IT1297593B1 - Dissipatore per componenti elettronici raffreddato a liquido, dotato di alette dissipatrici disposte in maniera selettiva - Google Patents
Dissipatore per componenti elettronici raffreddato a liquido, dotato di alette dissipatrici disposte in maniera selettivaInfo
- Publication number
- IT1297593B1 IT1297593B1 IT97AN000048A ITAN970048A IT1297593B1 IT 1297593 B1 IT1297593 B1 IT 1297593B1 IT 97AN000048 A IT97AN000048 A IT 97AN000048A IT AN970048 A ITAN970048 A IT AN970048A IT 1297593 B1 IT1297593 B1 IT 1297593B1
- Authority
- IT
- Italy
- Prior art keywords
- liquid
- electronic components
- selective manner
- fins arranged
- dissipator
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT97AN000048A IT1297593B1 (it) | 1997-08-08 | 1997-08-08 | Dissipatore per componenti elettronici raffreddato a liquido, dotato di alette dissipatrici disposte in maniera selettiva |
US08/996,030 US6457514B1 (en) | 1997-08-08 | 1997-12-22 | Liquid cooled dissipator for electronic components equipped with selectively arranged dissipation fins |
DE69730601T DE69730601T2 (de) | 1997-08-08 | 1997-12-23 | Kühlmittel-Verteiler mit für Elektronik-Komponenten selektiv verteilten Kühlspitzen |
EP97830701A EP0903971B1 (en) | 1997-08-08 | 1997-12-23 | Liquid cooled dissipator for electronic components equipped with selectively arranged dissipation fins. |
CA002225664A CA2225664A1 (en) | 1997-08-08 | 1997-12-23 | Liquid cooled dissipator for electronic components equipped with selectively arranged dissipation fins |
JP10125347A JPH1168368A (ja) | 1997-08-08 | 1998-04-20 | 選択的に設置された放熱フィンを備えた電気・電子部品用液冷放熱器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT97AN000048A IT1297593B1 (it) | 1997-08-08 | 1997-08-08 | Dissipatore per componenti elettronici raffreddato a liquido, dotato di alette dissipatrici disposte in maniera selettiva |
Publications (2)
Publication Number | Publication Date |
---|---|
ITAN970048A1 ITAN970048A1 (it) | 1999-02-08 |
IT1297593B1 true IT1297593B1 (it) | 1999-12-17 |
Family
ID=11334117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT97AN000048A IT1297593B1 (it) | 1997-08-08 | 1997-08-08 | Dissipatore per componenti elettronici raffreddato a liquido, dotato di alette dissipatrici disposte in maniera selettiva |
Country Status (6)
Country | Link |
---|---|
US (1) | US6457514B1 (it) |
EP (1) | EP0903971B1 (it) |
JP (1) | JPH1168368A (it) |
CA (1) | CA2225664A1 (it) |
DE (1) | DE69730601T2 (it) |
IT (1) | IT1297593B1 (it) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6639798B1 (en) * | 2002-06-24 | 2003-10-28 | Delphi Technologies, Inc. | Automotive electronics heat exchanger |
US6655449B1 (en) * | 2002-11-08 | 2003-12-02 | Cho-Chang Hsien | Heat dissipation device by liquid cooling |
US20040190253A1 (en) * | 2003-03-31 | 2004-09-30 | Ravi Prasher | Channeled heat sink and chassis with integrated heat rejector for two-phase cooling |
DE102005025381A1 (de) * | 2005-05-31 | 2006-12-07 | Behr Industry Gmbh & Co. Kg | Vorrichtung zur Kühlung von elekronischen Bauelementen |
US7450384B2 (en) * | 2006-07-06 | 2008-11-11 | Hybricon Corporation | Card cage with parallel flow paths having substantially similar lengths |
US20080160070A1 (en) * | 2006-12-27 | 2008-07-03 | Nexagen Usa Llc | Transdermal vitamin b12 delivery patch |
US20080310101A1 (en) * | 2007-06-18 | 2008-12-18 | Ivan Pawlenko | Double-walled enclosure with improved cooling |
RU2516227C2 (ru) * | 2009-11-23 | 2014-05-20 | Дженерал Электрик Компани | Теплоотвод и блок для плоских корпусов, обеспечивающий охлаждение и компоновку |
US10531594B2 (en) | 2010-07-28 | 2020-01-07 | Wieland Microcool, Llc | Method of producing a liquid cooled coldplate |
US9795057B2 (en) | 2010-07-28 | 2017-10-17 | Wolverine Tube, Inc. | Method of producing a liquid cooled coldplate |
US20120026692A1 (en) | 2010-07-28 | 2012-02-02 | Wolverine Tube, Inc. | Electronics substrate with enhanced direct bonded metal |
JP5813300B2 (ja) * | 2010-08-23 | 2015-11-17 | 三桜工業株式会社 | 冷却装置 |
EP2752104B1 (en) | 2011-09-02 | 2022-05-04 | Wieland Microcool, LLC | Enhanced clad metal base plate assembly |
US10161691B2 (en) * | 2012-01-16 | 2018-12-25 | The Boeing Company | Multi-channel cooling plenum |
RU2522181C2 (ru) * | 2012-10-23 | 2014-07-10 | Общество с ограниченной ответственностью "Гамем" (ООО "Гамем") | Жидкостной охладитель |
CN204189458U (zh) | 2012-10-26 | 2015-03-04 | “Rsc技术”封闭式股份公司 | 用于处理单元的冷却设备 |
RU167555U1 (ru) * | 2016-04-20 | 2017-01-10 | Закрытое акционерное общество "РСК Технологии" | Охладитель вычислительных модулей компьютера |
DE212019000273U1 (de) * | 2018-05-01 | 2020-12-09 | Dana Canada Corporation | Wärmetauscher mit Mehrzonen-Wärmeübertragungsfläche |
RU2706511C1 (ru) * | 2019-05-21 | 2019-11-19 | Роман Николаевич Горобец | Двухфазная бесконтактная система охлаждения электронных компонентов |
RU191755U1 (ru) * | 2019-05-21 | 2019-08-21 | Роман Николаевич Горобец | Теплообменник бесконтактной жидкостной системы охлаждения электронных компонентов |
US20220099389A1 (en) * | 2020-09-25 | 2022-03-31 | Abb Power Electronics Inc. | Systems and methods for thermal management using matrix coldplates |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3551758A (en) * | 1969-01-08 | 1970-12-29 | Westinghouse Electric Corp | Fluid cooled heat sink assembly for pressure contacted semiconductor devices |
US3807493A (en) | 1971-09-28 | 1974-04-30 | Kooltronic Fan Co | Heat exchanger using u-tube heat pipes |
US4268850A (en) * | 1979-05-11 | 1981-05-19 | Electric Power Research Institute | Forced vaporization heat sink for semiconductor devices |
JPS61222242A (ja) * | 1985-03-28 | 1986-10-02 | Fujitsu Ltd | 冷却装置 |
GB8811755D0 (en) | 1988-05-18 | 1988-06-22 | Fin Machine Co Ltd | Radiator assembly system |
US4884630A (en) * | 1988-07-14 | 1989-12-05 | Microelectronics And Computer Technology Corporation | End fed liquid heat exchanger for an electronic component |
US5111280A (en) * | 1988-11-10 | 1992-05-05 | Iversen Arthur H | Thermal management of power conditioning systems |
US4884168A (en) * | 1988-12-14 | 1989-11-28 | Cray Research, Inc. | Cooling plate with interboard connector apertures for circuit board assemblies |
CH680179A5 (en) | 1990-03-06 | 1992-06-30 | Siemens Ag Albis | Cooling appts. for electrical or electronic modules - provides at least one heat sink with side surface corresp. to that of module |
US5099311A (en) * | 1991-01-17 | 1992-03-24 | The United States Of America As Represented By The United States Department Of Energy | Microchannel heat sink assembly |
DE69209042T2 (de) | 1991-12-16 | 1996-10-02 | At & T Corp | Wärmeabfuhr durch engkanälige Kühlrippen um elektronisches Hochleistungskomponenten zu kühlen |
JPH07211832A (ja) * | 1994-01-03 | 1995-08-11 | Motorola Inc | 電力放散装置とその製造方法 |
US5453911A (en) * | 1994-02-17 | 1995-09-26 | General Motors Corporation | Device for cooling power electronics |
US5598320A (en) | 1995-03-06 | 1997-01-28 | Ast Research, Inc. | Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices |
US5983997A (en) * | 1996-10-17 | 1999-11-16 | Brazonics, Inc. | Cold plate having uniform pressure drop and uniform flow rate |
-
1997
- 1997-08-08 IT IT97AN000048A patent/IT1297593B1/it active IP Right Grant
- 1997-12-22 US US08/996,030 patent/US6457514B1/en not_active Expired - Fee Related
- 1997-12-23 CA CA002225664A patent/CA2225664A1/en not_active Abandoned
- 1997-12-23 DE DE69730601T patent/DE69730601T2/de not_active Expired - Lifetime
- 1997-12-23 EP EP97830701A patent/EP0903971B1/en not_active Expired - Lifetime
-
1998
- 1998-04-20 JP JP10125347A patent/JPH1168368A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP0903971A1 (en) | 1999-03-24 |
DE69730601D1 (de) | 2004-10-14 |
JPH1168368A (ja) | 1999-03-09 |
DE69730601T2 (de) | 2005-09-29 |
CA2225664A1 (en) | 1999-02-08 |
EP0903971B1 (en) | 2004-09-08 |
ITAN970048A1 (it) | 1999-02-08 |
US6457514B1 (en) | 2002-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted |