JP6971991B2 - 回転式ウェーハ支持組立体のための温度感知システム - Google Patents

回転式ウェーハ支持組立体のための温度感知システム Download PDF

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Publication number
JP6971991B2
JP6971991B2 JP2018541108A JP2018541108A JP6971991B2 JP 6971991 B2 JP6971991 B2 JP 6971991B2 JP 2018541108 A JP2018541108 A JP 2018541108A JP 2018541108 A JP2018541108 A JP 2018541108A JP 6971991 B2 JP6971991 B2 JP 6971991B2
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Prior art keywords
wafer support
semiconductor processing
support assembly
processing apparatus
shaft
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Japanese (ja)
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JP2019511111A5 (enExample
JP2019511111A (ja
Inventor
モハンマド ノスラチ，
ティモシー， ビー． トンプキンス，
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ワトロー エレクトリック マニュファクチュアリング カンパニー
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02—Means for indicating or recording specially adapted for thermometers
    • G01K1/024—Means for indicating or recording specially adapted for thermometers for remote indication
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2018541108A 2016-02-08 2017-02-08 回転式ウェーハ支持組立体のための温度感知システム Active JP6971991B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662292614P 2016-02-08 2016-02-08
US62/292,614 2016-02-08
PCT/US2017/016975 WO2017139353A1 (en) 2016-02-08 2017-02-08 Temperature sensing system for rotatable wafer support assembly

Publications (3)

Publication Number Publication Date
JP2019511111A JP2019511111A (ja) 2019-04-18
JP2019511111A5 JP2019511111A5 (enExample) 2020-03-12
JP6971991B2 true JP6971991B2 (ja) 2021-11-24

Family

ID=58094524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018541108A Active JP6971991B2 (ja) 2016-02-08 2017-02-08 回転式ウェーハ支持組立体のための温度感知システム

Country Status (7)

Country Link
US (1) US20170229331A1 (enExample)
EP (1) EP3414541B1 (enExample)
JP (1) JP6971991B2 (enExample)
KR (1) KR20180114088A (enExample)
CN (1) CN108885139A (enExample)
TW (1) TWI636519B (enExample)
WO (1) WO2017139353A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102638073B1 (ko) * 2018-03-06 2024-02-20 도쿄엘렉트론가부시키가이샤 액 처리 장치 및 액 처리 방법
CN112689887B (zh) * 2018-09-18 2024-09-27 株式会社国际电气 基板温度传感器、基板保持件、基板处理装置以及半导体装置的制造方法
CN110707035A (zh) * 2019-10-16 2020-01-17 北京北方华创微电子装备有限公司 静电卡盘、半导体处理腔室及设备
FR3103314B1 (fr) * 2019-11-14 2021-10-08 Safran Electronics & Defense Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant
JP7411431B2 (ja) * 2020-01-31 2024-01-11 新光電気工業株式会社 静電チャック、基板固定装置
DE102020007791A1 (de) * 2020-12-18 2022-06-23 Att Advanced Temperature Test Systems Gmbh Modulares Wafer-Chuck-System
TWI755996B (zh) * 2020-12-24 2022-02-21 天虹科技股份有限公司 用以產生均勻溫度的晶圓承載盤及應用該晶圓承載盤的薄膜沉積裝置
AT526503B1 (de) 2022-12-15 2024-04-15 Sensideon Gmbh Vorrichtung zur in-situ Oberflächentemperaturmessung von Beschichtungsobjekten in einem Gasphasenabscheidungsverfahren
CN116005136A (zh) * 2023-01-16 2023-04-25 深圳市原速光电科技有限公司 原子层沉积设备

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TW594455B (en) * 2001-04-19 2004-06-21 Onwafer Technologies Inc Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control
US20050211385A1 (en) * 2001-04-30 2005-09-29 Lam Research Corporation, A Delaware Corporation Method and apparatus for controlling spatial temperature distribution
JP2002343696A (ja) * 2001-05-11 2002-11-29 Tokyo Electron Ltd 基板の処理装置
DE10207901A1 (de) * 2002-02-22 2003-09-04 Aixtron Ag Vorrichtung zum Abschneiden dünner Schichten mit drahtloser Prozessparameter-Aufnahme
US20050092246A1 (en) * 2002-02-22 2005-05-05 Peter Baumann Device for depositing thin layers with a wireless detection of process parameters
JP2004111630A (ja) * 2002-09-18 2004-04-08 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP2004207687A (ja) * 2002-12-10 2004-07-22 Sharp Corp 半導体製造装置とそれを用いた半導体製造方法
JP2004334622A (ja) * 2003-05-09 2004-11-25 Hakko Electric Mach Works Co Ltd 環境情報測定装置及びこれを用いた温度制御システム
US7630855B2 (en) * 2004-08-31 2009-12-08 Watlow Electric Manufacturing Company Method of temperature sensing
US20070095160A1 (en) * 2005-11-03 2007-05-03 The Boeing Company Structural assessment and monitoring system and associated method
US7826724B2 (en) * 2006-04-24 2010-11-02 Nordson Corporation Electronic substrate non-contact heating system and method
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Also Published As

Publication number Publication date
US20170229331A1 (en) 2017-08-10
JP2019511111A (ja) 2019-04-18
WO2017139353A1 (en) 2017-08-17
EP3414541B1 (en) 2020-09-30
TWI636519B (zh) 2018-09-21
EP3414541A1 (en) 2018-12-19
CN108885139A (zh) 2018-11-23
KR20180114088A (ko) 2018-10-17
TW201735216A (zh) 2017-10-01

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