CN108885139A - 用于可旋转晶圆支承组件的温度感测系统 - Google Patents

用于可旋转晶圆支承组件的温度感测系统 Download PDF

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Publication number
CN108885139A
CN108885139A CN201780009778.0A CN201780009778A CN108885139A CN 108885139 A CN108885139 A CN 108885139A CN 201780009778 A CN201780009778 A CN 201780009778A CN 108885139 A CN108885139 A CN 108885139A
Authority
CN
China
Prior art keywords
wafer support
semiconductor processing
support assembly
module
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780009778.0A
Other languages
English (en)
Chinese (zh)
Inventor
穆罕默德·诺斯拉蒂
蒂莫西·B·汤普金斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Watlow Electric Manufacturing Co
Original Assignee
Watlow Electric Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Watlow Electric Manufacturing Co filed Critical Watlow Electric Manufacturing Co
Publication of CN108885139A publication Critical patent/CN108885139A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02—Means for indicating or recording specially adapted for thermometers
    • G01K1/024—Means for indicating or recording specially adapted for thermometers for remote indication
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
CN201780009778.0A 2016-02-08 2017-02-08 用于可旋转晶圆支承组件的温度感测系统 Pending CN108885139A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662292614P 2016-02-08 2016-02-08
US62/292,614 2016-02-08
PCT/US2017/016975 WO2017139353A1 (en) 2016-02-08 2017-02-08 Temperature sensing system for rotatable wafer support assembly

Publications (1)

Publication Number Publication Date
CN108885139A true CN108885139A (zh) 2018-11-23

Family

ID=58094524

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780009778.0A Pending CN108885139A (zh) 2016-02-08 2017-02-08 用于可旋转晶圆支承组件的温度感测系统

Country Status (7)

Country Link
US (1) US20170229331A1 (enExample)
EP (1) EP3414541B1 (enExample)
JP (1) JP6971991B2 (enExample)
KR (1) KR20180114088A (enExample)
CN (1) CN108885139A (enExample)
TW (1) TWI636519B (enExample)
WO (1) WO2017139353A1 (enExample)

Cited By (1)

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CN112689887A (zh) * 2018-09-18 2021-04-20 株式会社国际电气 基板处理装置、温度控制系统以及半导体装置的制造方法

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CN111819663B (zh) * 2018-03-06 2024-06-07 东京毅力科创株式会社 液处理装置和液处理方法
CN110707035A (zh) * 2019-10-16 2020-01-17 北京北方华创微电子装备有限公司 静电卡盘、半导体处理腔室及设备
FR3103314B1 (fr) * 2019-11-14 2021-10-08 Safran Electronics & Defense Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant
JP7411431B2 (ja) * 2020-01-31 2024-01-11 新光電気工業株式会社 静電チャック、基板固定装置
DE102020007791A1 (de) * 2020-12-18 2022-06-23 Att Advanced Temperature Test Systems Gmbh Modulares Wafer-Chuck-System
TWI755996B (zh) * 2020-12-24 2022-02-21 天虹科技股份有限公司 用以產生均勻溫度的晶圓承載盤及應用該晶圓承載盤的薄膜沉積裝置
AT526503B1 (de) 2022-12-15 2024-04-15 Sensideon Gmbh Vorrichtung zur in-situ Oberflächentemperaturmessung von Beschichtungsobjekten in einem Gasphasenabscheidungsverfahren
CN116005136A (zh) * 2023-01-16 2023-04-25 深圳市原速光电科技有限公司 原子层沉积设备

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JP2002343696A (ja) * 2001-05-11 2002-11-29 Tokyo Electron Ltd 基板の処理装置
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112689887A (zh) * 2018-09-18 2021-04-20 株式会社国际电气 基板处理装置、温度控制系统以及半导体装置的制造方法
CN112689887B (zh) * 2018-09-18 2024-09-27 株式会社国际电气 基板温度传感器、基板保持件、基板处理装置以及半导体装置的制造方法

Also Published As

Publication number Publication date
TW201735216A (zh) 2017-10-01
JP2019511111A (ja) 2019-04-18
TWI636519B (zh) 2018-09-21
KR20180114088A (ko) 2018-10-17
EP3414541B1 (en) 2020-09-30
EP3414541A1 (en) 2018-12-19
JP6971991B2 (ja) 2021-11-24
US20170229331A1 (en) 2017-08-10
WO2017139353A1 (en) 2017-08-17

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Application publication date: 20181123