DE69730601D1 - Kühlmittel-Verteiler mit für Elektronik-Komponenten selektiv verteilten Kühlspitzen - Google Patents

Kühlmittel-Verteiler mit für Elektronik-Komponenten selektiv verteilten Kühlspitzen

Info

Publication number
DE69730601D1
DE69730601D1 DE69730601T DE69730601T DE69730601D1 DE 69730601 D1 DE69730601 D1 DE 69730601D1 DE 69730601 T DE69730601 T DE 69730601T DE 69730601 T DE69730601 T DE 69730601T DE 69730601 D1 DE69730601 D1 DE 69730601D1
Authority
DE
Germany
Prior art keywords
electronic components
coolant distributor
selectively distributed
cooling tips
tips selectively
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69730601T
Other languages
English (en)
Other versions
DE69730601T2 (de
Inventor
Eugenio Fumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Itelco SpA
Original Assignee
Itelco SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Itelco SpA filed Critical Itelco SpA
Application granted granted Critical
Publication of DE69730601D1 publication Critical patent/DE69730601D1/de
Publication of DE69730601T2 publication Critical patent/DE69730601T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69730601T 1997-08-08 1997-12-23 Kühlmittel-Verteiler mit für Elektronik-Komponenten selektiv verteilten Kühlspitzen Expired - Lifetime DE69730601T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITAN970048 1997-08-08
IT97AN000048A IT1297593B1 (it) 1997-08-08 1997-08-08 Dissipatore per componenti elettronici raffreddato a liquido, dotato di alette dissipatrici disposte in maniera selettiva

Publications (2)

Publication Number Publication Date
DE69730601D1 true DE69730601D1 (de) 2004-10-14
DE69730601T2 DE69730601T2 (de) 2005-09-29

Family

ID=11334117

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69730601T Expired - Lifetime DE69730601T2 (de) 1997-08-08 1997-12-23 Kühlmittel-Verteiler mit für Elektronik-Komponenten selektiv verteilten Kühlspitzen

Country Status (6)

Country Link
US (1) US6457514B1 (de)
EP (1) EP0903971B1 (de)
JP (1) JPH1168368A (de)
CA (1) CA2225664A1 (de)
DE (1) DE69730601T2 (de)
IT (1) IT1297593B1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6639798B1 (en) * 2002-06-24 2003-10-28 Delphi Technologies, Inc. Automotive electronics heat exchanger
US6655449B1 (en) * 2002-11-08 2003-12-02 Cho-Chang Hsien Heat dissipation device by liquid cooling
US20040190253A1 (en) * 2003-03-31 2004-09-30 Ravi Prasher Channeled heat sink and chassis with integrated heat rejector for two-phase cooling
DE102005025381A1 (de) * 2005-05-31 2006-12-07 Behr Industry Gmbh & Co. Kg Vorrichtung zur Kühlung von elekronischen Bauelementen
US7450384B2 (en) * 2006-07-06 2008-11-11 Hybricon Corporation Card cage with parallel flow paths having substantially similar lengths
US20080160070A1 (en) * 2006-12-27 2008-07-03 Nexagen Usa Llc Transdermal vitamin b12 delivery patch
US20080310101A1 (en) * 2007-06-18 2008-12-18 Ivan Pawlenko Double-walled enclosure with improved cooling
RU2516227C2 (ru) * 2009-11-23 2014-05-20 Дженерал Электрик Компани Теплоотвод и блок для плоских корпусов, обеспечивающий охлаждение и компоновку
US10531594B2 (en) 2010-07-28 2020-01-07 Wieland Microcool, Llc Method of producing a liquid cooled coldplate
US20120026692A1 (en) 2010-07-28 2012-02-02 Wolverine Tube, Inc. Electronics substrate with enhanced direct bonded metal
US9795057B2 (en) 2010-07-28 2017-10-17 Wolverine Tube, Inc. Method of producing a liquid cooled coldplate
JP5813300B2 (ja) * 2010-08-23 2015-11-17 三桜工業株式会社 冷却装置
EP2752104B1 (de) 2011-09-02 2022-05-04 Wieland Microcool, LLC Anordnung mit einer verbesserten grundplatte aus verbundmetall
US10161691B2 (en) * 2012-01-16 2018-12-25 The Boeing Company Multi-channel cooling plenum
RU2522181C2 (ru) * 2012-10-23 2014-07-10 Общество с ограниченной ответственностью "Гамем" (ООО "Гамем") Жидкостной охладитель
JP3201784U (ja) 2012-10-26 2016-01-07 ザクリトエ アクツィオネルノエ オプシェストヴォ “アールエスシー テクノロジーズ” コンピュータの演算装置用の冷却装置
RU167555U1 (ru) * 2016-04-20 2017-01-10 Закрытое акционерное общество "РСК Технологии" Охладитель вычислительных модулей компьютера
DE212019000273U1 (de) * 2018-05-01 2020-12-09 Dana Canada Corporation Wärmetauscher mit Mehrzonen-Wärmeübertragungsfläche
RU191755U1 (ru) * 2019-05-21 2019-08-21 Роман Николаевич Горобец Теплообменник бесконтактной жидкостной системы охлаждения электронных компонентов
RU2706511C1 (ru) * 2019-05-21 2019-11-19 Роман Николаевич Горобец Двухфазная бесконтактная система охлаждения электронных компонентов
US20220099389A1 (en) * 2020-09-25 2022-03-31 Abb Power Electronics Inc. Systems and methods for thermal management using matrix coldplates

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3551758A (en) * 1969-01-08 1970-12-29 Westinghouse Electric Corp Fluid cooled heat sink assembly for pressure contacted semiconductor devices
US3807493A (en) 1971-09-28 1974-04-30 Kooltronic Fan Co Heat exchanger using u-tube heat pipes
US4268850A (en) * 1979-05-11 1981-05-19 Electric Power Research Institute Forced vaporization heat sink for semiconductor devices
JPS61222242A (ja) * 1985-03-28 1986-10-02 Fujitsu Ltd 冷却装置
GB8811755D0 (en) 1988-05-18 1988-06-22 Fin Machine Co Ltd Radiator assembly system
US4884630A (en) * 1988-07-14 1989-12-05 Microelectronics And Computer Technology Corporation End fed liquid heat exchanger for an electronic component
US5111280A (en) * 1988-11-10 1992-05-05 Iversen Arthur H Thermal management of power conditioning systems
US4884168A (en) * 1988-12-14 1989-11-28 Cray Research, Inc. Cooling plate with interboard connector apertures for circuit board assemblies
CH680179A5 (en) 1990-03-06 1992-06-30 Siemens Ag Albis Cooling appts. for electrical or electronic modules - provides at least one heat sink with side surface corresp. to that of module
US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
DE69209042T2 (de) 1991-12-16 1996-10-02 At & T Corp Wärmeabfuhr durch engkanälige Kühlrippen um elektronisches Hochleistungskomponenten zu kühlen
JPH07211832A (ja) * 1994-01-03 1995-08-11 Motorola Inc 電力放散装置とその製造方法
US5453911A (en) * 1994-02-17 1995-09-26 General Motors Corporation Device for cooling power electronics
US5598320A (en) 1995-03-06 1997-01-28 Ast Research, Inc. Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices
US5983997A (en) * 1996-10-17 1999-11-16 Brazonics, Inc. Cold plate having uniform pressure drop and uniform flow rate

Also Published As

Publication number Publication date
IT1297593B1 (it) 1999-12-17
DE69730601T2 (de) 2005-09-29
US6457514B1 (en) 2002-10-01
JPH1168368A (ja) 1999-03-09
EP0903971A1 (de) 1999-03-24
EP0903971B1 (de) 2004-09-08
ITAN970048A1 (it) 1999-02-08
CA2225664A1 (en) 1999-02-08

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