JP2019518321A - センサ及びその製造方法、電子機器 - Google Patents
センサ及びその製造方法、電子機器 Download PDFInfo
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- JP2019518321A JP2019518321A JP2017533486A JP2017533486A JP2019518321A JP 2019518321 A JP2019518321 A JP 2019518321A JP 2017533486 A JP2017533486 A JP 2017533486A JP 2017533486 A JP2017533486 A JP 2017533486A JP 2019518321 A JP2019518321 A JP 2019518321A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000010409 thin film Substances 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims description 41
- 239000002184 metal Substances 0.000 claims description 41
- 230000004888 barrier function Effects 0.000 claims description 33
- 238000002161 passivation Methods 0.000 claims description 27
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical group [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 4
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical group 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 253
- 239000010949 copper Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 125000006850 spacer group Chemical group 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 229910052750 molybdenum Inorganic materials 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000011733 molybdenum Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 230000003064 anti-oxidating effect Effects 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 239000002238 carbon nanotube film Substances 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910021389 graphene Inorganic materials 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- UBSJOWMHLJZVDJ-UHFFFAOYSA-N aluminum neodymium Chemical compound [Al].[Nd] UBSJOWMHLJZVDJ-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
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Abstract
Description
ステップS011では、図4Aに示されるように、ベース基板上にゲート電極1021を形成する。
ステップS012では、図4Bに示されるように、ゲート電極1021上にゲート絶縁層1022を形成する。
ステップS013では、図4Cに示されるように、ゲート絶縁層1022上に活性層1023を形成する。
ステップS014では、図4Dに示されるように、活性層1023上にソース電極1025とドレイン電極1024を形成する。
Claims (20)
- センサであって、
ベース基板と、
前記ベース基板上に設けられソース電極を含む薄膜トランジスタと、
前記薄膜トランジスタ上に設けられ第1ビアホールが設けられた第1絶縁層であって、前記第1ビアホールによって貫通された第1絶縁層と、
前記第1ビアホール内と前記第1絶縁層の一部の上に設けられ、前記第1ビアホールを介して前記ソース電極に電気的に接続された導電層と、
前記第1絶縁層上に設けられ、かつ前記導電層と離間したバイアス電極と、
前記導電層と前記バイアス電極にそれぞれ接続されたセンサ活性層と、
前記導電層上に設けられた補助導電層と、を備えるセンサ。 - 前記補助導電層が前記センサ活性層と離間する請求項1に記載のセンサ。
- 前記補助導電層が金属酸化物導電層である請求項1または2に記載のセンサ。
- 前記補助導電層が酸化インジウムスズ(ITO)層または酸化インジウム亜鉛(IZO)層である請求項1〜3のいずれか1項に記載のセンサ。
- 前記補助導電層が前記導電層と直接接触する請求項1〜4のいずれか1項に記載のセンサ。
- 前記センサ活性層上に第2絶縁層が設けられている請求項1〜5のいずれか1項に記載のセンサ。
- 前記導電層が金属導電層である請求項1〜6のいずれか1項に記載のセンサ。
- 前記導電層の厚さが10〜100nmである請求項1〜7のいずれか1項に記載のセンサ。
- 第2ビアホールが設けられたパッシベーション層をさらに備え、前記ベース基板に垂直な方向において、前記パッシベーション層が前記ソース電極と前記第1絶縁層の間に設けられ、
前記第2ビアホールが前記パッシベーション層を貫通して前記第1ビアホールに連通し、前記導電層が前記第1ビアホールと前記第2ビアホールを介して前記ソース電極に電気的に接続される請求項1〜8のいずれか1項に記載のセンサ。 - 前記第2ビアホールの最大孔径が前記第1ビアホールの最小孔径より小さい請求項9に記載のセンサ。
- 第3ビアホールが設けられたバリアメタル層をさらに備え、
前記バリアメタル層が前記パッシベーション層と前記第1絶縁層の間に設けられ、
前記第3ビアホールが前記バリアメタル層を貫通して前記第1ビアホールと前記第2ビアホールに連通し、
前記導電層が前記第1ビアホール、前記第2ビアホール及び前記第3ビアホールを介して前記ソース電極に電気的に接続される請求項9または10に記載のセンサ。 - 前記バリアメタル層の前記ベース基板への投影と、前記薄膜トランジスタの活性層の前記ベース基板への投影とが、少なくとも部分的に重なっている請求項11に記載のセンサ。
- 前記第3ビアホールの最大孔径が前記第1ビアホールの最小孔径より小さく、前記第3ビアホールの最小孔径が前記第2ビアホールの最大孔径より大きい請求項11または12に記載のセンサ。
- 前記導電層が少なくとも前記第1ビアホール、前記第2ビアホール及び前記第3ビアホールの側壁に設けられ、前記導電層の少なくとも前記側壁に位置する部分が前記補助導電層により完全に覆われる請求項11〜13のいずれか1項に記載のセンサ。
- 前記第1絶縁層の厚さが1〜4μmである請求項1〜14のいずれか1項に記載のセンサ。
- 請求項1〜15のいずれか1項に記載のセンサを含む電子機器。
- センサの製造方法であって、
ベース基板上に、ソース電極を含む薄膜トランジスタを形成するステップと、
前記薄膜トランジスタ上に、第1ビアホールが設けられた第1絶縁層を形成するステップと、
前記第1ビアホール内と前記第1絶縁層の一部の上に、前記第1ビアホールを介して前記ソース電極に電気的に接続された導電層を形成するステップと、
前記第1絶縁層上に、前記導電層と離間したバイアス電極と、前記導電層と前記バイアス電極にそれぞれ接続されたセンサ活性層を形成するステップと、
前記導電層上に、補助導電層を形成するステップと、を含むセンサの製造方法。 - 前記センサ活性層上に第2絶縁層を形成するステップをさらに含む請求項17に記載のセンサの製造方法。
- 前記ソース電極と前記第1絶縁層の間に、前記第1ビアホールに連通する第2ビアホールが設けられたパッシベーション層を形成し、前記第1ビアホールと前記第2ビアホールを介して前記ソース電極に電気的に接続された導電層を形成するステップをさらに含む請求項17または18に記載のセンサの製造方法。
- 前記パッシベーション層と前記第1絶縁層の間に、前記第1ビアホールと前記第2ビアホールに連通する第3ビアホールが設けられたバリアメタル層を形成し、前記第1ビアホール、前記第2ビアホール及び前記第3ビアホールを介して前記ソース電極に電気的に接続された導電層を形成するステップをさらに含む請求項19に記載のセンサの製造方法。
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