JP2019513290A - 基板を真空処理するための装置、基板を真空処理するためのシステム、及び、真空チャンバ内で基板キャリアとマスクキャリアを搬送するための方法 - Google Patents
基板を真空処理するための装置、基板を真空処理するためのシステム、及び、真空チャンバ内で基板キャリアとマスクキャリアを搬送するための方法 Download PDFInfo
- Publication number
- JP2019513290A JP2019513290A JP2018515207A JP2018515207A JP2019513290A JP 2019513290 A JP2019513290 A JP 2019513290A JP 2018515207 A JP2018515207 A JP 2018515207A JP 2018515207 A JP2018515207 A JP 2018515207A JP 2019513290 A JP2019513290 A JP 2019513290A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- carrier
- mask
- actuator
- alignment system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 241
- 238000000034 method Methods 0.000 title claims description 26
- 238000000926 separation method Methods 0.000 claims abstract description 27
- 230000003068 static effect Effects 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 4
- 238000000151 deposition Methods 0.000 description 29
- 230000008021 deposition Effects 0.000 description 27
- 239000000463 material Substances 0.000 description 23
- 230000007246 mechanism Effects 0.000 description 21
- 238000001704 evaporation Methods 0.000 description 15
- 230000008020 evaporation Effects 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000002955 isolation Methods 0.000 description 9
- 239000011368 organic material Substances 0.000 description 8
- 239000000969 carrier Substances 0.000 description 7
- 230000014759 maintenance of location Effects 0.000 description 7
- 238000000429 assembly Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 4
- 238000005339 levitation Methods 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000007717 exclusion Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 229920001746 electroactive polymer Polymers 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 etc.) Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Non-Mechanical Conveyors (AREA)
Abstract
Description
Claims (18)
- 基板を処理するための装置であって、
真空チャンバと、
前記真空チャンバ内の基板搬送アセンブリと、
前記真空チャンバ内のマスク搬送アセンブリと、
位置合わせシステムであって、前記真空チャンバ内のアクチュエータ、及び、
前記アクチュエータと前記真空チャンバとの間の機械的分離素子を備える、位置合わせシステムとを備える、装置。 - 前記位置合わせシステムがフレームに装着される、請求項1に記載の装置。
- 前記位置合わせシステムが、
基板キャリアを前記位置合わせシステムに装着するための第1マウントと、マスクキャリアを前記位置合わせシステムに装着するための第2マウントとを備える、請求項1又は2に記載の装置。 - 前記アクチュエータが、前記機械的分離素子と前記第1マウントとの間の機械的接続経路内に提供され、かつ、前記機械的分離素子と前記第2マウントとの間の機械的接続経路内に提供される、請求項3に記載の装置。
- 前記アクチュエータが、前記第1マウントと前記第2マウントとを互いに対して動かすよう構成される、請求項3又は4に記載の装置。
- 前記アクチュエータが、前記第1マウント及び前記第2マウントに接続され、かつ、前記第1マウントと前記第2マウントとの間に提供される、請求項3から5のいずれか一項に記載の装置。
- 前記第1マウントと前記第2マウントの少なくとも一方が磁気固定デバイスを備える、請求項3から6のいずれか一項に記載の装置。
- 前記磁気固定デバイスが電磁石又は永久電磁石の少なくとも一方を備える、請求項7に記載の装置。
- 前記アクチュエータが、ステッパアクチュエータ、ブラシレスアクチュエータ、DC(直流電流)アクチュエータ、ボイスコイルアクチュエータ、空気圧アクチュエータ、及び圧電アクチュエータからなる群から選択される、請求項1から8のいずれか一項に記載の装置。
- 前記位置合わせシステムの少なくとも一部分が、前記マスク搬送アセンブリと前記基板搬送アセンブリとの間に提供される、請求項1から9のいずれか一項に記載の装置。
- 第1マウントと第2マウントの少なくとも一方が、前記マスク搬送アセンブリと前記基板搬送アセンブリとの間に提供される、請求項10に記載の装置。
- 前記第1マウントと前記第2マウントとが、前記アクチュエータを介して機械的に接続される、請求項10又は11に記載の装置。
- 前記機械的分離素子が、振動ダンパ、揺動ダンパ、ブッシング、ゴム製ブッシング、及び、能動的な機械的補償素子のうちの少なくとも1つである、請求項1から12のいずれか一項に記載の装置。
- 基板を処理するためのシステムであって、
請求項1から13のいずれか一項に記載の前記装置と、
前記基板搬送アセンブリに提供された基板キャリアと、
前記マスク搬送アセンブリに提供されたマスクキャリアとを備える、システム。 - 前記基板搬送アセンブリが前記基板キャリアを非接触搬送するよう構成され、前記マスク搬送アセンブリが前記マスクキャリアを非接触搬送するよう構成される、請求項14に記載のシステム。
- チャンバ内で基板キャリアとマスクキャリアとを位置合わせするための方法であって、
前記真空チャンバ内で、一又は複数のアクチュエータを備える位置合わせシステムを用いて、前記基板キャリアと前記マスクキャリアとを互いに対して位置合わせすることと、
前記真空チャンバから前記アクチュエータに伝わる機械的ノイズ、動的変形、及び静的変形のうちの少なくとも1つを補償するか又は低減させることとを含む、方法。 - 前記マスクキャリアを前記アクチュエータに装着することと、
前記基板キャリアを前記アクチュエータに装着することとを更に含み、前記マスクキャリアと前記基板キャリアとの間の直接的な機械的接続経路が前記アクチュエータを介して提供される、請求項16に記載の方法。 - 基板搬送アセンブリで、前記基板キャリアを非接触搬送することと、
マスク搬送アセンブリで、前記基板キャリアを非接触搬送することと、
前記基板搬送アセンブリと前記マスク搬送アセンブリの少なくとも一方を用いて、前記基板キャリアと前記マスクキャリアとを互いに対して位置合わせすることとを更に含む、請求項16又は17に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EPPCT/EP2017/056383 | 2017-03-17 | ||
EP2017056383 | 2017-03-17 | ||
PCT/EP2017/058828 WO2018166636A1 (en) | 2017-03-17 | 2017-04-12 | Apparatus for vacuum processing of a substrate, system for vacuum processing of a substrate, and method for transportation of a substrate carrier and a mask carrier in a vacuum chamber |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020051962A Division JP2020123726A (ja) | 2017-03-17 | 2020-03-24 | 基板を真空処理するための装置、基板を真空処理するためのシステム、及び、真空チャンバ内で基板キャリアとマスクキャリアを搬送するための方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019513290A true JP2019513290A (ja) | 2019-05-23 |
JP6681977B2 JP6681977B2 (ja) | 2020-04-15 |
Family
ID=58578934
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018515207A Active JP6681977B2 (ja) | 2017-03-17 | 2017-04-12 | 基板を真空処理するための装置、基板を真空処理するためのシステム、及び、真空チャンバ内で基板キャリアとマスクキャリアを搬送するための方法 |
JP2020051962A Pending JP2020123726A (ja) | 2017-03-17 | 2020-03-24 | 基板を真空処理するための装置、基板を真空処理するためのシステム、及び、真空チャンバ内で基板キャリアとマスクキャリアを搬送するための方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020051962A Pending JP2020123726A (ja) | 2017-03-17 | 2020-03-24 | 基板を真空処理するための装置、基板を真空処理するためのシステム、及び、真空チャンバ内で基板キャリアとマスクキャリアを搬送するための方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20200251691A1 (ja) |
JP (2) | JP6681977B2 (ja) |
KR (2) | KR102232306B1 (ja) |
CN (1) | CN109075114A (ja) |
TW (2) | TW201836053A (ja) |
WO (1) | WO2018166636A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021015224A1 (ja) * | 2019-07-23 | 2021-01-28 | キヤノントッキ株式会社 | アライメント機構、アライメント方法、成膜装置及び成膜方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6735350B2 (ja) * | 2017-08-24 | 2020-08-05 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 真空処理システムにおけるデバイスの非接触搬送用の装置及び方法 |
KR20200017381A (ko) * | 2018-08-06 | 2020-02-18 | 어플라이드 머티어리얼스, 인코포레이티드 | 마스크 정렬기를 갖는 증착 장치, 기판을 마스킹하기 위한 마스크 어레인지먼트, 및 기판을 마스킹하기 위한 방법 |
KR20210057117A (ko) * | 2018-10-22 | 2021-05-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 재료 증착 장치, 진공 증착 시스템, 및 대면적 기판을 프로세싱하는 방법 |
KR102182471B1 (ko) * | 2019-01-11 | 2020-11-24 | 캐논 톡키 가부시키가이샤 | 성막장치 및 전자 디바이스 제조장치 |
JP7220136B2 (ja) * | 2019-01-11 | 2023-02-09 | キヤノントッキ株式会社 | 成膜装置及び電子デバイスの製造装置 |
CN110164808B (zh) * | 2019-05-15 | 2022-03-25 | 云谷(固安)科技有限公司 | 掩膜板的搬运装置以及搬运方法 |
US11538706B2 (en) | 2019-05-24 | 2022-12-27 | Applied Materials, Inc. | System and method for aligning a mask with a substrate |
US11189516B2 (en) | 2019-05-24 | 2021-11-30 | Applied Materials, Inc. | Method for mask and substrate alignment |
US10916464B1 (en) | 2019-07-26 | 2021-02-09 | Applied Materials, Inc. | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency |
US11196360B2 (en) | 2019-07-26 | 2021-12-07 | Applied Materials, Inc. | System and method for electrostatically chucking a substrate to a carrier |
US11756816B2 (en) | 2019-07-26 | 2023-09-12 | Applied Materials, Inc. | Carrier FOUP and a method of placing a carrier |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003224066A (ja) * | 2001-11-26 | 2003-08-08 | Tokyo Electron Ltd | 塗布膜形成装置 |
US20100322754A1 (en) * | 2009-06-23 | 2010-12-23 | Sang Don Lee | Apparatus for Substrate Alignment, Apparatus for Substrate Processing Having the Same, and Substrate Alignment Method |
JP2011195907A (ja) * | 2010-03-19 | 2011-10-06 | Tokyo Electron Ltd | マスク保持装置及び薄膜形成装置 |
WO2015113861A1 (en) * | 2014-01-31 | 2015-08-06 | Asml Netherlands Bv | Stage positioning system and lithographic apparatus |
WO2016091303A1 (en) * | 2014-12-10 | 2016-06-16 | Applied Materials, Inc. | Mask arrangement for masking a substrate in a processing chamber |
WO2016112951A1 (en) * | 2015-01-12 | 2016-07-21 | Applied Materials, Inc. | Holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber, apparatus for depositing a layer on a substrate, and method for aligning a substrate carrier supporting a substrate and a mask carrier |
JP2017506703A (ja) * | 2014-02-04 | 2017-03-09 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | キャリアによって支持された基板上に一又は複数の層を堆積させるためのシステム、及び当該システムを使用する方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10112433A (ja) * | 1996-10-04 | 1998-04-28 | Nikon Corp | 除振装置及び露光装置 |
TWI282909B (en) * | 1999-12-23 | 2007-06-21 | Asml Netherlands Bv | Lithographic apparatus and a method for manufacturing a device |
US6811613B2 (en) * | 2001-11-26 | 2004-11-02 | Tokyo Electron Limited | Coating film forming apparatus |
JP4471708B2 (ja) * | 2004-03-31 | 2010-06-02 | キヤノンアネルバ株式会社 | 基板搬送装置 |
EP3098835B1 (en) * | 2004-06-21 | 2017-07-26 | Nikon Corporation | Exposure apparatus, exposure method and device manufacturing method |
JP2010106359A (ja) * | 2008-09-30 | 2010-05-13 | Canon Anelva Corp | 基板保持装置、基板処理装置、マスク、および画像表示装置の製造方法 |
NL2005701A (en) * | 2009-12-22 | 2011-06-23 | Asml Netherlands Bv | Active mount, lithographic apparatus comprising such active mount and method for tuning such active mount. |
JP5783811B2 (ja) * | 2010-07-06 | 2015-09-24 | キヤノン株式会社 | 成膜装置 |
JP5639431B2 (ja) * | 2010-09-30 | 2014-12-10 | キヤノントッキ株式会社 | 成膜装置 |
JP2012140671A (ja) * | 2010-12-28 | 2012-07-26 | Canon Tokki Corp | 成膜装置 |
CN103597625B (zh) * | 2011-06-17 | 2017-07-11 | 应用材料公司 | 用于有机发光二极管处理的化学气相沉积掩模对准 |
KR20130009563A (ko) * | 2011-07-13 | 2013-01-23 | 주식회사 원익아이피에스 | 진공처리장치 |
US8597982B2 (en) * | 2011-10-31 | 2013-12-03 | Nordson Corporation | Methods of fabricating electronics assemblies |
US9640372B2 (en) * | 2012-11-15 | 2017-05-02 | Applied Materials, Inc. | Method and system for maintaining an edge exclusion shield |
JP6084440B2 (ja) * | 2012-11-16 | 2017-02-22 | 株式会社アルバック | 基板処理装置のアライメント機構 |
JP6133128B2 (ja) * | 2013-05-23 | 2017-05-24 | 株式会社アルバック | 真空処理装置、制振装置 |
DE102015201096A1 (de) * | 2015-01-22 | 2016-07-28 | Carl Zeiss Smt Gmbh | Anordnung zur Halterung eines Bauteils in einer Lithographieanlage sowie Lithographieanlage |
-
2017
- 2017-04-12 US US15/761,064 patent/US20200251691A1/en not_active Abandoned
- 2017-04-12 JP JP2018515207A patent/JP6681977B2/ja active Active
- 2017-04-12 WO PCT/EP2017/058828 patent/WO2018166636A1/en active Application Filing
- 2017-04-12 KR KR1020207013453A patent/KR102232306B1/ko active IP Right Grant
- 2017-04-12 CN CN201780006944.1A patent/CN109075114A/zh active Pending
- 2017-04-12 KR KR1020187010122A patent/KR102111722B1/ko active IP Right Grant
-
2018
- 2018-03-15 TW TW107108883A patent/TW201836053A/zh unknown
- 2018-03-15 TW TW107115082A patent/TWI671848B/zh not_active IP Right Cessation
-
2020
- 2020-03-24 JP JP2020051962A patent/JP2020123726A/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003224066A (ja) * | 2001-11-26 | 2003-08-08 | Tokyo Electron Ltd | 塗布膜形成装置 |
US20100322754A1 (en) * | 2009-06-23 | 2010-12-23 | Sang Don Lee | Apparatus for Substrate Alignment, Apparatus for Substrate Processing Having the Same, and Substrate Alignment Method |
JP2011195907A (ja) * | 2010-03-19 | 2011-10-06 | Tokyo Electron Ltd | マスク保持装置及び薄膜形成装置 |
WO2015113861A1 (en) * | 2014-01-31 | 2015-08-06 | Asml Netherlands Bv | Stage positioning system and lithographic apparatus |
JP2017506703A (ja) * | 2014-02-04 | 2017-03-09 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | キャリアによって支持された基板上に一又は複数の層を堆積させるためのシステム、及び当該システムを使用する方法 |
WO2016091303A1 (en) * | 2014-12-10 | 2016-06-16 | Applied Materials, Inc. | Mask arrangement for masking a substrate in a processing chamber |
WO2016112951A1 (en) * | 2015-01-12 | 2016-07-21 | Applied Materials, Inc. | Holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber, apparatus for depositing a layer on a substrate, and method for aligning a substrate carrier supporting a substrate and a mask carrier |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021015224A1 (ja) * | 2019-07-23 | 2021-01-28 | キヤノントッキ株式会社 | アライメント機構、アライメント方法、成膜装置及び成膜方法 |
JPWO2021015224A1 (ja) * | 2019-07-23 | 2021-01-28 | ||
JP7191229B2 (ja) | 2019-07-23 | 2022-12-16 | キヤノントッキ株式会社 | アライメント機構、アライメント方法、成膜装置及び成膜方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20180132596A (ko) | 2018-12-12 |
KR102111722B1 (ko) | 2020-05-15 |
TW201836054A (zh) | 2018-10-01 |
TW201836053A (zh) | 2018-10-01 |
JP2020123726A (ja) | 2020-08-13 |
WO2018166636A1 (en) | 2018-09-20 |
TWI671848B (zh) | 2019-09-11 |
JP6681977B2 (ja) | 2020-04-15 |
KR20200053658A (ko) | 2020-05-18 |
US20200251691A1 (en) | 2020-08-06 |
KR102232306B1 (ko) | 2021-03-24 |
CN109075114A (zh) | 2018-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6681977B2 (ja) | 基板を真空処理するための装置、基板を真空処理するためのシステム、及び、真空チャンバ内で基板キャリアとマスクキャリアを搬送するための方法 | |
KR102161185B1 (ko) | 기판의 진공 프로세싱을 위한 장치, 기판의 진공 프로세싱을 위한 시스템, 및 진공 챔버에서의 기판 캐리어 및 마스크 캐리어의 운송을 위한 방법 | |
JP6602465B2 (ja) | 基板キャリア及びマスクキャリアの位置決め装置、基板キャリア及びマスクキャリアの搬送システム、並びにそのための方法 | |
CN110573646B (zh) | 用于在真空腔室中的载体对准的设备和在真空腔室中对准载体的真空系统及方法 | |
WO2017198298A1 (en) | Apparatus and method for transport | |
KR102107973B1 (ko) | 진공 챔버 내의 기판을 프로세싱하기 위한 장치 및 시스템, 및 마스크 캐리어에 대해 기판 캐리어를 정렬하는 방법 | |
US20210335640A1 (en) | Holding device for holding a carrier or a component in a vacuum chamber, use of a holding device for holding a carrier or a component in a vacuum chamber, apparatus for handling a carrier in a vacuum chamber, and vacuum deposition system | |
TWI678421B (zh) | 真空腔室內加工基板之設備和系統及真空腔室內運輸載體之方法 | |
KR102167534B1 (ko) | 진공 챔버에서의 캐리어 정렬을 위한 장치 및 진공 시스템, 및 캐리어의 정렬 방법 | |
KR20190116968A (ko) | 진공 챔버에서 캐리어를 핸들링하기 위한 장치, 진공 증착 시스템, 및 진공 챔버에서 캐리어를 핸들링하는 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180529 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180529 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190611 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20190903 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191111 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200225 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200324 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6681977 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |