TWI733873B - 用於表面檢測之系統、方法及設備 - Google Patents

用於表面檢測之系統、方法及設備 Download PDF

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Publication number
TWI733873B
TWI733873B TW106126378A TW106126378A TWI733873B TW I733873 B TWI733873 B TW I733873B TW 106126378 A TW106126378 A TW 106126378A TW 106126378 A TW106126378 A TW 106126378A TW I733873 B TWI733873 B TW I733873B
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Taiwan
Prior art keywords
measurement point
leading
light
lpm
illumination
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TW106126378A
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English (en)
Chinese (zh)
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TW201807765A (zh
Inventor
史帝夫 （宜豐） 崔
春聖 黃
春翰 王
克里斯堤安 渥特斯
布萊特 懷特席德
阿那托利 Ｇ 羅曼諾夫斯基
傳勇 黃
唐諾 渥倫 派提波
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美商克萊譚克公司
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Publication of TW201807765A publication Critical patent/TW201807765A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW106126378A 2016-08-05 2017-08-04 用於表面檢測之系統、方法及設備 TWI733873B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/230,330 2016-08-05
US15/230,330 US10324045B2 (en) 2016-08-05 2016-08-05 Surface defect inspection with large particle monitoring and laser power control

Publications (2)

Publication Number Publication Date
TW201807765A TW201807765A (zh) 2018-03-01
TWI733873B true TWI733873B (zh) 2021-07-21

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Family Applications (1)

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TW106126378A TWI733873B (zh) 2016-08-05 2017-08-04 用於表面檢測之系統、方法及設備

Country Status (8)

Country Link
US (1) US10324045B2 (enExample)
JP (1) JP6840224B2 (enExample)
KR (1) KR102228505B1 (enExample)
CN (1) CN109564884B (enExample)
IL (1) IL264450B (enExample)
SG (1) SG11201900803YA (enExample)
TW (1) TWI733873B (enExample)
WO (1) WO2018027010A1 (enExample)

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EP3942279A4 (en) 2019-03-21 2022-12-28 Becton, Dickinson and Company LIGHT DETECTION SYSTEMS AND METHODS OF USE THEREOF
US11374375B2 (en) 2019-08-14 2022-06-28 Kla Corporation Laser closed power loop with an acousto-optic modulator for power modulation
CN112540082A (zh) * 2019-09-20 2021-03-23 深圳中科飞测科技股份有限公司 检测系统及检测方法
US11094501B2 (en) * 2019-11-19 2021-08-17 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Secondary charged particle imaging system
WO2021250771A1 (ja) 2020-06-09 2021-12-16 株式会社日立ハイテク 欠陥検査装置
EP3923078A1 (en) 2020-06-10 2021-12-15 ASML Netherlands B.V. Heigth measurement method and height measurement system
US12345658B2 (en) * 2020-09-24 2025-07-01 Kla Corporation Large-particle monitoring with laser power control for defect inspection
CN115248531A (zh) * 2021-04-26 2022-10-28 上海微电子装备（集团）股份有限公司 颗粒度检测装置及其检测方法、光刻机
CN118483249B (zh) * 2024-05-07 2024-12-20 无锡卓海科技股份有限公司 一种晶圆检测装置及检测方法

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Also Published As

Publication number Publication date
KR102228505B1 (ko) 2021-03-15
SG11201900803YA (en) 2019-02-27
JP2019525180A (ja) 2019-09-05
WO2018027010A1 (en) 2018-02-08
KR20190027390A (ko) 2019-03-14
US20180038803A1 (en) 2018-02-08
CN109564884B (zh) 2020-08-18
TW201807765A (zh) 2018-03-01
JP6840224B2 (ja) 2021-03-10
IL264450B (en) 2021-09-30
IL264450A (en) 2019-02-28
US10324045B2 (en) 2019-06-18
CN109564884A (zh) 2019-04-02

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