JP2019522358A - GaN基板用途のためのプニクタイド緩衝材構造およびデバイス - Google Patents
GaN基板用途のためのプニクタイド緩衝材構造およびデバイス Download PDFInfo
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- JP2019522358A JP2019522358A JP2018563061A JP2018563061A JP2019522358A JP 2019522358 A JP2019522358 A JP 2019522358A JP 2018563061 A JP2018563061 A JP 2018563061A JP 2018563061 A JP2018563061 A JP 2018563061A JP 2019522358 A JP2019522358 A JP 2019522358A
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- layer
- rare earth
- lattice constant
- earth pnictide
- pnictide
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- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims description 4
- 239000000872 buffer Substances 0.000 title description 30
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 204
- 150000002910 rare earth metals Chemical class 0.000 claims abstract description 178
- 239000004065 semiconductor Substances 0.000 claims abstract description 80
- 239000000463 material Substances 0.000 claims description 104
- 229910045601 alloy Inorganic materials 0.000 claims description 48
- 239000000956 alloy Substances 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 42
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 29
- 229910052757 nitrogen Inorganic materials 0.000 claims description 16
- 229910052785 arsenic Inorganic materials 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- 229910002601 GaN Inorganic materials 0.000 description 68
- 238000010586 diagram Methods 0.000 description 37
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 34
- 239000013078 crystal Substances 0.000 description 30
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 28
- 238000000034 method Methods 0.000 description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 229910052710 silicon Inorganic materials 0.000 description 16
- 239000010703 silicon Substances 0.000 description 16
- 239000000203 mixture Substances 0.000 description 10
- 150000004767 nitrides Chemical class 0.000 description 10
- 229910002058 ternary alloy Inorganic materials 0.000 description 9
- 230000007704 transition Effects 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000012212 insulator Substances 0.000 description 8
- 229910021478 group 5 element Inorganic materials 0.000 description 7
- 230000007547 defect Effects 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 239000002243 precursor Substances 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 238000000407 epitaxy Methods 0.000 description 5
- 238000001451 molecular beam epitaxy Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229910002059 quaternary alloy Inorganic materials 0.000 description 5
- 238000013459 approach Methods 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052691 Erbium Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910052706 scandium Inorganic materials 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 229910052692 Dysprosium Inorganic materials 0.000 description 2
- 229910052693 Europium Inorganic materials 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 229910052689 Holmium Inorganic materials 0.000 description 2
- 229910052765 Lutetium Inorganic materials 0.000 description 2
- 229910052779 Neodymium Inorganic materials 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 229910052777 Praseodymium Inorganic materials 0.000 description 2
- 229910052773 Promethium Inorganic materials 0.000 description 2
- 229910052772 Samarium Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910052771 Terbium Inorganic materials 0.000 description 2
- 229910052775 Thulium Inorganic materials 0.000 description 2
- 229910052769 Ytterbium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 2
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 2
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 2
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052747 lanthanoid Inorganic materials 0.000 description 2
- 150000002602 lanthanoids Chemical class 0.000 description 2
- OHSVLFRHMCKCQY-UHFFFAOYSA-N lutetium atom Chemical compound [Lu] OHSVLFRHMCKCQY-UHFFFAOYSA-N 0.000 description 2
- 229910052752 metalloid Inorganic materials 0.000 description 2
- 150000002738 metalloids Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 2
- VQMWBBYLQSCNPO-UHFFFAOYSA-N promethium atom Chemical compound [Pm] VQMWBBYLQSCNPO-UHFFFAOYSA-N 0.000 description 2
- 238000004549 pulsed laser deposition Methods 0.000 description 2
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 2
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 2
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 2
- FRNOGLGSGLTDKL-UHFFFAOYSA-N thulium atom Chemical compound [Tm] FRNOGLGSGLTDKL-UHFFFAOYSA-N 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 2
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 2
- 238000000927 vapour-phase epitaxy Methods 0.000 description 2
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- -1 (Ho) Chemical class 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- 229910001199 N alloy Inorganic materials 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 229910001245 Sb alloy Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 229910000756 V alloy Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- 230000005307 ferromagnetism Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052696 pnictogen Inorganic materials 0.000 description 1
- 150000003063 pnictogens Chemical class 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- QTQRGDBFHFYIBH-UHFFFAOYSA-N tert-butylarsenic Chemical compound CC(C)(C)[As] QTQRGDBFHFYIBH-UHFFFAOYSA-N 0.000 description 1
- ZGNPLWZYVAFUNZ-UHFFFAOYSA-N tert-butylphosphane Chemical compound CC(C)(C)P ZGNPLWZYVAFUNZ-UHFFFAOYSA-N 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
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- H01L21/02367—Substrates
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- H01L21/02387—Group 13/15 materials
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
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- H01L21/02496—Layer structure
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- H01L21/02518—Deposited layers
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- H01L21/02538—Group 13/15 materials
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- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
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Abstract
Description
本願は、2016年6月2日に出願された米国仮出願第62/344,439号、2016年9月9日に出願された米国仮出願第62/385,744号に対する優先権を主張するものであり、これらの各々は、全体的に参照により本明細書中に援用される。
Claims (15)
- 構造であって、
第1の格子定数を伴うIII−N層と、
前記III−N層にわたってエピタキシャルに成長させられた第2の格子定数を伴う第1の希土類プニクタイド層であって、前記第1の格子定数と前記第2の格子定数との間の第1の差異は、1パーセント未満である、層と、
前記第1の希土類プニクタイド層にわたってエピタキシャルに成長させられた第3の格子定数を伴う第2の希土類プニクタイド層と、
前記第2の希土類プニクタイド層にわたってエピタキシャルに成長させられた第4の格子定数を伴う半導体層であって、前記第3の格子定数と前記第4の格子定数との間の第2の差異は、1パーセント未満である、層と
を含む、構造。 - 前記第1の希土類プニクタイド層は、Scと希土類元素とを含む合金を含み、前記合金は、ScxRE1−xNによって表され、式中、xは、ゼロよりも大きく1以下である、請求項1に記載の構造。
- 前記III−N層は、GaN基板、Si基板、SiC基板、およびサファイア基板のうちの1つにわたってエピタキシャルに成長させられたデバイスの部分である、請求項1−2に記載の構造。
- 前記III−N層は、GaN材料を含む、請求項1−3に記載の構造。
- 前記III−N層は、Al、Ga、およびInのうちの1つ以上のものを含む、請求項1−4に記載の構造。
- 前記第2の希土類プニクタイド層は、少なくとも2つの希土類プニクタイド層を含み、前記希土類プニクタイド層のそれぞれは、異なる固定格子定数を有する、請求項1−5に記載の構造。
- 前記第1の希土類プニクタイド層と前記第2の希土類プニクタイド層との間に第3の希土類プニクタイド層をさらに備え、
前記第3の希土類プニクタイド層は、前記第3の希土類プニクタイド層の厚さを横断して変動する第5の格子定数を有し、
前記第3の希土類プニクタイド層は、前記第1の希土類プニクタイド層に隣接する第1の表面と、前記第2の希土類プニクタイド層に隣接する第2の表面とを有し、
前記第5の格子定数は、勾配が付けられ、前記第1の格子定数を前記第1の表面に整合させ、前記第2の格子定数を前記第2の表面に整合させる、
請求項1−6に記載の構造。 - 前記III−N層は、GaNを含み、
前記第1の希土類プニクタイド層は、ScNを含み、
前記第2の希土類プニクタイド層は、Scと、希土類元素と、Nとを含む第1の合金を含み、
前記第3の希土類プニクタイド層は、前記希土類元素と、Nと、Asとを含む第2の合金を含み、
前記半導体層は、GaAsを含む、
請求項7に記載の構造。 - 前記III−N層は、GaNを含み、
前記第1の希土類プニクタイド層は、ScNを含み、
前記第2の希土類プニクタイド層は、Scと、希土類元素と、Nとを含む第1の合金を含み、
前記第3の希土類プニクタイド層は、前記希土類元素と、Nと、Pとを含む第2の合金を含み、
前記半導体層は、Siを含む、
請求項7に記載の構造。 - 前記III−N層は、GaNを含み、
前記第1の希土類プニクタイド層は、ScNを含み、
前記第2の希土類プニクタイド層は、Scと、希土類元素と、Nとを含む第1の合金を含み、
前記第3の希土類プニクタイド層は、前記希土類元素と、Nと、Asとを含む第2の合金を含み、
前記半導体層は、InPを含む、
請求項7に記載の構造。 - 前記第3の希土類プニクタイド層内に絶縁層をさらに備える、請求項7−10に記載の構造。
- 前記第3の希土類プニクタイド層に接続される第1の電気的接点と、前記第2の希土類プニクタイド層に接続される第2の電気的接点とをさらに備える、請求項7−11に記載の構造。
- 前記III−N層は、トランジスタの部分である、請求項1−12に記載の構造。
- 前記III−N層は、ダイオードの部分である、請求項1−13に記載の構造。
- 前記III−N層は、無線周波数フィルタの部分である、請求項1−14に記載の構造。
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Also Published As
Publication number | Publication date |
---|---|
WO2017210597A1 (en) | 2017-12-07 |
CN109478504B (zh) | 2023-08-29 |
US20180012858A1 (en) | 2018-01-11 |
CN109478504A (zh) | 2019-03-15 |
TWI753915B (zh) | 2022-02-01 |
US10332857B2 (en) | 2019-06-25 |
EP3465744A1 (en) | 2019-04-10 |
JP2019522359A (ja) | 2019-08-08 |
US20190139761A1 (en) | 2019-05-09 |
WO2017210622A1 (en) | 2017-12-07 |
JP6937784B2 (ja) | 2021-09-22 |
EP3488462A1 (en) | 2019-05-29 |
US10615141B2 (en) | 2020-04-07 |
CN109478503A (zh) | 2019-03-15 |
TW201816947A (zh) | 2018-05-01 |
EP3465743A1 (en) | 2019-04-10 |
JP6937783B2 (ja) | 2021-09-22 |
TW201810542A (zh) | 2018-03-16 |
TW201813010A (zh) | 2018-04-01 |
US20170353002A1 (en) | 2017-12-07 |
WO2017210629A1 (en) | 2017-12-07 |
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