JP2019511111A5 - - Google Patents

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Publication number
JP2019511111A5
JP2019511111A5 JP2018541108A JP2018541108A JP2019511111A5 JP 2019511111 A5 JP2019511111 A5 JP 2019511111A5 JP 2018541108 A JP2018541108 A JP 2018541108A JP 2018541108 A JP2018541108 A JP 2018541108A JP 2019511111 A5 JP2019511111 A5 JP 2019511111A5
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JP
Japan
Prior art keywords
wafer support
semiconductor processing
processing apparatus
support assembly
module
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JP2018541108A
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English (en)
Japanese (ja)
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JP6971991B2 (ja
JP2019511111A (ja
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Priority claimed from PCT/US2017/016975 external-priority patent/WO2017139353A1/en
Publication of JP2019511111A publication Critical patent/JP2019511111A/ja
Publication of JP2019511111A5 publication Critical patent/JP2019511111A5/ja
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Publication of JP6971991B2 publication Critical patent/JP6971991B2/ja
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JP2018541108A 2016-02-08 2017-02-08 回転式ウェーハ支持組立体のための温度感知システム Active JP6971991B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662292614P 2016-02-08 2016-02-08
US62/292,614 2016-02-08
PCT/US2017/016975 WO2017139353A1 (en) 2016-02-08 2017-02-08 Temperature sensing system for rotatable wafer support assembly

Publications (3)

Publication Number Publication Date
JP2019511111A JP2019511111A (ja) 2019-04-18
JP2019511111A5 true JP2019511111A5 (enExample) 2020-03-12
JP6971991B2 JP6971991B2 (ja) 2021-11-24

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ID=58094524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018541108A Active JP6971991B2 (ja) 2016-02-08 2017-02-08 回転式ウェーハ支持組立体のための温度感知システム

Country Status (7)

Country Link
US (1) US20170229331A1 (enExample)
EP (1) EP3414541B1 (enExample)
JP (1) JP6971991B2 (enExample)
KR (1) KR20180114088A (enExample)
CN (1) CN108885139A (enExample)
TW (1) TWI636519B (enExample)
WO (1) WO2017139353A1 (enExample)

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KR102638073B1 (ko) * 2018-03-06 2024-02-20 도쿄엘렉트론가부시키가이샤 액 처리 장치 및 액 처리 방법
CN112689887B (zh) * 2018-09-18 2024-09-27 株式会社国际电气 基板温度传感器、基板保持件、基板处理装置以及半导体装置的制造方法
CN110707035A (zh) * 2019-10-16 2020-01-17 北京北方华创微电子装备有限公司 静电卡盘、半导体处理腔室及设备
FR3103314B1 (fr) * 2019-11-14 2021-10-08 Safran Electronics & Defense Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant
JP7411431B2 (ja) * 2020-01-31 2024-01-11 新光電気工業株式会社 静電チャック、基板固定装置
DE102020007791A1 (de) * 2020-12-18 2022-06-23 Att Advanced Temperature Test Systems Gmbh Modulares Wafer-Chuck-System
TWI755996B (zh) * 2020-12-24 2022-02-21 天虹科技股份有限公司 用以產生均勻溫度的晶圓承載盤及應用該晶圓承載盤的薄膜沉積裝置
AT526503B1 (de) 2022-12-15 2024-04-15 Sensideon Gmbh Vorrichtung zur in-situ Oberflächentemperaturmessung von Beschichtungsobjekten in einem Gasphasenabscheidungsverfahren
CN116005136A (zh) * 2023-01-16 2023-04-25 深圳市原速光电科技有限公司 原子层沉积设备

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JP2002343696A (ja) * 2001-05-11 2002-11-29 Tokyo Electron Ltd 基板の処理装置
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