JP2019525180A5 - - Google Patents
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- Publication number
- JP2019525180A5 JP2019525180A5 JP2019506157A JP2019506157A JP2019525180A5 JP 2019525180 A5 JP2019525180 A5 JP 2019525180A5 JP 2019506157 A JP2019506157 A JP 2019506157A JP 2019506157 A JP2019506157 A JP 2019506157A JP 2019525180 A5 JP2019525180 A5 JP 2019525180A5
- Authority
- JP
- Japan
- Prior art keywords
- measurement spot
- scattered light
- leading
- illumination
- lpm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005259 measurement Methods 0.000 claims 54
- 238000005286 illumination Methods 0.000 claims 33
- 238000007689 inspection Methods 0.000 claims 27
- 230000003287 optical effect Effects 0.000 claims 11
- 238000003384 imaging method Methods 0.000 claims 10
- 238000000034 method Methods 0.000 claims 7
- 230000010365 information processing Effects 0.000 claims 4
- 238000000926 separation method Methods 0.000 claims 3
- 230000000903 blocking effect Effects 0.000 claims 1
- 210000001747 pupil Anatomy 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/230,330 | 2016-08-05 | ||
| US15/230,330 US10324045B2 (en) | 2016-08-05 | 2016-08-05 | Surface defect inspection with large particle monitoring and laser power control |
| PCT/US2017/045261 WO2018027010A1 (en) | 2016-08-05 | 2017-08-03 | Surface defect inspection with large particle monitoring and laser power control |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019525180A JP2019525180A (ja) | 2019-09-05 |
| JP2019525180A5 true JP2019525180A5 (enExample) | 2020-09-10 |
| JP6840224B2 JP6840224B2 (ja) | 2021-03-10 |
Family
ID=61069145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019506157A Active JP6840224B2 (ja) | 2016-08-05 | 2017-08-03 | 大粒子監視及びレーザパワー制御を伴う表面欠陥検査 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10324045B2 (enExample) |
| JP (1) | JP6840224B2 (enExample) |
| KR (1) | KR102228505B1 (enExample) |
| CN (1) | CN109564884B (enExample) |
| IL (1) | IL264450B (enExample) |
| SG (1) | SG11201900803YA (enExample) |
| TW (1) | TWI733873B (enExample) |
| WO (1) | WO2018027010A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10438339B1 (en) * | 2016-09-12 | 2019-10-08 | Apple Inc. | Optical verification system and methods of verifying micro device transfer |
| US11143600B2 (en) | 2018-02-16 | 2021-10-12 | Hitachi High-Tech Corporation | Defect inspection device |
| EP3942279A4 (en) | 2019-03-21 | 2022-12-28 | Becton, Dickinson and Company | LIGHT DETECTION SYSTEMS AND METHODS OF USE THEREOF |
| US11374375B2 (en) | 2019-08-14 | 2022-06-28 | Kla Corporation | Laser closed power loop with an acousto-optic modulator for power modulation |
| CN112540082A (zh) * | 2019-09-20 | 2021-03-23 | 深圳中科飞测科技股份有限公司 | 检测系统及检测方法 |
| US11094501B2 (en) * | 2019-11-19 | 2021-08-17 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Secondary charged particle imaging system |
| WO2021250771A1 (ja) | 2020-06-09 | 2021-12-16 | 株式会社日立ハイテク | 欠陥検査装置 |
| EP3923078A1 (en) | 2020-06-10 | 2021-12-15 | ASML Netherlands B.V. | Heigth measurement method and height measurement system |
| US12345658B2 (en) * | 2020-09-24 | 2025-07-01 | Kla Corporation | Large-particle monitoring with laser power control for defect inspection |
| CN115248531A (zh) * | 2021-04-26 | 2022-10-28 | 上海微电子装备(集团)股份有限公司 | 颗粒度检测装置及其检测方法、光刻机 |
| TWI814412B (zh) * | 2022-05-31 | 2023-09-01 | 合盈光電科技股份有限公司 | 多方向物件失效檢查系統及其方法 |
| CN118483249B (zh) * | 2024-05-07 | 2024-12-20 | 无锡卓海科技股份有限公司 | 一种晶圆检测装置及检测方法 |
Family Cites Families (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6271916B1 (en) | 1994-03-24 | 2001-08-07 | Kla-Tencor Corporation | Process and assembly for non-destructive surface inspections |
| US5864394A (en) | 1994-06-20 | 1999-01-26 | Kla-Tencor Corporation | Surface inspection system |
| US6608676B1 (en) | 1997-08-01 | 2003-08-19 | Kla-Tencor Corporation | System for detecting anomalies and/or features of a surface |
| US6201601B1 (en) | 1997-09-19 | 2001-03-13 | Kla-Tencor Corporation | Sample inspection system |
| US5898492A (en) * | 1997-09-25 | 1999-04-27 | International Business Machines Corporation | Surface inspection tool using reflected and scattered light |
| JP4089798B2 (ja) | 1998-04-13 | 2008-05-28 | 株式会社トプコン | 表面検査装置 |
| US6208411B1 (en) | 1998-09-28 | 2001-03-27 | Kla-Tencor Corporation | Massively parallel inspection and imaging system |
| TW444247B (en) | 1999-01-29 | 2001-07-01 | Toshiba Corp | Laser beam irradiating device, manufacture of non-single crystal semiconductor film, and manufacture of liquid crystal display device |
| JP3652912B2 (ja) | 1999-03-08 | 2005-05-25 | 日本電子株式会社 | 欠陥検査装置 |
| US6529270B1 (en) | 1999-03-31 | 2003-03-04 | Ade Optical Systems Corporation | Apparatus and method for detecting defects in the surface of a workpiece |
| US6466315B1 (en) | 1999-09-03 | 2002-10-15 | Applied Materials, Inc. | Method and system for reticle inspection by photolithography simulation |
| JP2002033256A (ja) * | 2000-07-14 | 2002-01-31 | Nikon Corp | 位置計測装置及び露光装置 |
| JP2003017536A (ja) | 2001-07-04 | 2003-01-17 | Nec Corp | パターン検査方法及び検査装置 |
| US7046353B2 (en) | 2001-12-04 | 2006-05-16 | Kabushiki Kaisha Topcon | Surface inspection system |
| US7130039B2 (en) | 2002-04-18 | 2006-10-31 | Kla-Tencor Technologies Corporation | Simultaneous multi-spot inspection and imaging |
| US7286697B2 (en) | 2002-10-18 | 2007-10-23 | Applied Materials, Israel, Ltd. | System for imaging an extended area |
| JP4641143B2 (ja) | 2003-06-30 | 2011-03-02 | 株式会社トプコン | 表面検査装置 |
| JP4567984B2 (ja) | 2004-01-30 | 2010-10-27 | 株式会社 日立ディスプレイズ | 平面表示装置の製造装置 |
| US7295303B1 (en) | 2004-03-25 | 2007-11-13 | Kla-Tencor Technologies Corporation | Methods and apparatus for inspecting a sample |
| JP5033314B2 (ja) | 2004-09-29 | 2012-09-26 | 株式会社日立ハイテクノロジーズ | イオンビーム加工装置及び加工方法 |
| JP4694179B2 (ja) | 2004-11-18 | 2011-06-08 | 株式会社トプコン | 表面検査装置 |
| JP2006162500A (ja) | 2004-12-09 | 2006-06-22 | Hitachi High-Technologies Corp | 欠陥検査装置 |
| KR20070104451A (ko) | 2005-02-03 | 2007-10-25 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 다중빔 광학주사장치의 스폿 사이즈 초점 오차 검출 |
| US7548308B2 (en) | 2005-05-11 | 2009-06-16 | Kla-Tencor Corporation | Illumination energy management in surface inspection |
| JP5302678B2 (ja) * | 2005-07-14 | 2013-10-02 | ケーエルエー−テンカー コーポレイション | 検出器と回路の飽和を避けることにより検査システムの熱破損を削減して、検出範囲を拡張するためのシステム、回路、方法 |
| US7436508B2 (en) | 2005-07-14 | 2008-10-14 | Kla-Tencor Technologies Corp. | Systems, circuits and methods for reducing thermal damage and extending the detection range of an inspection system |
| JP2007279026A (ja) | 2006-04-03 | 2007-10-25 | Samsung Electronics Co Ltd | 基板検査装置とこれを用いた基板検査方法 |
| DE112006003970T5 (de) | 2006-07-28 | 2009-07-30 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Vorrichtung und Verfahren zum Prozessieren eines Wafers |
| US7787114B2 (en) | 2007-06-06 | 2010-08-31 | Kla-Tencor Technologies Corp. | Systems and methods for inspecting a specimen with light at varying power levels |
| US8194240B1 (en) | 2008-03-04 | 2012-06-05 | Kla-Tencor Corporation | Enhanced focusing capability on a sample using a spot matrix |
| US8194301B2 (en) | 2008-03-04 | 2012-06-05 | Kla-Tencor Corporation | Multi-spot scanning system and method |
| US7912658B2 (en) | 2008-05-28 | 2011-03-22 | Kla-Tencor Corp. | Systems and methods for determining two or more characteristics of a wafer |
| JP4618360B2 (ja) | 2008-10-10 | 2011-01-26 | ソニー株式会社 | レーザアニール方法およびレーザアニール装置 |
| DE102009000528B4 (de) | 2009-01-30 | 2011-04-07 | Nanophotonics Ag | Inspektionsvorrichtung und -verfahren für die optische Untersuchung von Objektoberflächen, insbesondere von Waferoberflächen |
| JP2010236966A (ja) | 2009-03-31 | 2010-10-21 | Hitachi High-Technologies Corp | 欠陥検査装置およびその方法 |
| JP5283037B2 (ja) | 2009-04-25 | 2013-09-04 | 独立行政法人産業技術総合研究所 | 高均一照度が得られる照明装置及び照明方法 |
| JP2011009554A (ja) | 2009-06-26 | 2011-01-13 | Fujitsu Semiconductor Ltd | 欠陥検査方法及び欠陥検査装置 |
| JP5544176B2 (ja) | 2010-01-07 | 2014-07-09 | 株式会社日立ハイテクノロジーズ | 検査装置および検査方法 |
| JP5538072B2 (ja) * | 2010-06-03 | 2014-07-02 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法およびその装置 |
| US8885158B2 (en) | 2011-03-10 | 2014-11-11 | Kla-Tencor Corporation | Surface scanning inspection system with adjustable scan pitch |
| US9279774B2 (en) * | 2011-07-12 | 2016-03-08 | Kla-Tencor Corp. | Wafer inspection |
| US8873596B2 (en) * | 2011-07-22 | 2014-10-28 | Kla-Tencor Corporation | Laser with high quality, stable output beam, and long life high conversion efficiency non-linear crystal |
| US8755044B2 (en) * | 2011-08-15 | 2014-06-17 | Kla-Tencor Corporation | Large particle detection for multi-spot surface scanning inspection systems |
| US8569700B2 (en) | 2012-03-06 | 2013-10-29 | Omnivision Technologies, Inc. | Image sensor for two-dimensional and three-dimensional image capture |
| US9255891B2 (en) | 2012-11-20 | 2016-02-09 | Kla-Tencor Corporation | Inspection beam shaping for improved detection sensitivity |
| US9696264B2 (en) * | 2013-04-03 | 2017-07-04 | Kla-Tencor Corporation | Apparatus and methods for determining defect depths in vertical stack memory |
| US9645097B2 (en) * | 2014-06-20 | 2017-05-09 | Kla-Tencor Corporation | In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning |
| WO2016121756A1 (ja) * | 2015-01-30 | 2016-08-04 | 株式会社日立ハイテクノロジーズ | 検査装置 |
| US9696568B2 (en) * | 2015-05-13 | 2017-07-04 | Lasertec Corporation | Light source apparatus and inspection apparatus |
-
2016
- 2016-08-05 US US15/230,330 patent/US10324045B2/en active Active
-
2017
- 2017-08-03 WO PCT/US2017/045261 patent/WO2018027010A1/en not_active Ceased
- 2017-08-03 CN CN201780049354.7A patent/CN109564884B/zh active Active
- 2017-08-03 SG SG11201900803YA patent/SG11201900803YA/en unknown
- 2017-08-03 KR KR1020197006370A patent/KR102228505B1/ko active Active
- 2017-08-03 JP JP2019506157A patent/JP6840224B2/ja active Active
- 2017-08-04 TW TW106126378A patent/TWI733873B/zh active
-
2019
- 2019-01-24 IL IL264450A patent/IL264450B/en unknown
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