BR112018069655A2 - dispositivo de resfriamento ativo em plano - Google Patents

dispositivo de resfriamento ativo em plano

Info

Publication number
BR112018069655A2
BR112018069655A2 BR112018069655A BR112018069655A BR112018069655A2 BR 112018069655 A2 BR112018069655 A2 BR 112018069655A2 BR 112018069655 A BR112018069655 A BR 112018069655A BR 112018069655 A BR112018069655 A BR 112018069655A BR 112018069655 A2 BR112018069655 A2 BR 112018069655A2
Authority
BR
Brazil
Prior art keywords
active
cooling device
heat
layer
electrodes
Prior art date
Application number
BR112018069655A
Other languages
English (en)
Inventor
Wang Peng
Vadakkanmaruveedu Unnikrishnan
Mitter Vinay
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of BR112018069655A2 publication Critical patent/BR112018069655A2/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

um dispositivo de transferência de calor ativo é proposto para gerenciamento de calor em dispositivos tais como dispositivos móveis. o dispositivo de transferência de calor proposto pode incluir uma camada termoelétrica (te), e primeiro e segundo eletrodos, ambos em superfícies laterais da camada te. quando existe uma diferença de tensão entre o primeiro e segundo eletrodos, o calor de uma fonte de calor pode ser transferido lateralmente dentro da camada te do primeiro eletrodo para o segundo eletrodo.
BR112018069655A 2016-03-30 2017-03-28 dispositivo de resfriamento ativo em plano BR112018069655A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/086,039 US10267545B2 (en) 2016-03-30 2016-03-30 In-plane active cooling device for mobile electronics
PCT/US2017/024517 WO2017172752A1 (en) 2016-03-30 2017-03-28 In-plane active cooling device for mobile electronics

Publications (1)

Publication Number Publication Date
BR112018069655A2 true BR112018069655A2 (pt) 2019-02-05

Family

ID=58548893

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112018069655A BR112018069655A2 (pt) 2016-03-30 2017-03-28 dispositivo de resfriamento ativo em plano

Country Status (9)

Country Link
US (1) US10267545B2 (pt)
EP (1) EP3436892B1 (pt)
JP (1) JP2019517128A (pt)
KR (1) KR20180130508A (pt)
CN (1) CN108780344B (pt)
BR (1) BR112018069655A2 (pt)
CA (1) CA3015939A1 (pt)
TW (1) TW201806204A (pt)
WO (1) WO2017172752A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102539153B1 (ko) * 2016-12-05 2023-06-01 삼성디스플레이 주식회사 표시 장치
CN117915748A (zh) 2019-02-01 2024-04-19 Dtp热电体有限责任公司 具有增强最大温差的热电元件和装置
US11421919B2 (en) 2019-02-01 2022-08-23 DTP Thermoelectrics LLC Thermoelectric systems employing distributed transport properties to increase cooling and heating performance
KR20210099710A (ko) * 2020-02-04 2021-08-13 삼성디스플레이 주식회사 표시 모듈
US20210278887A1 (en) 2020-03-05 2021-09-09 Samsung Electronics Co., Ltd. Thermal control for electronic devices
WO2021257464A1 (en) 2020-06-15 2021-12-23 DTP Thermoelectrics LLC Thermoelectric enhanced hybrid heat pump systems
CN112254371A (zh) * 2020-09-28 2021-01-22 西南电子技术研究所（中国电子科技集团公司第十研究所） 多级梯度热电制冷片热控装置

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
JPH02221821A (ja) * 1989-02-22 1990-09-04 Murata Mfg Co Ltd 薄膜熱電素子
JPH06318736A (ja) * 1993-05-06 1994-11-15 Canon Inc 薄膜ペルチェ熱電素子
US6282907B1 (en) 1999-12-09 2001-09-04 International Business Machines Corporation Thermoelectric cooling apparatus and method for maximizing energy transport
JP4218241B2 (ja) * 2001-12-27 2009-02-04 三菱電機株式会社 光モジュール、および光送信もしくは光受信装置
KR101094783B1 (ko) * 2003-10-27 2011-12-16 엘지디스플레이 주식회사 열전기 발생장치를 이용한 액정표시장치
US20050150537A1 (en) * 2004-01-13 2005-07-14 Nanocoolers Inc. Thermoelectric devices
JP3874365B2 (ja) * 2004-03-01 2007-01-31 松下電器産業株式会社 熱電変換デバイス、およびこれを用いた冷却方法および発電方法
US20060076046A1 (en) 2004-10-08 2006-04-13 Nanocoolers, Inc. Thermoelectric device structure and apparatus incorporating same
US7825324B2 (en) 2006-12-29 2010-11-02 Alcatel-Lucent Usa Inc. Spreading thermoelectric coolers
US20090071525A1 (en) 2007-09-17 2009-03-19 Lucent Technologies, Inc. Cooling Hot-Spots by Lateral Active Heat Transport
KR100997994B1 (ko) * 2009-04-13 2010-12-03 삼성전기주식회사 열전소자
US9443491B2 (en) * 2010-09-14 2016-09-13 Nec Display Solutions, Ltd. Information display device
DE102012105373B4 (de) 2012-02-24 2019-02-07 Mahle International Gmbh Thermoelektrisches Element sowie Verfahren zu dessen Herstellung
JP5857792B2 (ja) * 2012-02-27 2016-02-10 富士通株式会社 熱電デバイスおよびその製造方法
JP6474110B2 (ja) * 2014-02-28 2019-02-27 国立大学法人 奈良先端科学技術大学院大学 熱電変換材料および熱電変換素子
KR101574012B1 (ko) * 2014-04-17 2015-12-02 부산대학교 산학협력단 열전 장치 및 이를 포함하는 열전 시스템
JP6738338B2 (ja) * 2015-09-04 2020-08-12 浩明 中弥 熱電変換素子および熱電変換モジュール

Also Published As

Publication number Publication date
JP2019517128A (ja) 2019-06-20
KR20180130508A (ko) 2018-12-07
EP3436892A1 (en) 2019-02-06
CN108780344A (zh) 2018-11-09
US10267545B2 (en) 2019-04-23
CA3015939A1 (en) 2017-10-05
CN108780344B (zh) 2021-03-12
US20170284708A1 (en) 2017-10-05
TW201806204A (zh) 2018-02-16
EP3436892B1 (en) 2020-09-23
WO2017172752A1 (en) 2017-10-05

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Legal Events

Date Code Title Description
B350 Update of information on the portal [chapter 15.35 patent gazette]
B06W Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette]