JP2019529599A5 - - Google Patents
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- Publication number
- JP2019529599A5 JP2019529599A5 JP2019504746A JP2019504746A JP2019529599A5 JP 2019529599 A5 JP2019529599 A5 JP 2019529599A5 JP 2019504746 A JP2019504746 A JP 2019504746A JP 2019504746 A JP2019504746 A JP 2019504746A JP 2019529599 A5 JP2019529599 A5 JP 2019529599A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- ink
- substrate
- straight chain
- branched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010949 copper Substances 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 7
- -1 copper(II) formic anhydride Chemical group 0.000 claims 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 5
- 229910052799 carbon Inorganic materials 0.000 claims 5
- 229910052802 copper Inorganic materials 0.000 claims 5
- 239000012691 Cu precursor Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 238000000151 deposition Methods 0.000 claims 3
- 229920005596 polymer binder Polymers 0.000 claims 3
- 239000002491 polymer binding agent Substances 0.000 claims 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 239000004205 dimethyl polysiloxane Substances 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 239000002105 nanoparticle Substances 0.000 claims 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims 2
- LTACQVCHVAUOKN-UHFFFAOYSA-N 3-(diethylamino)propane-1,2-diol Chemical compound CCN(CC)CC(O)CO LTACQVCHVAUOKN-UHFFFAOYSA-N 0.000 claims 1
- QCMHUGYTOGXZIW-UHFFFAOYSA-N 3-(dimethylamino)propane-1,2-diol Chemical compound CN(C)CC(O)CO QCMHUGYTOGXZIW-UHFFFAOYSA-N 0.000 claims 1
- KQIGMPWTAHJUMN-UHFFFAOYSA-N 3-aminopropane-1,2-diol Chemical compound NCC(O)CO KQIGMPWTAHJUMN-UHFFFAOYSA-N 0.000 claims 1
- WOMTYMDHLQTCHY-UHFFFAOYSA-N 3-methylamino-1,2-propanediol Chemical compound CNCC(O)CO WOMTYMDHLQTCHY-UHFFFAOYSA-N 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000004793 Polystyrene Substances 0.000 claims 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- IFYDWYVPVAMGRO-UHFFFAOYSA-N n-[3-(dimethylamino)propyl]tetradecanamide Chemical compound CCCCCCCCCCCCCC(=O)NCCCN(C)C IFYDWYVPVAMGRO-UHFFFAOYSA-N 0.000 claims 1
- 239000000123 paper Substances 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 229920000098 polyolefin Polymers 0.000 claims 1
- 229920002223 polystyrene Polymers 0.000 claims 1
- 229920006268 silicone film Polymers 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662367810P | 2016-07-28 | 2016-07-28 | |
| US62/367,810 | 2016-07-28 | ||
| PCT/CA2017/050870 WO2018018136A1 (en) | 2016-07-28 | 2017-07-19 | Copper ink and conductive solderable copper traces produced therefrom |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019529599A JP2019529599A (ja) | 2019-10-17 |
| JP2019529599A5 true JP2019529599A5 (enExample) | 2020-08-20 |
| JP6901549B2 JP6901549B2 (ja) | 2021-07-14 |
Family
ID=61015482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019504746A Active JP6901549B2 (ja) | 2016-07-28 | 2017-07-19 | 銅インク及びそれから製造された導電性のはんだ付け可能な銅トレース |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10844238B2 (enExample) |
| EP (1) | EP3491082B1 (enExample) |
| JP (1) | JP6901549B2 (enExample) |
| KR (1) | KR102360657B1 (enExample) |
| CN (1) | CN109790409B (enExample) |
| CA (1) | CA3032252C (enExample) |
| TW (1) | TWI752986B (enExample) |
| WO (1) | WO2018018136A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI823871B (zh) | 2017-10-27 | 2023-12-01 | 加拿大國家研究委員會 | 用於通過強脈衝光燒結金屬線路之塗有氮化硼奈米管之基板 |
| TWI825140B (zh) * | 2018-08-03 | 2023-12-11 | 加拿大國家研究委員會 | Uv-可燒結分子油墨和其使用廣譜uv光之加工 |
| TWI853828B (zh) | 2018-08-07 | 2024-09-01 | 加拿大國家研究委員會 | 包覆成型的印刷電子零件和其製造方法 |
| US20210254271A1 (en) * | 2018-10-11 | 2021-08-19 | Hewlett-Packard Development Company, L.P. | Generation of metals in textiles |
| JP7269565B2 (ja) * | 2019-03-29 | 2023-05-09 | 学校法人 関西大学 | 導電性インキ組成物及び導電性積層体 |
| KR102213925B1 (ko) * | 2019-10-31 | 2021-02-08 | (주)쎄미시스코 | 실리카 입자를 포함하는 광소결용 잉크 조성물 |
| CN111269615A (zh) * | 2020-03-20 | 2020-06-12 | 辽宁大学 | 一种抗氧化无颗粒型铜导电墨水及其制备方法 |
| CN114799613B (zh) * | 2021-01-28 | 2023-11-07 | 深圳先进电子材料国际创新研究院 | 一种铜焊膏及其制备方法和应用 |
| CN114231092A (zh) * | 2021-12-15 | 2022-03-25 | 深圳先进技术研究院 | 一种铜导电油墨、柔性基底及柔性基底的制备方法 |
| CN114540889B (zh) * | 2022-03-25 | 2023-03-24 | 江阴纳力新材料科技有限公司 | 镀铜添加剂、镀铜液及其应用 |
| CN115171945A (zh) * | 2022-05-31 | 2022-10-11 | 宁波柔印电子科技有限责任公司 | 一种可用于大面积制备的铜浆及制作方法 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2728465C2 (de) | 1977-06-24 | 1982-04-22 | Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt | Gedruckte Schaltung |
| US4396666A (en) | 1981-11-02 | 1983-08-02 | Cts Corporation | Solderable conductive employing an organic binder |
| US4687597A (en) | 1986-01-29 | 1987-08-18 | E. I. Du Pont De Nemours And Company | Copper conductor compositions |
| JPH01168867A (ja) * | 1987-12-24 | 1989-07-04 | Mitsubishi Gas Chem Co Inc | 銅膜形成物品の製造法 |
| JP2619289B2 (ja) | 1989-06-20 | 1997-06-11 | 三井金属鉱業株式会社 | 銅導電性組成物 |
| JP2660937B2 (ja) | 1990-07-16 | 1997-10-08 | 三井金属鉱業株式会社 | 銅導電性組成物 |
| US5882722A (en) | 1995-07-12 | 1999-03-16 | Partnerships Limited, Inc. | Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds |
| US20030148024A1 (en) | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
| US7211205B2 (en) | 2003-01-29 | 2007-05-01 | Parelec, Inc. | High conductivity inks with improved adhesion |
| US7731812B2 (en) | 2004-10-19 | 2010-06-08 | E.I. Du Pont De Nemours And Company | Thick film conductor case compositions for LTCC tape |
| US8017044B2 (en) | 2008-07-08 | 2011-09-13 | Xerox Corporation | Bimodal metal nanoparticle ink and applications therefor |
| KR101276237B1 (ko) | 2010-12-02 | 2013-06-20 | 한국기계연구원 | 저온소결 전도성 금속막 및 이의 제조방법 |
| TWI532059B (zh) * | 2011-03-31 | 2016-05-01 | Taiyo Holdings Co Ltd | Conductive paste, conductive pattern formation method and conductive pattern |
| KR20120132424A (ko) | 2011-05-27 | 2012-12-05 | 한양대학교 산학협력단 | 전도성 구리 나노잉크의 광소결 방법 |
| JP5821551B2 (ja) * | 2011-11-10 | 2015-11-24 | 日立化成株式会社 | 導電粒子、異方導電材料及び導電接続構造体 |
| US10590295B2 (en) | 2012-02-29 | 2020-03-17 | Singapore Asahi Chemical & Solder Ind. Pte. Ltd | Inks containing metal precursors nanoparticles |
| CN103382327B (zh) * | 2012-05-02 | 2015-11-25 | 比亚迪股份有限公司 | 一种太阳能电池用铜墨及其制备方法、一种太阳能电池主栅的制造方法及太阳能电池组件 |
| KR20140044743A (ko) | 2012-10-04 | 2014-04-15 | 한양대학교 산학협력단 | 전도성 하이브리드 구리잉크 및 이를 이용한 광소결 방법 |
| KR101350507B1 (ko) | 2013-01-09 | 2014-01-17 | (주)쎄미시스코 | 금속 나노입자를 포함하는 전기전도성 잉크 및 이의 광 소결 방법 |
| JP2014182913A (ja) * | 2013-03-19 | 2014-09-29 | Fujifilm Corp | 導電膜形成用組成物およびこれを用いる導電膜の製造方法 |
| JP2014196427A (ja) | 2013-03-29 | 2014-10-16 | 富士フイルム株式会社 | 導電膜形成用組成物およびこれを用いる導電膜の製造方法 |
| KR20150045605A (ko) | 2013-10-21 | 2015-04-29 | 전자부품연구원 | 구리 잉크 조성물 및 이를 이용한 도전 패턴 형성 방법 |
| KR101597651B1 (ko) | 2013-12-30 | 2016-02-25 | 전자부품연구원 | 고내열성을 갖는 나노산화구리 잉크 조성물 및 이를 이용한 전극 형성방법 |
| EP2918371A1 (en) | 2014-03-11 | 2015-09-16 | Heraeus Precious Metals North America Conshohocken LLC | Solderable conductive polymer thick film composition |
| KR20150134728A (ko) * | 2014-05-22 | 2015-12-02 | 주식회사 동진쎄미켐 | 전도성 조성물 |
| JP6135687B2 (ja) * | 2014-07-15 | 2017-05-31 | 東洋インキＳｃホールディングス株式会社 | レーザー加工用導電性ペースト |
-
2017
- 2017-07-19 CN CN201780059065.5A patent/CN109790409B/zh active Active
- 2017-07-19 JP JP2019504746A patent/JP6901549B2/ja active Active
- 2017-07-19 WO PCT/CA2017/050870 patent/WO2018018136A1/en not_active Ceased
- 2017-07-19 EP EP17833137.7A patent/EP3491082B1/en active Active
- 2017-07-19 CA CA3032252A patent/CA3032252C/en active Active
- 2017-07-19 KR KR1020197005617A patent/KR102360657B1/ko active Active
- 2017-07-19 US US16/321,076 patent/US10844238B2/en active Active
- 2017-07-26 TW TW106125020A patent/TWI752986B/zh active
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