BR112016002693A2 - aparelho de resfriamento para um dispositivo elétrico, dispositivo elétrico ou eletrônico, interruptor e quadro de distribuição elétrica - Google Patents
aparelho de resfriamento para um dispositivo elétrico, dispositivo elétrico ou eletrônico, interruptor e quadro de distribuição elétricaInfo
- Publication number
- BR112016002693A2 BR112016002693A2 BR112016002693A BR112016002693A BR112016002693A2 BR 112016002693 A2 BR112016002693 A2 BR 112016002693A2 BR 112016002693 A BR112016002693 A BR 112016002693A BR 112016002693 A BR112016002693 A BR 112016002693A BR 112016002693 A2 BR112016002693 A2 BR 112016002693A2
- Authority
- BR
- Brazil
- Prior art keywords
- electrical
- switchboard
- switch
- cooling
- electronic device
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/20681—Liquid coolant with phase change, e.g. heat pipes within cabinets for removing heat from sub-racks
-
- G—PHYSICS
- G12—INSTRUMENT DETAILS
- G12B—CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILS OF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR
- G12B15/00—Cooling
- G12B15/06—Cooling by contact with heat-absorbing or radiating masses, e.g. heat-sink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/52—Cooling of switch parts
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/56—Cooling; Ventilation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Installation Of Bus-Bars (AREA)
- Structure Of Telephone Exchanges (AREA)
Abstract
ÿþr
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2013/066549 WO2015018443A1 (en) | 2013-08-07 | 2013-08-07 | Cooling apparatus for an electrical or electronic device, and electrical or electronic device, in particular a circuit breaker, comprising such cooling apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112016002693A2 true BR112016002693A2 (pt) | 2017-08-01 |
Family
ID=48917561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112016002693A BR112016002693A2 (pt) | 2013-08-07 | 2013-08-07 | aparelho de resfriamento para um dispositivo elétrico, dispositivo elétrico ou eletrônico, interruptor e quadro de distribuição elétrica |
Country Status (6)
Country | Link |
---|---|
US (1) | US9736967B2 (pt) |
EP (1) | EP3031309B1 (pt) |
CN (1) | CN105706540B (pt) |
BR (1) | BR112016002693A2 (pt) |
RU (1) | RU2650183C2 (pt) |
WO (1) | WO2015018443A1 (pt) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9835382B2 (en) * | 2015-09-16 | 2017-12-05 | Acer Incorporated | Thermal dissipation module |
KR102443261B1 (ko) * | 2015-10-08 | 2022-09-13 | 현대모비스 주식회사 | 직접냉각유로를 갖는 전력반도체 양면 냉각 장치 |
TWI590751B (zh) * | 2016-08-26 | 2017-07-01 | 宏碁股份有限公司 | 可攜式電子裝置 |
CN110291689B (zh) * | 2017-02-20 | 2021-01-08 | 三菱电机株式会社 | 电路断路器 |
DE102017206978A1 (de) * | 2017-04-26 | 2018-10-31 | Bayerische Motoren Werke Aktiengesellschaft | Deckel zum elektrischen Koppeln mehrerer Speicherzellen eines elektrischen Energiespeichermoduls |
EP3686536B1 (en) * | 2019-01-22 | 2021-05-26 | ABB Power Grids Switzerland AG | Evaporator and manufacturing method |
EP3742461B1 (en) | 2019-05-20 | 2022-02-23 | ABB Schweiz AG | Cooling apparatus for a medium voltage or high voltage switchgear |
CN110265241B (zh) * | 2019-07-19 | 2024-10-01 | 常州博瑞电力自动化设备有限公司 | 一种独立控制式直流断路器水冷系统 |
EP3889985A1 (en) | 2020-04-03 | 2021-10-06 | ABB Schweiz AG | Cooling apparatus for a medium voltage or high voltage switchgear |
US11950394B2 (en) | 2021-10-12 | 2024-04-02 | Ge Aviation Systems Llc | Liquid-cooled assembly and method |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
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DE3680774D1 (de) * | 1985-12-16 | 1991-09-12 | Hitachi Ltd | Integriertes halbleiterbauelement. |
JP2953273B2 (ja) * | 1993-10-22 | 1999-09-27 | 住友電気工業株式会社 | 低温に冷却する素子の接続方法 |
US5565716A (en) * | 1995-03-01 | 1996-10-15 | The United States Of America As Represented By The Secretary Of The Navy | Variable resistance, liquid-cooled load bank |
US6053238A (en) * | 1998-10-30 | 2000-04-25 | International Business Machines Corporation | Center feed parallel flow cold plate for dual refrigeration systems |
RU2161835C1 (ru) * | 2000-01-24 | 2001-01-10 | Петербургский государственный университет путей сообщения | Электротермический силовой элемент |
US8396950B1 (en) * | 2000-03-02 | 2013-03-12 | Rockstar Consortium Us Lp | Method and apparatus for the fast detection of connectivity loss between devices in a network |
DE10102310C1 (de) * | 2001-01-18 | 2002-06-20 | Reinhausen Maschf Scheubeck | Thyristor-Stufenschalter |
US6999316B2 (en) * | 2003-09-10 | 2006-02-14 | Qnx Cooling Systems Inc. | Liquid cooling system |
DE20314532U1 (de) * | 2003-09-16 | 2004-02-19 | Pries, Wulf H. | Vorrichtung zur Ableitung von Wärme von elektronischen und elektrischen Bauelementen |
JP2005228237A (ja) * | 2004-02-16 | 2005-08-25 | Hitachi Ltd | 液冷システム及びそれを備えた電子機器 |
US7161803B1 (en) * | 2004-04-12 | 2007-01-09 | Heady Gregory S | Cooling system for an electronic display |
US7187549B2 (en) * | 2004-06-30 | 2007-03-06 | Teradyne, Inc. | Heat exchange apparatus with parallel flow |
US20060011326A1 (en) * | 2004-07-15 | 2006-01-19 | Yassour Yuval | Heat-exchanger device and cooling system |
US7168152B1 (en) * | 2004-10-18 | 2007-01-30 | Lockheed Martin Corporation | Method for making an integrated active antenna element |
US7219715B2 (en) * | 2004-12-23 | 2007-05-22 | Onscreen Technologies, Inc. | Cooling systems incorporating heat transfer meshes |
US7312987B1 (en) * | 2005-12-09 | 2007-12-25 | Storage Technology Corporation | Adaptable thin plate modular heat exchanger blade for cooling electronic equipment |
US7295436B2 (en) * | 2005-12-10 | 2007-11-13 | Kioan Cheon | Cooling system for computer components |
DE202006013674U1 (de) * | 2006-09-06 | 2006-11-02 | Abb Patent Gmbh | Hoch-, Mittel- oder Niederspannungsschaltschrank |
IT1395698B1 (it) * | 2009-05-28 | 2012-10-19 | Abb Spa | Dispositivo di raffreddamento per un interruttore, ed interruttore comprendente tale dispositivo. |
KR101472642B1 (ko) * | 2009-09-28 | 2014-12-15 | 에이비비 리써치 리미티드 | 전자 부품 냉각용 냉각 모듈 |
DE102009054517B4 (de) * | 2009-12-10 | 2011-12-29 | Robert Bosch Gmbh | Elektronisches Steuergerät |
CN102300442A (zh) * | 2010-06-25 | 2011-12-28 | 鸿富锦精密工业(深圳)有限公司 | 液冷散热系统及使用该液冷散热系统的电子装置 |
US8184436B2 (en) * | 2010-06-29 | 2012-05-22 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems |
US20120026692A1 (en) * | 2010-07-28 | 2012-02-02 | Wolverine Tube, Inc. | Electronics substrate with enhanced direct bonded metal |
KR101057958B1 (ko) * | 2010-07-30 | 2011-08-18 | 김병호 | 돌입전류 충격방지 및 대기전력 차단을 위한 스위치 |
EP2426801A1 (en) * | 2010-09-02 | 2012-03-07 | ABB Research Ltd. | Busbar, method for cooling thereof and electrical apparatus |
US8804334B2 (en) * | 2011-05-25 | 2014-08-12 | International Business Machines Corporation | Multi-rack, door-mounted heat exchanger |
EP2552182A1 (en) | 2011-07-29 | 2013-01-30 | ABB Research Ltd. | Double-loop thermosiphon for cooling of electric and electronic components |
US8811015B2 (en) * | 2012-02-16 | 2014-08-19 | Mission Motor Company | Motor control device |
DE202012008739U1 (de) * | 2012-09-12 | 2013-12-16 | Abb Technology Ag | Kühlkreislauf mit ausreichend knapp bemessenem Wärmetauscher |
WO2014065696A1 (ru) * | 2012-10-26 | 2014-05-01 | Закрытое акционерное общество "РСК Технологии" | Охладитель вычислительных модулей компьютера |
US9153374B2 (en) * | 2013-06-28 | 2015-10-06 | Teco-Westinghouse Motor Company | Cooling arrangements for drive systems |
US9277683B2 (en) * | 2013-09-19 | 2016-03-01 | Siemens Aktiengesellschaft | Liquid cooled electronic modules and methods for replacing the same |
US20150124381A1 (en) * | 2013-11-05 | 2015-05-07 | Chia Hsing Electrical Co., Ltd. | Switchboard copper busbar heat dissipating device |
US9504191B2 (en) * | 2014-03-28 | 2016-11-22 | Deere & Company | Electronic assembly for an inverter |
-
2013
- 2013-08-07 CN CN201380078819.3A patent/CN105706540B/zh active Active
- 2013-08-07 US US14/906,313 patent/US9736967B2/en active Active
- 2013-08-07 EP EP13745437.7A patent/EP3031309B1/en active Active
- 2013-08-07 BR BR112016002693A patent/BR112016002693A2/pt not_active Application Discontinuation
- 2013-08-07 RU RU2016107879A patent/RU2650183C2/ru not_active IP Right Cessation
- 2013-08-07 WO PCT/EP2013/066549 patent/WO2015018443A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US9736967B2 (en) | 2017-08-15 |
US20160174414A1 (en) | 2016-06-16 |
CN105706540A (zh) | 2016-06-22 |
RU2016107879A (ru) | 2017-09-14 |
CN105706540B (zh) | 2018-04-03 |
EP3031309A1 (en) | 2016-06-15 |
WO2015018443A1 (en) | 2015-02-12 |
RU2650183C2 (ru) | 2018-04-11 |
EP3031309B1 (en) | 2018-12-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] | ||
B08G | Application fees: restoration [chapter 8.7 patent gazette] | ||
B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
B11B | Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements |