 - Google Patents
取引カードのためのオーバーモールド加工電子部品及びその製造方法 Download PDFInfo
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- JP2019531918A JP2019531918A JP2019504037A JP2019504037A JP2019531918A JP 2019531918 A JP2019531918 A JP 2019531918A JP 2019504037 A JP2019504037 A JP 2019504037A JP 2019504037 A JP2019504037 A JP 2019504037A JP 2019531918 A JP2019531918 A JP 2019531918A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D19/00—Casting in, on, or around objects which form part of the product
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/006—Memory cards, chip cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
本出願は、2016年7月27日に提出された「取引カードのためのオーバーモールド加工電子部品及びその製造方法」と題する米国仮特許出願第62/367362号(その内容は、参照によりあらゆる目的のためにその全体が本明細書において援用される)に関連し、その優先権の利益を主張する。
Claims (14)
- 取引カードを製造するためのプロセスであって、
前記取引カードのカード本体に開口を形成するステップと、
前記開口の中へ電子部品を挿入するステップと、
前記電子部品の周りに成形材料を成形するステップと、
を含む、プロセス。 - 前記成形するステップが、前記開口の中へ前記電子部品を挿入し、その後前記開口に前記成形材料を充填することを含む、請求項1に記載のプロセス。
- 前記成形するステップが、型の中に前記電子部品を配置し、前記型の中へ前記成形材料を射出することを含む、請求項1に記載のプロセス。
- 前記挿入するステップが、前記成形するステップの後に行われる、請求項3に記載のプロセス。
- 更に、前記成形材料を前記カード本体に固定するために前記カード本体に1つ又は複数の固定特徴部を形成するステップを含む、請求項1に記載のプロセス。
- 前記固定特徴部が前記カード本体の中のポケットを含む、請求項5に記載のプロセス。
- 前記開口が前記カード本体を部分的又は全体的に通過して延びる、請求項1に記載のプロセス。
- 前記成形材料が、約150〜300℃の成形温度範囲を有するプラスチックである、請求項1に記載のプロセス。
- 前記重合体成形材料が、EVA、メタロセンポリアルファオレフィン、アタクチックポリアルファオレフィンを含むポリオレフィン、ブロック共重合体、ポリウレタンホットメルト、ポリアミド、ファイバグラス強化ポリエステル、ポリウレタン、ベークライト、ドゥロプラスト、メラミン、ジアリルフタレート及びポリイミドの1つ又はそれ以上である、請求項1に記載のプロセス。
- 金属性成形材料が、ロジウム、アルミニウム、チタン、マグネシウム、銅、真鍮、ニッケル、モネル、インコネル、スチール又はこれらの合金の1つ又はそれ以上である、請求項1に記載のプロセス。
- 前記成形するステップの後に、更に、成形された電子部品から余分な成形材料を取り除くステップを含む、請求項1に記載のプロセス。
- 前記開口が前記カード本体の中のポケットであり、前記成形するステップが、前記電子部品の少なくとも上面に成形材料を成形することを含む、請求項1に記載のプロセス。
- 成形電子部品を備える取引カード。
- 請求項1のプロセスに従って製造された取引カード。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662367362P | 2016-07-27 | 2016-07-27 | |
US62/367,362 | 2016-07-27 | ||
PCT/US2017/043954 WO2018022755A1 (en) | 2016-07-27 | 2017-07-26 | Overmolded electronic components for transaction cards and methods of making thereof |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021003355A Division JP7280899B2 (ja) | 2016-07-27 | 2021-01-13 | 取引カードのためのオーバーモールド加工電子部品及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019531918A true JP2019531918A (ja) | 2019-11-07 |
JP7247086B2 JP7247086B2 (ja) | 2023-03-28 |
Family
ID=61016710
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019504037A Active JP7247086B2 (ja) | 2016-07-27 | 2017-07-26 | 取引カードのためのオーバーモールド加工電子部品及びその製造方法 |
JP2021521110A Active JP7208376B2 (ja) | 2016-07-27 | 2019-10-17 | トランザクションカード用のオーバーモールド電子部品およびその製造方法 |
JP2021003355A Active JP7280899B2 (ja) | 2016-07-27 | 2021-01-13 | 取引カードのためのオーバーモールド加工電子部品及びその製造方法 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021521110A Active JP7208376B2 (ja) | 2016-07-27 | 2019-10-17 | トランザクションカード用のオーバーモールド電子部品およびその製造方法 |
JP2021003355A Active JP7280899B2 (ja) | 2016-07-27 | 2021-01-13 | 取引カードのためのオーバーモールド加工電子部品及びその製造方法 |
Country Status (16)
Country | Link |
---|---|
US (5) | US11267172B2 (ja) |
EP (2) | EP3491584B1 (ja) |
JP (3) | JP7247086B2 (ja) |
KR (2) | KR102286490B1 (ja) |
CN (2) | CN109564634A (ja) |
AU (1) | AU2019361988B2 (ja) |
BR (1) | BR112021007410A2 (ja) |
CA (1) | CA3116226C (ja) |
CO (1) | CO2021005273A2 (ja) |
DK (1) | DK3491584T3 (ja) |
ES (1) | ES2928212T3 (ja) |
MX (2) | MX2019001144A (ja) |
NZ (1) | NZ774730A (ja) |
PL (1) | PL3491584T3 (ja) |
SG (1) | SG11202103590TA (ja) |
WO (2) | WO2018022755A1 (ja) |
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US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
EP3491584B1 (en) | 2016-07-27 | 2022-07-13 | Composecure LLC | Overmolded electronic components for transaction cards and methods of making thereof |
US10892646B2 (en) | 2016-12-09 | 2021-01-12 | Nucurrent, Inc. | Method of fabricating an antenna having a substrate configured to facilitate through-metal energy transfer via near field magnetic coupling |
MX2021012822A (es) | 2017-09-07 | 2023-03-02 | Composecure Llc | Tarjeta de transaccion con componentes electronicos incorporados y procedimiento para su fabricacion. |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
CA3079539A1 (en) | 2017-10-18 | 2019-04-25 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
EP3895070A4 (en) * | 2018-12-11 | 2022-08-17 | Giesecke+Devrient Mobile Security GmbH | IDENTIFICATION CARD HAVING A GLASS SUBSTRATE, IDENTIFICATION CARD HAVING A CERAMIC SUBSTRATE AND METHODS OF MAKING THEM |
WO2020243148A1 (en) * | 2019-05-31 | 2020-12-03 | Composecure, Llc | Rfid device |
US20210081743A1 (en) | 2019-08-12 | 2021-03-18 | Federal Card Services, LLC | Dual interface metal cards and methods of manufacturing |
US20210049431A1 (en) | 2019-08-14 | 2021-02-18 | Federal Card Services, LLC | Metal-containing dual interface smartcards |
US11416728B2 (en) | 2019-08-15 | 2022-08-16 | Federal Card Services, LLC | Durable dual interface metal transaction cards |
US11113593B2 (en) | 2019-08-15 | 2021-09-07 | Federal Card Services; LLC | Contactless metal cards with fingerprint sensor and display |
US11455507B2 (en) | 2019-10-13 | 2022-09-27 | Federal Card Services, LLC | Metal transaction cards containing ceramic having selected coloring and texture |
TW202127337A (zh) | 2019-10-25 | 2021-07-16 | 美商坎柏斯庫爾有限責任公司 | 具生物特徵之金屬卡片 |
US11341385B2 (en) | 2019-11-16 | 2022-05-24 | Federal Card Services, LLC | RFID enabled metal transaction card with shaped opening and shaped slit |
US10810475B1 (en) | 2019-12-20 | 2020-10-20 | Capital One Services, Llc | Systems and methods for overmolding a card to prevent chip fraud |
BR112022014016A2 (pt) | 2020-01-24 | 2022-10-11 | Composecure Llc | Cartão de transação metálico, de cerâmica ou revestido com cerâmica com janela ou padrão de janela e retroiluminação opcional |
USD1032613S1 (en) * | 2020-02-02 | 2024-06-25 | Federal Card Services, LLC | Smart card |
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CA3180457A1 (en) | 2020-06-01 | 2021-12-09 | Composecure, Llc | Transaction cards with discontinuous metal strata |
EP4334103A1 (en) * | 2021-05-07 | 2024-03-13 | Microsoft Technology Licensing, LLC | Forming complex geometries using insert molding |
WO2023034642A1 (en) | 2021-09-06 | 2023-03-09 | Metaland Llc | Encapsulating a metal inlay with thermosetting resin and method for making a metal transaction card |
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