WO2014065696A1 - Охладитель вычислительных модулей компьютера - Google Patents
Охладитель вычислительных модулей компьютера Download PDFInfo
- Publication number
- WO2014065696A1 WO2014065696A1 PCT/RU2013/000087 RU2013000087W WO2014065696A1 WO 2014065696 A1 WO2014065696 A1 WO 2014065696A1 RU 2013000087 W RU2013000087 W RU 2013000087W WO 2014065696 A1 WO2014065696 A1 WO 2014065696A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooler
- computer
- computing modules
- refrigerant
- channel
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
Definitions
- the invention relates to electrical engineering, in particular to a device for cooling power supply units for computing modules of a computer
- a cooling device is known (US patent No. 6457514, class H05K7 / 20, dated 01.10.2002), using a liquid cooler with guides for selective cooling of electronic components, including channels formed by parallel guiding elements that provide parallel supply of coolant to the cooled electronic heat dissipating fins installed in the refrigerant stream directly below the cooling modules.
- the disadvantage of the described device is the increase in local heat transfer at the installation sites of the cooled modules by introducing additional elements (fins, inset inserts) into the refrigerant stream, which leads to an increase in the hydraulic resistance of the cooler channels and the cost of the structure.
- a known module of the electronic unit (copyright certificate Na 1637051, class N05K 7/20, publ. 23.03.1991), containing a frame, printed circuit boards with a number of electronic components on one side of them rigidly fixed to it and a heat sink assembly consisting of multilayer plates which form channels for the passage of liquid coolant, in the module the printed circuit boards are connected to the heat sink unit with their free sides in order to increase the density of the arrangement and improve heat transfer, and the channels for the liquid coolant are located in the inner a layer of the heat-removing unit with ensuring contact along their entire length with the outer layers and are made with a longitudinal section in the form of a meander oriented in the direction of the rows of electronic components.
- the disadvantage of this invention is the uneconomical design and lack of efficiency due to the fact that the heat sink is carried out from almost the entire surface of the base with partial localization along the rows of electronic units.
- the closest technical solution is a cooler for power electronic modules (Russian patent jN ° 2273970, class N05K 7/20, dated 10.04.2006), containing a heat-removing base with rows of heat-generating electronic modules installed on it, a cover and including channels for the passage of refrigerant, this channels for the passage of liquid refrigerant made using the shape of the meander, the heat-removing base includes cavities made under the installation sites of the electronic modules with the inserts forming the channels form in them, paired with the lid, the indicated channels for the passage of the refrigerant are made in the form of rectilinear sections located in different planes, interconnected, and connected sections, each of which is located in the specified cavity, while these channels are connected in parallel-serial flow diagram of the liquid coolant Ghent; for mounting electronic modules at the base, tides are made passing through the meander sections of channels for passing liquid refrigerant, while the tide sections located inside the channel are made in the form of conveniently flowing blades, and at the points of rotation of the liquid ref
- the technical result of the proposed technical solution is to increase the efficiency and economy of the design of the cooling system of computer modules of the computer, simplify their design and improve reliability, reduce energy consumption of the cooling system.
- the cooler of the computer's computing modules includes two flat plates fastened together with grooves, together forming at least one channel for the passage of refrigerant, hermetically sealed with liners, which are the heat sink base for the heat-generating electronic components of the computer modules in contact with them, while the channel for passing the refrigerant has inlet and outlet openings, respectively, for supplying and draining the refrigerant.
- the electronic components of the computing modules of the computer are in contact with the flat plates directly through the pads and / or through various thermal interfaces.
- the channel for the passage of refrigerant in the cross section may be in the form of a square, or rectangle, or circle, or oval.
- each flat plate with the grooves are fastened by means of fasteners or welded together.
- each flat plate has an isolated closed groove for installation of sealing liners in it.
- two flat plates bonded together in their design may have fastening means for fastening the cooler to the enclosure.
- the refrigerant passage preferably has a series circuit for the passage of refrigerant.
- inlet and outlet openings must have means for quick connection of hoses or pipes, fittings such as john guest.
- the principle of operation of the cooling system of computing modules of a computer consists in the complete removal of heat influx generated in electronic components using a liquid coolant.
- the liquid coolant moves in a channel preformed in such a way as to reduce hydraulic losses and equalize the temperature on the surface of the heat-absorbing components of the computer.
- the stable temperature of the components of the computer increases the reliability of the computer as a whole. Energy savings are achieved by:
- the temperature of the heated liquid refrigerant allows the use of free cooling in the atmosphere and completely abandon freon and similar cooling systems.
- the required volume of liquid refrigerant is 4000 times less than the equivalent volume of air in terms of heat capacity. This is due to the difference in heat capacity of different media.
- the proposed cooling system includes one or more cooling plates, which are formed so as to be connected to
- a cooling system is used to cool 2.5 "drives or 1 3.5" drive.
- the cooling plate is also used as an element of the case and gives rigidity to the structural and structural integrity of the computer's computing modules. Inside the cooling plate, cooling fluid circulates in at least one channel. Thus, the coolant removes heat influx from the surfaces of electronic components primarily due to contact heat transfer.
- the input and output of the cooler of the computing modules of the computer (calculator) are connected to an external liquid cooling system.
- the cooler of the cooling system of the computing modules consists of 2 halves, including channels for the passage of refrigerant, sealing liners, heat-removing bases from the computing modules of the computer in contact with the heat-absorbing electronic components directly or through various thermal interfaces.
- a heat exchanger is used, in the slots of which memory modules are installed and fixed inside with the help of thermal interfaces.
- the heat exchanger itself is attached to the cooler of the computing modules of the computer, the heat transfer from the memory modules through the heat exchanger to the cooler is carried out by the contact method.
- the channel for the passage of the refrigerant is made by the body of the cooler of the computing modules of the computer (calculator) in the form of a rectangular groove and has a serial circuit for passing the refrigerant; half of the cooler (one or both) have 2 isolated closed channels for installing sealing liners, contain fasteners for installing the cooler in the structure of the enclosure.
- Figure 1 General view of the cooler of the computing modules of the computer
- Fig.Z is a view of one of the cooler plates
- Figure 4 - shows various types of contact pads of the cooler for connecting to them cooled elements of the computer
- the cooler of the cooling system can also be attached by various known means to the cooled modules of the computer.
- the specified computer module cooler together with standard memory modules and disks, containing 2 halves and including channels for the passage of the coolant, sealing liners, heat sinks with thermal interfaces installed on them, directly in contact with the heat-generating electronic components of the computer's computing modules, the channel for passing the coolant is made in the body half (one or two) of a rectangular groove and has a sequential circuit for passing refrigerant; the halves have 2 isolated closed channels for installing sealing liners, contain fasteners for installing the cooler in the structure of the enclosure.
- a heat exchanger is used, in the slots of which memory modules are installed and fixed inside with the help of thermal interfaces.
- the heat exchanger itself is attached to the cooler of the computing modules of the computer, the heat transfer from the memory modules through the heat exchanger to the cooler is carried out by the contact method.
- the plate is used to cool 2 2.5 "drives or 1 3.5" drive.
- the cooler of the computer modules is manufactured by milling 2 halves 1 and 2 (Figs. 2, 3, 5), including channels for the passage of refrigerant 3.
- sealing liners are used, placed in grooves 4 of Figure 2, liners made in the form rings of elastic material.
- tides heat exchangers
- FIG. 4 position 5.
- coolant inlet and outlet 7 are provided with inlet 6 and outlet 7 openings connected to the refrigerant passage 3, closed by half 2 with sealing inserts 4.
- Half 1 ( Figure 2) contains guide elements for installing the cooler in the enclosure 8.
- FIG. 5 shows a cross-section of a cooler of computing modules of a computer containing 2 halves 1 and 2, with a standard cooling memory cooling coil installed (pos. 10 of FIG. 5).
- the heat exchanger is mounted on a cooler using thermal interfaces 11.
- Cooler computing modules of a computer operates as follows.
- the refrigerant through the inlet 6 in half 1 enters the channel for the passage of refrigerant 3, formed by interconnected half 1 and half 2.
- the refrigerant moves in the direction of the arrow along the channel for the passage of refrigerant;
- the channel for the passage of the refrigerant is made in the body of the half in the form of a rectangular groove and has a sequential circuit for the passage of the refrigerant, which allows to optimize the flow of refrigerant and increase the economy and efficiency of the cooler.
- the design of the channel between the two halves allows you to create the optimal cross-sectional shape, providing a high fluid flow rate, increase efficiency and simplify the design of the cooler, including by eliminating unnecessary sealing gaskets.
- Heat exchanger Removal of heat influx from standard memory modules is performed by a heat exchanger, in the slots of which memory modules are installed and fixed inside with the help of thermal interfaces.
- the heat exchanger itself is attached to the cooler of the computing modules of the computer, the heat transfer from the memory modules through the heat exchanger to the cooler is carried out by the contact method.
- cooler of computing modules of a computer were disclosed, but it is obvious to any person skilled in the art that based on the disclosed data, it is possible to create variations of cooling devices, for example, with different arrangement of plates relative to computer modules, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/238,939 US9335800B2 (en) | 2012-10-26 | 2013-02-07 | Cooler for computing modules of a computer |
KR2020147000020U KR20150002626U (ko) | 2012-10-26 | 2013-02-07 | 컴퓨터 프로세싱 유닛용 냉각 장치 |
CN201390000136.1U CN204189458U (zh) | 2012-10-26 | 2013-02-07 | 用于处理单元的冷却设备 |
JP2015600071U JP3201784U (ja) | 2012-10-26 | 2013-02-07 | コンピュータの演算装置用の冷却装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RU2012145747 | 2012-10-26 | ||
RU2012145747 | 2012-10-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014065696A1 true WO2014065696A1 (ru) | 2014-05-01 |
Family
ID=50544957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/RU2013/000087 WO2014065696A1 (ru) | 2012-10-26 | 2013-02-07 | Охладитель вычислительных модулей компьютера |
Country Status (6)
Country | Link |
---|---|
US (1) | US9335800B2 (ru) |
JP (1) | JP3201784U (ru) |
KR (1) | KR20150002626U (ru) |
CN (1) | CN204189458U (ru) |
DE (1) | DE202013011767U1 (ru) |
WO (1) | WO2014065696A1 (ru) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3031309B1 (en) * | 2013-08-07 | 2018-12-05 | ABB S.p.A. | Cooling apparatus for an electrical or electronic device, and electrical or electronic device, in particular a circuit breaker, comprising such cooling apparatus |
KR102570579B1 (ko) * | 2018-07-13 | 2023-08-24 | 엘지전자 주식회사 | 냉동기 |
US10840167B2 (en) | 2018-11-19 | 2020-11-17 | Advanced Micro Devices, Inc. | Integrated heat spreader with configurable heat fins |
EP3879382B1 (en) * | 2020-03-13 | 2022-11-16 | EKWB d.o.o. | Cooling device for a computer module |
WO2022188036A1 (zh) * | 2021-03-09 | 2022-09-15 | 深圳市大疆创新科技有限公司 | 车辆控制器及车辆 |
CN116507097B (zh) * | 2023-06-25 | 2024-05-28 | 盐城工学院 | 一种电机控制器和自动化设备 |
Citations (6)
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SU1637051A1 (ru) * | 1989-04-26 | 1991-03-23 | Предприятие П/Я В-2969 | Модуль радиоэлектронного блока |
SU1762429A1 (ru) * | 1990-12-25 | 1992-09-15 | Конструкторское Бюро Электроприборостроения | Модуль радиоэлектронного блока |
US5363659A (en) * | 1987-07-31 | 1994-11-15 | Heat And Control, Inc. | Ice making apparatus |
RU2088059C1 (ru) * | 1995-05-10 | 1997-08-20 | Центральный научно-исследовательский институт "Электроприбор" | Шкаф радиоэлектронной аппаратуры |
RU2273970C1 (ru) * | 2004-09-06 | 2006-04-10 | Сибирский филиал Федерального государственного унитарного предприятия Всероссийский научно-исследовательский и конструкторско-технологический институт подвижного состава Министерства путей сообщения Российской Федерации | Охладитель силовых электронных модулей |
EA201001072A1 (ru) * | 2008-01-02 | 2011-02-28 | П.Т.Х. Энджиниринг Лтд. | Трубный фитинг |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
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US4551787A (en) * | 1983-02-07 | 1985-11-05 | Sperry Corporation | Apparatus for use in cooling integrated circuit chips |
US5159529A (en) * | 1991-05-15 | 1992-10-27 | International Business Machines Corporation | Composite liquid cooled plate for electronic equipment |
IT1297593B1 (it) | 1997-08-08 | 1999-12-17 | Itelco S P A | Dissipatore per componenti elettronici raffreddato a liquido, dotato di alette dissipatrici disposte in maniera selettiva |
US6988534B2 (en) * | 2002-11-01 | 2006-01-24 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
JP4561632B2 (ja) * | 2003-06-27 | 2010-10-13 | 日本電気株式会社 | 電子機器の冷却装置 |
DK200301577A (da) * | 2003-10-27 | 2005-04-28 | Danfoss Silicon Power Gmbh | Flowfordelingsenhed og köleenhed |
MX2007001096A (es) * | 2004-07-28 | 2007-04-17 | 3M Innovative Properties Co | Intercambiador de calor y dispositivo de fluido. |
US7298618B2 (en) * | 2005-10-25 | 2007-11-20 | International Business Machines Corporation | Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled |
EP1887847B1 (de) * | 2006-08-10 | 2011-06-15 | Continental Automotive GmbH | Elektronikeinheit mit abgedichteter Kühlmittelpassage |
US7764494B2 (en) * | 2007-11-20 | 2010-07-27 | Basic Electronics, Inc. | Liquid cooled module |
WO2009143330A2 (en) * | 2008-05-21 | 2009-11-26 | Asetek A/S | Graphics card thermal interposer |
US20120087088A1 (en) * | 2008-08-05 | 2012-04-12 | Pipeline Micro, Inc. | Microscale heat transfer systems |
US8427832B2 (en) * | 2011-01-05 | 2013-04-23 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cold plate assemblies and power electronics modules |
US20140049908A1 (en) * | 2012-08-20 | 2014-02-20 | André Sloth Eriksen | Thermal management system |
-
2013
- 2013-02-07 KR KR2020147000020U patent/KR20150002626U/ko not_active Application Discontinuation
- 2013-02-07 CN CN201390000136.1U patent/CN204189458U/zh not_active Expired - Fee Related
- 2013-02-07 US US14/238,939 patent/US9335800B2/en active Active
- 2013-02-07 JP JP2015600071U patent/JP3201784U/ja not_active Expired - Fee Related
- 2013-02-07 WO PCT/RU2013/000087 patent/WO2014065696A1/ru active Application Filing
- 2013-02-07 DE DE202013011767.2U patent/DE202013011767U1/de not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5363659A (en) * | 1987-07-31 | 1994-11-15 | Heat And Control, Inc. | Ice making apparatus |
SU1637051A1 (ru) * | 1989-04-26 | 1991-03-23 | Предприятие П/Я В-2969 | Модуль радиоэлектронного блока |
SU1762429A1 (ru) * | 1990-12-25 | 1992-09-15 | Конструкторское Бюро Электроприборостроения | Модуль радиоэлектронного блока |
RU2088059C1 (ru) * | 1995-05-10 | 1997-08-20 | Центральный научно-исследовательский институт "Электроприбор" | Шкаф радиоэлектронной аппаратуры |
RU2273970C1 (ru) * | 2004-09-06 | 2006-04-10 | Сибирский филиал Федерального государственного унитарного предприятия Всероссийский научно-исследовательский и конструкторско-технологический институт подвижного состава Министерства путей сообщения Российской Федерации | Охладитель силовых электронных модулей |
EA201001072A1 (ru) * | 2008-01-02 | 2011-02-28 | П.Т.Х. Энджиниринг Лтд. | Трубный фитинг |
Also Published As
Publication number | Publication date |
---|---|
CN204189458U (zh) | 2015-03-04 |
DE202013011767U1 (de) | 2015-01-30 |
US20150234438A1 (en) | 2015-08-20 |
JP3201784U (ja) | 2016-01-07 |
US9335800B2 (en) | 2016-05-10 |
KR20150002626U (ko) | 2015-07-06 |
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