DE69828871D1 - Kühlkörpermontageanordnung für oberflächenmontierte elektronische packungen - Google Patents
Kühlkörpermontageanordnung für oberflächenmontierte elektronische packungenInfo
- Publication number
- DE69828871D1 DE69828871D1 DE69828871T DE69828871T DE69828871D1 DE 69828871 D1 DE69828871 D1 DE 69828871D1 DE 69828871 T DE69828871 T DE 69828871T DE 69828871 T DE69828871 T DE 69828871T DE 69828871 D1 DE69828871 D1 DE 69828871D1
- Authority
- DE
- Germany
- Prior art keywords
- assembly
- cooling body
- surface mounted
- mounted electronic
- packs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US955640 | 1997-10-23 | ||
US08/955,640 US5930114A (en) | 1997-10-23 | 1997-10-23 | Heat sink mounting assembly for surface mount electronic device packages |
PCT/US1998/022447 WO1999021402A1 (en) | 1997-10-23 | 1998-10-23 | Heat sink mounting assembly for surface mount electronic device packages |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69828871D1 true DE69828871D1 (de) | 2005-03-10 |
DE69828871T2 DE69828871T2 (de) | 2006-03-30 |
Family
ID=25497122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69828871T Expired - Fee Related DE69828871T2 (de) | 1997-10-23 | 1998-10-23 | Kühlkörpermontageanordnung für oberflächenmontierte elektronische packungen |
Country Status (8)
Country | Link |
---|---|
US (1) | US5930114A (de) |
EP (1) | EP0962123B1 (de) |
JP (1) | JP2001506428A (de) |
KR (1) | KR20000069701A (de) |
CN (1) | CN1251253A (de) |
DE (1) | DE69828871T2 (de) |
TW (1) | TW419935B (de) |
WO (1) | WO1999021402A1 (de) |
Families Citing this family (72)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6178628B1 (en) * | 1997-10-22 | 2001-01-30 | Aavid Thermalloy, Llc | Apparatus and method for direct attachment of heat sink to surface mount |
JP3619670B2 (ja) * | 1998-05-27 | 2005-02-09 | アルプス電気株式会社 | 電子機器 |
US6175500B1 (en) * | 1998-09-22 | 2001-01-16 | Lucent Technologies Inc. | Surface mount thermal connections |
US6412149B1 (en) * | 1999-08-25 | 2002-07-02 | General Electric Company | C-clip for shroud assembly |
US6617685B1 (en) * | 1999-08-30 | 2003-09-09 | Sun Microsystems, Inc. | Clip heat sink assembly |
DE19959023C2 (de) * | 1999-12-08 | 2003-11-13 | Bosch Gmbh Robert | Anbaugehäuse für ein elektrisches Gerät |
US6483169B1 (en) * | 2000-06-28 | 2002-11-19 | Advanced Micro Devices, Inc. | Extruded heat spreader |
US6417563B1 (en) * | 2000-07-14 | 2002-07-09 | Advanced Micro Devices, Inc. | Spring frame for protecting packaged electronic devices |
US6722423B1 (en) * | 2000-09-12 | 2004-04-20 | Wen-Chen Wei | Heat sink |
JP4152575B2 (ja) * | 2000-09-28 | 2008-09-17 | 三菱電機株式会社 | 半導体装置 |
GB0106547D0 (en) * | 2001-03-16 | 2001-05-02 | Aavid Thermalloy Ltd | Heat sinks |
US6496371B2 (en) | 2001-03-30 | 2002-12-17 | Intel Corporation | Heat sink mounting method and apparatus |
US6580167B1 (en) * | 2001-04-20 | 2003-06-17 | Amkor Technology, Inc. | Heat spreader with spring IC package |
US6562655B1 (en) | 2001-04-20 | 2003-05-13 | Amkor Technology, Inc. | Heat spreader with spring IC package fabrication method |
US6707676B1 (en) * | 2002-08-30 | 2004-03-16 | Ehood Geva | Heat sink for automatic assembling |
US20040147169A1 (en) | 2003-01-28 | 2004-07-29 | Allison Jeffrey W. | Power connector with safety feature |
US20050057907A1 (en) * | 2003-09-12 | 2005-03-17 | Hewlett-Packard Development Company, L.P. | Circuit board assembly |
US7345891B2 (en) | 2003-10-07 | 2008-03-18 | Hewlett-Packard Development Company, L.P. | Circuit board assembly |
US7061126B2 (en) | 2003-10-07 | 2006-06-13 | Hewlett-Packard Development Company, L.P. | Circuit board assembly |
US7458839B2 (en) | 2006-02-21 | 2008-12-02 | Fci Americas Technology, Inc. | Electrical connectors having power contacts with alignment and/or restraining features |
KR20060118567A (ko) | 2003-12-31 | 2006-11-23 | 에프씨아이 | 전력 접점과 이를 포함하는 커넥터 |
US20050148230A1 (en) * | 2004-01-07 | 2005-07-07 | Flynn James D. | Coupling device that includes opposing pawls engagable into opposing pawl catches |
US7056144B2 (en) | 2004-02-19 | 2006-06-06 | Hewlett-Packard Development Company, L.P. | Offset compensation system |
US7233497B2 (en) * | 2004-10-06 | 2007-06-19 | Hewlett-Packard Development Company, L.P. | Surface mount heat sink |
US7384289B2 (en) | 2005-01-31 | 2008-06-10 | Fci Americas Technology, Inc. | Surface-mount connector |
US7303427B2 (en) * | 2005-04-05 | 2007-12-04 | Fci Americas Technology, Inc. | Electrical connector with air-circulation features |
US7726982B2 (en) | 2006-06-15 | 2010-06-01 | Fci Americas Technology, Inc. | Electrical connectors with air-circulation features |
US7759169B2 (en) * | 2006-07-11 | 2010-07-20 | Stats Chippac Ltd. | Integrated circuit heat spreader stacking method |
US7742310B2 (en) * | 2006-09-29 | 2010-06-22 | Hewlett-Packard Development Company, L.P. | Sequencer |
US7397666B2 (en) * | 2006-10-25 | 2008-07-08 | Hewlett-Packard Development Company, L.P. | Wedge lock |
FR2913530B1 (fr) * | 2007-03-09 | 2009-06-05 | Accumulateurs Fixes | Terminal electrique pour accumulateur etanche. |
US7905731B2 (en) | 2007-05-21 | 2011-03-15 | Fci Americas Technology, Inc. | Electrical connector with stress-distribution features |
US20080310119A1 (en) * | 2007-06-13 | 2008-12-18 | Tellabs Bedford, Inc. | Clip on heat sink |
US7762857B2 (en) | 2007-10-01 | 2010-07-27 | Fci Americas Technology, Inc. | Power connectors with contact-retention features |
DE102008019797B4 (de) * | 2008-04-18 | 2023-09-21 | Sew-Eurodrive Gmbh & Co Kg | Kühlanordnung und Umrichter |
US8062051B2 (en) | 2008-07-29 | 2011-11-22 | Fci Americas Technology Llc | Electrical communication system having latching and strain relief features |
USD664096S1 (en) | 2009-01-16 | 2012-07-24 | Fci Americas Technology Llc | Vertical electrical connector |
USD608293S1 (en) | 2009-01-16 | 2010-01-19 | Fci Americas Technology, Inc. | Vertical electrical connector |
USD640637S1 (en) | 2009-01-16 | 2011-06-28 | Fci Americas Technology Llc | Vertical electrical connector |
USD606497S1 (en) | 2009-01-16 | 2009-12-22 | Fci Americas Technology, Inc. | Vertical electrical connector |
USD610548S1 (en) | 2009-01-16 | 2010-02-23 | Fci Americas Technology, Inc. | Right-angle electrical connector |
USD619099S1 (en) | 2009-01-30 | 2010-07-06 | Fci Americas Technology, Inc. | Electrical connector |
US8323049B2 (en) | 2009-01-30 | 2012-12-04 | Fci Americas Technology Llc | Electrical connector having power contacts |
US8366485B2 (en) | 2009-03-19 | 2013-02-05 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate |
USD618181S1 (en) | 2009-04-03 | 2010-06-22 | Fci Americas Technology, Inc. | Asymmetrical electrical connector |
USD618180S1 (en) | 2009-04-03 | 2010-06-22 | Fci Americas Technology, Inc. | Asymmetrical electrical connector |
US8477499B2 (en) | 2009-06-05 | 2013-07-02 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
JP5610284B2 (ja) * | 2010-09-28 | 2014-10-22 | 日本電産シンポ株式会社 | 発熱素子の放熱構造 |
US8437138B2 (en) * | 2011-02-25 | 2013-05-07 | Hon Hai Precision Industry Co., Ltd. | Lower profile heat dissipating system embedded with springs |
EP2624034A1 (de) | 2012-01-31 | 2013-08-07 | Fci | Abbaubare optische Kupplungsvorrichtung |
USD727852S1 (en) | 2012-04-13 | 2015-04-28 | Fci Americas Technology Llc | Ground shield for a right angle electrical connector |
US9257778B2 (en) | 2012-04-13 | 2016-02-09 | Fci Americas Technology | High speed electrical connector |
USD718253S1 (en) | 2012-04-13 | 2014-11-25 | Fci Americas Technology Llc | Electrical cable connector |
USD727268S1 (en) | 2012-04-13 | 2015-04-21 | Fci Americas Technology Llc | Vertical electrical connector |
US8944831B2 (en) | 2012-04-13 | 2015-02-03 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate with engagement members |
USD751507S1 (en) | 2012-07-11 | 2016-03-15 | Fci Americas Technology Llc | Electrical connector |
US9543703B2 (en) | 2012-07-11 | 2017-01-10 | Fci Americas Technology Llc | Electrical connector with reduced stack height |
KR101519187B1 (ko) * | 2012-09-07 | 2015-05-11 | 엘지이노텍 주식회사 | 방열부재, 방열회로기판 및 발열소자 패키지 |
USD745852S1 (en) | 2013-01-25 | 2015-12-22 | Fci Americas Technology Llc | Electrical connector |
USD720698S1 (en) | 2013-03-15 | 2015-01-06 | Fci Americas Technology Llc | Electrical cable connector |
US20160057891A1 (en) * | 2013-05-03 | 2016-02-25 | Schneider Electric USA, Inc. | Heat sink and method of assemblying |
CN103429054A (zh) * | 2013-07-24 | 2013-12-04 | 昆山维金五金制品有限公司 | 一种散热片 |
WO2015039341A1 (en) | 2013-09-23 | 2015-03-26 | Tellabs Operations, Inc. | Fixation of heat sink on sfp/xfp cage |
CN104632717B (zh) * | 2013-11-12 | 2017-04-12 | 巨铠实业股份有限公司 | 吊扇控制器置放盒的散热结构 |
EP2946886B1 (de) | 2014-03-28 | 2017-02-22 | Black & Decker Inc. | Elektronisches schalter- und steuerungsmodul für ein elektrowerkzeug |
USD756431S1 (en) * | 2015-05-19 | 2016-05-17 | F. Richard Langner | Robot accessory mount |
US9823718B2 (en) | 2016-01-13 | 2017-11-21 | Microsoft Technology Licensing, Llc | Device cooling |
CN105783567A (zh) * | 2016-03-22 | 2016-07-20 | 周玉翔 | 一种工业用散热装置 |
CN105704985A (zh) * | 2016-03-22 | 2016-06-22 | 深圳市智汇十方科技有限公司 | 一种纳米散热片及制造方法 |
US10541588B2 (en) | 2017-05-24 | 2020-01-21 | Black & Decker Inc. | Electronic power module for a power tool having an integrated heat sink |
EP3633720A1 (de) | 2018-10-05 | 2020-04-08 | Aros Electronics AB | Oberflächenmontierter wärmepuffer |
DE102020106492A1 (de) | 2019-04-12 | 2020-10-15 | Infineon Technologies Ag | Chip -package, verfahren zum bilden eines chip -packages, halbleitervorrichtung, halbleiteranordnung, dreiphasensystem, verfahren zum bilden einer halbleitervorrichtung und verfahren zum bilden einer halbleiteranordnung |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1534883A (en) * | 1976-10-25 | 1978-12-06 | Redpoint Ltd | Socket and heat sink for an electronic component |
US4235285A (en) * | 1979-10-29 | 1980-11-25 | Aavid Engineering, Inc. | Self-fastened heat sinks |
US4625260A (en) * | 1984-08-24 | 1986-11-25 | Thermalloy Incorporated | Fasteners for surface mounting of printed circuit board components |
EP0449150B1 (de) * | 1990-03-26 | 1999-03-03 | Labinal Components And Systems, Inc. | Wärmeübertragungsplatte und integrierter Schaltungschip oder andere elektrische Baugruppen einschliesslich einer derartigen Platte |
US5365399A (en) * | 1992-08-03 | 1994-11-15 | Motorola, Inc. | Heat sinking apparatus for surface mountable power devices |
-
1997
- 1997-10-23 US US08/955,640 patent/US5930114A/en not_active Expired - Fee Related
-
1998
- 1998-10-23 WO PCT/US1998/022447 patent/WO1999021402A1/en active IP Right Grant
- 1998-10-23 DE DE69828871T patent/DE69828871T2/de not_active Expired - Fee Related
- 1998-10-23 TW TW087117555A patent/TW419935B/zh active
- 1998-10-23 JP JP52464399A patent/JP2001506428A/ja active Pending
- 1998-10-23 EP EP98953919A patent/EP0962123B1/de not_active Expired - Lifetime
- 1998-10-23 CN CN98802700A patent/CN1251253A/zh active Pending
- 1998-10-23 KR KR1019997005769A patent/KR20000069701A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
US5930114A (en) | 1999-07-27 |
EP0962123B1 (de) | 2005-02-02 |
CN1251253A (zh) | 2000-04-19 |
EP0962123A4 (de) | 2002-10-02 |
KR20000069701A (ko) | 2000-11-25 |
WO1999021402A9 (en) | 1999-06-24 |
DE69828871T2 (de) | 2006-03-30 |
EP0962123A1 (de) | 1999-12-08 |
TW419935B (en) | 2001-01-21 |
JP2001506428A (ja) | 2001-05-15 |
WO1999021402A1 (en) | 1999-04-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69828871D1 (de) | Kühlkörpermontageanordnung für oberflächenmontierte elektronische packungen | |
DE69821779D1 (de) | Kühlmodul für elektronische bauelemente | |
DE69909252D1 (de) | Bestückungsvorrichtung für elektronische bauteile | |
DE59803852D1 (de) | Trägeranordnung für elektronische baugruppen | |
DE19983799T1 (de) | Einfaches Gehäuse für elektronische Komponenten | |
DE69911078D1 (de) | Elektronische Komponenten | |
DE59504639D1 (de) | Verkapselung für elektronische bauelemente | |
DE69831993D1 (de) | Vorrichtung für elektronische Ausrüstung | |
DE69837988D1 (de) | Elektronische aufhängung für fahrzeug mit rädern | |
DE69830129D1 (de) | Elektronische Planungsgeräte | |
DE69519077D1 (de) | Verpackung für elektronische Komponenten | |
DE69929636D1 (de) | Gehäuse für elektronisches Bauelement | |
DE69938997D1 (de) | Bauteil für die Oberflächenmontage | |
ATE282249T1 (de) | Kühlkörper für elektronische bauelemente | |
DE69837421D1 (de) | Gehaüse für Akkumulator | |
DE69718416D1 (de) | Speisevorrichtung für elektronische Komponenten | |
DE59810941D1 (de) | Elektronische Baugruppe | |
DE69322574T2 (de) | Kühlungsstruktur für elektronische Schaltungspackung | |
DE69827304D1 (de) | Elektronische baugruppe mit kühlelementen für elektronische bauelemente | |
DE69817651D1 (de) | Schalterstruktur für elektronische Vorrichtung | |
DE69524724T2 (de) | Elektronische schaltungspackung | |
DE69804184D1 (de) | Trägerband für elektronische Bauteile | |
DE69500017D1 (de) | Verbinder für integrierte Schaltungspackung | |
DE69813724D1 (de) | Elektronische Steuereinheit für Kraftfahrzeug | |
DE69903270D1 (de) | Stromversorgungen für elektronische steuereinrichtungen |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: CBDL PATENTANWAELTE, 47051 DUISBURG |
|
8339 | Ceased/non-payment of the annual fee |