JP2019517128A5 - - Google Patents
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- Publication number
- JP2019517128A5 JP2019517128A5 JP2018550514A JP2018550514A JP2019517128A5 JP 2019517128 A5 JP2019517128 A5 JP 2019517128A5 JP 2018550514 A JP2018550514 A JP 2018550514A JP 2018550514 A JP2018550514 A JP 2018550514A JP 2019517128 A5 JP2019517128 A5 JP 2019517128A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- layer
- joint
- junction
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 10
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/086,039 | 2016-03-30 | ||
| US15/086,039 US10267545B2 (en) | 2016-03-30 | 2016-03-30 | In-plane active cooling device for mobile electronics |
| PCT/US2017/024517 WO2017172752A1 (en) | 2016-03-30 | 2017-03-28 | In-plane active cooling device for mobile electronics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019517128A JP2019517128A (ja) | 2019-06-20 |
| JP2019517128A5 true JP2019517128A5 (enExample) | 2020-04-23 |
Family
ID=58548893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018550514A Pending JP2019517128A (ja) | 2016-03-30 | 2017-03-28 | モバイル電子機器のための面内能動冷却デバイス |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10267545B2 (enExample) |
| EP (1) | EP3436892B1 (enExample) |
| JP (1) | JP2019517128A (enExample) |
| KR (1) | KR20180130508A (enExample) |
| CN (1) | CN108780344B (enExample) |
| CA (1) | CA3015939A1 (enExample) |
| TW (1) | TW201806204A (enExample) |
| WO (1) | WO2017172752A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102539153B1 (ko) * | 2016-12-05 | 2023-06-01 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR102677907B1 (ko) | 2019-02-01 | 2024-06-21 | 디티피 써모일렉트릭스 엘엘씨 | 공간 가변 분산 전송 특성에 기초한 향상된 최대 온도차를 갖는 열전 소자 및 장치 |
| US11421919B2 (en) | 2019-02-01 | 2022-08-23 | DTP Thermoelectrics LLC | Thermoelectric systems employing distributed transport properties to increase cooling and heating performance |
| KR102846605B1 (ko) * | 2020-02-04 | 2025-08-19 | 삼성디스플레이 주식회사 | 표시 모듈 |
| US20210278887A1 (en) | 2020-03-05 | 2021-09-09 | Samsung Electronics Co., Ltd. | Thermal control for electronic devices |
| CN116209588A (zh) | 2020-06-15 | 2023-06-02 | Dtp热电体有限责任公司 | 热电增强混合热泵系统 |
| CN112254371A (zh) * | 2020-09-28 | 2021-01-22 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | 多级梯度热电制冷片热控装置 |
| US20230403935A1 (en) * | 2022-05-20 | 2023-12-14 | Apple Inc. | Thermoelectric Cooling Modules |
| US12243469B2 (en) * | 2022-12-13 | 2025-03-04 | Lx Semicon Co., Ltd. | Display driving apparatus for operating display device that displays image and control method therefor |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02221821A (ja) * | 1989-02-22 | 1990-09-04 | Murata Mfg Co Ltd | 薄膜熱電素子 |
| JPH06318736A (ja) * | 1993-05-06 | 1994-11-15 | Canon Inc | 薄膜ペルチェ熱電素子 |
| US6282907B1 (en) | 1999-12-09 | 2001-09-04 | International Business Machines Corporation | Thermoelectric cooling apparatus and method for maximizing energy transport |
| JP4218241B2 (ja) * | 2001-12-27 | 2009-02-04 | 三菱電機株式会社 | 光モジュール、および光送信もしくは光受信装置 |
| KR101094783B1 (ko) * | 2003-10-27 | 2011-12-16 | 엘지디스플레이 주식회사 | 열전기 발생장치를 이용한 액정표시장치 |
| US20050150537A1 (en) * | 2004-01-13 | 2005-07-14 | Nanocoolers Inc. | Thermoelectric devices |
| JP3874365B2 (ja) * | 2004-03-01 | 2007-01-31 | 松下電器産業株式会社 | 熱電変換デバイス、およびこれを用いた冷却方法および発電方法 |
| US20060076046A1 (en) | 2004-10-08 | 2006-04-13 | Nanocoolers, Inc. | Thermoelectric device structure and apparatus incorporating same |
| US7825324B2 (en) | 2006-12-29 | 2010-11-02 | Alcatel-Lucent Usa Inc. | Spreading thermoelectric coolers |
| US20090071525A1 (en) | 2007-09-17 | 2009-03-19 | Lucent Technologies, Inc. | Cooling Hot-Spots by Lateral Active Heat Transport |
| KR100997994B1 (ko) * | 2009-04-13 | 2010-12-03 | 삼성전기주식회사 | 열전소자 |
| US9443491B2 (en) * | 2010-09-14 | 2016-09-13 | Nec Display Solutions, Ltd. | Information display device |
| DE102012105367A1 (de) | 2012-02-24 | 2013-08-29 | O-Flexx Technologies Gmbh | Thermoelektrisches Modul und Herstellungsverfahren |
| JP5857792B2 (ja) * | 2012-02-27 | 2016-02-10 | 富士通株式会社 | 熱電デバイスおよびその製造方法 |
| JP6474110B2 (ja) * | 2014-02-28 | 2019-02-27 | 国立大学法人 奈良先端科学技術大学院大学 | 熱電変換材料および熱電変換素子 |
| KR101574012B1 (ko) * | 2014-04-17 | 2015-12-02 | 부산대학교 산학협력단 | 열전 장치 및 이를 포함하는 열전 시스템 |
| AU2016316164A1 (en) * | 2015-09-04 | 2018-04-26 | Hiroaki Nakaya | Thermoelectric conversion element and thermoelectric conversion module |
-
2016
- 2016-03-30 US US15/086,039 patent/US10267545B2/en active Active
-
2017
- 2017-03-28 EP EP17717964.5A patent/EP3436892B1/en active Active
- 2017-03-28 KR KR1020187028222A patent/KR20180130508A/ko not_active Ceased
- 2017-03-28 CN CN201780018440.1A patent/CN108780344B/zh active Active
- 2017-03-28 JP JP2018550514A patent/JP2019517128A/ja active Pending
- 2017-03-28 WO PCT/US2017/024517 patent/WO2017172752A1/en not_active Ceased
- 2017-03-28 CA CA3015939A patent/CA3015939A1/en not_active Abandoned
- 2017-03-30 TW TW106110691A patent/TW201806204A/zh unknown
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