JP2019517128A - モバイル電子機器のための面内能動冷却デバイス - Google Patents

モバイル電子機器のための面内能動冷却デバイス Download PDF

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Publication number
JP2019517128A
JP2019517128A JP2018550514A JP2018550514A JP2019517128A JP 2019517128 A JP2019517128 A JP 2019517128A JP 2018550514 A JP2018550514 A JP 2018550514A JP 2018550514 A JP2018550514 A JP 2018550514A JP 2019517128 A JP2019517128 A JP 2019517128A
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JP
Japan
Prior art keywords
electrode
layer
heat transfer
transfer device
junction
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018550514A
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English (en)
Japanese (ja)
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JP2019517128A5 (enExample
Inventor
ペン・ワン
ユンニクリシュナン・ヴァダッカンマルヴィードゥ
ヴィナイ・ミッター
Original Assignee
クアルコム，インコーポレイテッド
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Application filed by クアルコム，インコーポレイテッド filed Critical クアルコム，インコーポレイテッド
Publication of JP2019517128A publication Critical patent/JP2019517128A/ja
Publication of JP2019517128A5 publication Critical patent/JP2019517128A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2018550514A 2016-03-30 2017-03-28 モバイル電子機器のための面内能動冷却デバイス Pending JP2019517128A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/086,039 2016-03-30
US15/086,039 US10267545B2 (en) 2016-03-30 2016-03-30 In-plane active cooling device for mobile electronics
PCT/US2017/024517 WO2017172752A1 (en) 2016-03-30 2017-03-28 In-plane active cooling device for mobile electronics

Publications (2)

Publication Number Publication Date
JP2019517128A true JP2019517128A (ja) 2019-06-20
JP2019517128A5 JP2019517128A5 (enExample) 2020-04-23

Family

ID=58548893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018550514A Pending JP2019517128A (ja) 2016-03-30 2017-03-28 モバイル電子機器のための面内能動冷却デバイス

Country Status (8)

Country Link
US (1) US10267545B2 (enExample)
EP (1) EP3436892B1 (enExample)
JP (1) JP2019517128A (enExample)
KR (1) KR20180130508A (enExample)
CN (1) CN108780344B (enExample)
CA (1) CA3015939A1 (enExample)
TW (1) TW201806204A (enExample)
WO (1) WO2017172752A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102539153B1 (ko) * 2016-12-05 2023-06-01 삼성디스플레이 주식회사 표시 장치
KR102677907B1 (ko) 2019-02-01 2024-06-21 디티피 써모일렉트릭스 엘엘씨 공간 가변 분산 전송 특성에 기초한 향상된 최대 온도차를 갖는 열전 소자 및 장치
US11421919B2 (en) 2019-02-01 2022-08-23 DTP Thermoelectrics LLC Thermoelectric systems employing distributed transport properties to increase cooling and heating performance
KR102846605B1 (ko) * 2020-02-04 2025-08-19 삼성디스플레이 주식회사 표시 모듈
US20210278887A1 (en) 2020-03-05 2021-09-09 Samsung Electronics Co., Ltd. Thermal control for electronic devices
CN116209588A (zh) 2020-06-15 2023-06-02 Dtp热电体有限责任公司 热电增强混合热泵系统
CN112254371A (zh) * 2020-09-28 2021-01-22 西南电子技术研究所（中国电子科技集团公司第十研究所） 多级梯度热电制冷片热控装置
US20230403935A1 (en) * 2022-05-20 2023-12-14 Apple Inc. Thermoelectric Cooling Modules
US12243469B2 (en) * 2022-12-13 2025-03-04 Lx Semicon Co., Ltd. Display driving apparatus for operating display device that displays image and control method therefor

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02221821A (ja) * 1989-02-22 1990-09-04 Murata Mfg Co Ltd 薄膜熱電素子
JPH06318736A (ja) * 1993-05-06 1994-11-15 Canon Inc 薄膜ペルチェ熱電素子
JP2003198042A (ja) * 2001-12-27 2003-07-11 Mitsubishi Electric Corp 光モジュール、および光送信もしくは光受信装置
WO2005083808A1 (ja) * 2004-03-01 2005-09-09 Matsushita Electric Industrial Co., Ltd. 熱電変換デバイス、およびこれを用いた冷却方法および発電方法
US7310123B2 (en) * 2003-10-27 2007-12-18 Lg.Philips Lcd Co., Ltd. Liquid crystal display module including thermoelectric device
US20080155992A1 (en) * 2006-12-29 2008-07-03 Lucent Technologies, Inc. Spreading Thermoelectric Coolers
JP2013175627A (ja) * 2012-02-27 2013-09-05 Fujitsu Ltd 熱電デバイスおよびその製造方法
WO2015129877A1 (ja) * 2014-02-28 2015-09-03 国立大学法人 奈良先端科学技術大学院大学 熱電変換材料および熱電変換素子
WO2017038831A1 (ja) * 2015-09-04 2017-03-09 浩明 中弥 熱電変換素子および熱電変換モジュール

Family Cites Families (8)

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Publication number Priority date Publication date Assignee Title
US6282907B1 (en) 1999-12-09 2001-09-04 International Business Machines Corporation Thermoelectric cooling apparatus and method for maximizing energy transport
US20050150537A1 (en) * 2004-01-13 2005-07-14 Nanocoolers Inc. Thermoelectric devices
US20060076046A1 (en) 2004-10-08 2006-04-13 Nanocoolers, Inc. Thermoelectric device structure and apparatus incorporating same
US20090071525A1 (en) 2007-09-17 2009-03-19 Lucent Technologies, Inc. Cooling Hot-Spots by Lateral Active Heat Transport
KR100997994B1 (ko) * 2009-04-13 2010-12-03 삼성전기주식회사 열전소자
US9443491B2 (en) * 2010-09-14 2016-09-13 Nec Display Solutions, Ltd. Information display device
DE102012105367A1 (de) 2012-02-24 2013-08-29 O-Flexx Technologies Gmbh Thermoelektrisches Modul und Herstellungsverfahren
KR101574012B1 (ko) * 2014-04-17 2015-12-02 부산대학교 산학협력단 열전 장치 및 이를 포함하는 열전 시스템

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02221821A (ja) * 1989-02-22 1990-09-04 Murata Mfg Co Ltd 薄膜熱電素子
JPH06318736A (ja) * 1993-05-06 1994-11-15 Canon Inc 薄膜ペルチェ熱電素子
JP2003198042A (ja) * 2001-12-27 2003-07-11 Mitsubishi Electric Corp 光モジュール、および光送信もしくは光受信装置
US7310123B2 (en) * 2003-10-27 2007-12-18 Lg.Philips Lcd Co., Ltd. Liquid crystal display module including thermoelectric device
WO2005083808A1 (ja) * 2004-03-01 2005-09-09 Matsushita Electric Industrial Co., Ltd. 熱電変換デバイス、およびこれを用いた冷却方法および発電方法
US20080155992A1 (en) * 2006-12-29 2008-07-03 Lucent Technologies, Inc. Spreading Thermoelectric Coolers
JP2013175627A (ja) * 2012-02-27 2013-09-05 Fujitsu Ltd 熱電デバイスおよびその製造方法
WO2015129877A1 (ja) * 2014-02-28 2015-09-03 国立大学法人 奈良先端科学技術大学院大学 熱電変換材料および熱電変換素子
WO2017038831A1 (ja) * 2015-09-04 2017-03-09 浩明 中弥 熱電変換素子および熱電変換モジュール

Also Published As

Publication number Publication date
US20170284708A1 (en) 2017-10-05
WO2017172752A1 (en) 2017-10-05
TW201806204A (zh) 2018-02-16
KR20180130508A (ko) 2018-12-07
CA3015939A1 (en) 2017-10-05
CN108780344B (zh) 2021-03-12
EP3436892B1 (en) 2020-09-23
CN108780344A (zh) 2018-11-09
US10267545B2 (en) 2019-04-23
EP3436892A1 (en) 2019-02-06
BR112018069655A2 (pt) 2019-02-05

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