DE69429949D1 - Kühlapparat für integrierte Schaltungschips - Google Patents

Kühlapparat für integrierte Schaltungschips

Info

Publication number
DE69429949D1
DE69429949D1 DE69429949T DE69429949T DE69429949D1 DE 69429949 D1 DE69429949 D1 DE 69429949D1 DE 69429949 T DE69429949 T DE 69429949T DE 69429949 T DE69429949 T DE 69429949T DE 69429949 D1 DE69429949 D1 DE 69429949D1
Authority
DE
Germany
Prior art keywords
integrated circuit
cooling device
circuit chips
chips
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69429949T
Other languages
English (en)
Other versions
DE69429949T2 (de
Inventor
Minoru Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE69429949D1 publication Critical patent/DE69429949D1/de
Application granted granted Critical
Publication of DE69429949T2 publication Critical patent/DE69429949T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69429949T 1993-06-21 1994-06-20 Kühlapparat für integrierte Schaltungschips Expired - Fee Related DE69429949T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5148740A JP2500757B2 (ja) 1993-06-21 1993-06-21 集積回路の冷却構造

Publications (2)

Publication Number Publication Date
DE69429949D1 true DE69429949D1 (de) 2002-04-04
DE69429949T2 DE69429949T2 (de) 2002-06-27

Family

ID=15459567

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69429949T Expired - Fee Related DE69429949T2 (de) 1993-06-21 1994-06-20 Kühlapparat für integrierte Schaltungschips

Country Status (5)

Country Link
US (1) US5465192A (de)
EP (1) EP0630046B1 (de)
JP (1) JP2500757B2 (de)
CA (1) CA2126291C (de)
DE (1) DE69429949T2 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
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US5802707A (en) * 1996-03-28 1998-09-08 Intel Corporation Controlled bondline thickness attachment mechanism
US5907473A (en) * 1997-04-04 1999-05-25 Raytheon Company Environmentally isolated enclosure for electronic components
US6459581B1 (en) 2000-12-19 2002-10-01 Harris Corporation Electronic device using evaporative micro-cooling and associated methods
SE524204C2 (sv) * 2001-07-19 2004-07-06 Denso Corp Värmeansamlare med ett membran vilket tar emot ett fluidtryck
US20030033398A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for generating and using configuration policies
US20030033346A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for managing multiple resources in a system
US7252139B2 (en) * 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
US7133907B2 (en) * 2001-10-18 2006-11-07 Sun Microsystems, Inc. Method, system, and program for configuring system resources
US6965559B2 (en) * 2001-10-19 2005-11-15 Sun Microsystems, Inc. Method, system, and program for discovering devices communicating through a switch
US7103889B2 (en) 2002-07-23 2006-09-05 Sun Microsystems, Inc. Method, system, and article of manufacture for agent processing
US20040024887A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for generating information on components within a network
US7143615B2 (en) * 2002-07-31 2006-12-05 Sun Microsystems, Inc. Method, system, and program for discovering components within a network
US6953227B2 (en) * 2002-12-05 2005-10-11 Sun Microsystems, Inc. High-power multi-device liquid cooling
US20040215764A1 (en) * 2003-04-23 2004-10-28 Sun Microsystems, Inc. Method, system, and program for rendering a visualization of aggregations of network devices
US7327578B2 (en) * 2004-02-06 2008-02-05 Sun Microsystems, Inc. Cooling failure mitigation for an electronics enclosure
US20050241803A1 (en) * 2004-04-29 2005-11-03 Hewlett-Packard Development Company, L.P. Liquid cooling loop using tubing and bellows for stress isolation and tolerance variation
US7159645B1 (en) * 2004-06-01 2007-01-09 Lockheed Martin Corporation Low torque inner gimbal heat remover
US7187549B2 (en) * 2004-06-30 2007-03-06 Teradyne, Inc. Heat exchange apparatus with parallel flow
US7212406B2 (en) * 2004-09-01 2007-05-01 Rockwell Automation Technologies, Inc. Cooling of electrical components with split-flow closed-end devices
JP4333587B2 (ja) * 2005-01-14 2009-09-16 三菱電機株式会社 ヒートシンクおよび冷却ユニット
US7515418B2 (en) * 2005-09-26 2009-04-07 Curtiss-Wright Controls, Inc. Adjustable height liquid cooler in liquid flow through plate
US8363413B2 (en) * 2010-09-13 2013-01-29 Raytheon Company Assembly to provide thermal cooling
US9472487B2 (en) * 2012-04-02 2016-10-18 Raytheon Company Flexible electronic package integrated heat exchanger with cold plate and risers
GB2543549B (en) * 2015-10-21 2020-04-15 Andor Tech Limited Thermoelectric Heat pump system
US10856446B2 (en) * 2018-02-08 2020-12-01 Juniper Networks, Inc. Cooling for slot mounted electrical modules
WO2020217285A1 (ja) * 2019-04-22 2020-10-29 三菱電機株式会社 電子機器
TWM592991U (zh) * 2019-12-06 2020-04-01 訊凱國際股份有限公司 液冷式散熱裝置
US11393807B2 (en) 2020-03-11 2022-07-19 Peter C. Salmon Densely packed electronic systems
US11546991B2 (en) 2020-03-11 2023-01-03 Peter C. Salmon Densely packed electronic systems
US10966338B1 (en) 2020-03-11 2021-03-30 Peter C. Salmon Densely packed electronic systems
CN114650698A (zh) * 2020-12-21 2022-06-21 中兴通讯股份有限公司 散热装置和电子设备
EP4025024A1 (de) * 2021-01-04 2022-07-06 Aptiv Technologies Limited Kühlvorrichtung und verfahren zur herstellung davon
US11934213B2 (en) * 2021-02-18 2024-03-19 Asia Vital Components (China) Co., Ltd. Liquid-cooling device
US11641727B2 (en) * 2021-03-23 2023-05-02 Hewlett Packard Enterprise Development Lp Cooling system for an electronic circuit module
US11523543B1 (en) 2022-02-25 2022-12-06 Peter C. Salmon Water cooled server
US11445640B1 (en) 2022-02-25 2022-09-13 Peter C. Salmon Water cooled server

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU917371A1 (ru) * 1980-08-22 1982-03-30 Предприятие П/Я Г-4371 Устройство дл охлаждени элементов радиоаппаратуры
JPS582049A (ja) * 1981-06-29 1983-01-07 Nippon Telegr & Teleph Corp <Ntt> 半導体パツケ−ジ
JPH0673364B2 (ja) * 1983-10-28 1994-09-14 株式会社日立製作所 集積回路チップ冷却装置
US4791983A (en) * 1987-10-13 1988-12-20 Unisys Corporation Self-aligning liquid-cooling assembly
JP2786193B2 (ja) * 1987-10-26 1998-08-13 株式会社日立製作所 半導体冷却装置
DE68918156T2 (de) * 1988-05-09 1995-01-12 Nippon Electric Co Flache Kühlungsstruktur für integrierte Schaltung.
US4882654A (en) * 1988-12-22 1989-11-21 Microelectronics And Computer Technology Corporation Method and apparatus for adjustably mounting a heat exchanger for an electronic component
US5050036A (en) * 1989-10-24 1991-09-17 Amdahl Corporation Liquid cooled integrated circuit assembly
JPH03215968A (ja) * 1990-01-22 1991-09-20 Hitachi Ltd 半導体冷却装置
CA2072377A1 (en) * 1991-07-12 1993-01-13 Masanori Nishiguchi Semiconductor chip module and method of manufacturing the same
US5166863A (en) * 1991-07-15 1992-11-24 Amdahl Corporation Liquid-cooled assembly of heat-generating devices and method for assembling and disassembling
JP2852148B2 (ja) * 1991-10-21 1999-01-27 日本電気株式会社 集積回路パッケージの冷却構造
JP2792304B2 (ja) * 1992-01-22 1998-09-03 日本電気株式会社 集積回路用冷却装置
JP2745948B2 (ja) * 1992-04-06 1998-04-28 日本電気株式会社 集積回路の冷却構造

Also Published As

Publication number Publication date
EP0630046A3 (de) 1995-05-17
CA2126291A1 (en) 1994-12-22
EP0630046B1 (de) 2002-02-27
JP2500757B2 (ja) 1996-05-29
CA2126291C (en) 1998-10-13
US5465192A (en) 1995-11-07
JPH07142656A (ja) 1995-06-02
DE69429949T2 (de) 2002-06-27
EP0630046A2 (de) 1994-12-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee