JP2007171046A5 - - Google Patents

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Publication number
JP2007171046A5
JP2007171046A5 JP2005370810A JP2005370810A JP2007171046A5 JP 2007171046 A5 JP2007171046 A5 JP 2007171046A5 JP 2005370810 A JP2005370810 A JP 2005370810A JP 2005370810 A JP2005370810 A JP 2005370810A JP 2007171046 A5 JP2007171046 A5 JP 2007171046A5
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JP
Japan
Prior art keywords
wafer
temperature
frequency signal
oscillation
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005370810A
Other languages
English (en)
Japanese (ja)
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JP2007171046A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005370810A priority Critical patent/JP2007171046A/ja
Priority claimed from JP2005370810A external-priority patent/JP2007171046A/ja
Priority to US11/642,827 priority patent/US7977609B2/en
Publication of JP2007171046A publication Critical patent/JP2007171046A/ja
Publication of JP2007171046A5 publication Critical patent/JP2007171046A5/ja
Pending legal-status Critical Current

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JP2005370810A 2005-12-22 2005-12-22 ウェハ型温度センサとこれを用いた温度測定装置、温度測定機能を有する熱処理装置および温度測定方法 Pending JP2007171046A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005370810A JP2007171046A (ja) 2005-12-22 2005-12-22 ウェハ型温度センサとこれを用いた温度測定装置、温度測定機能を有する熱処理装置および温度測定方法
US11/642,827 US7977609B2 (en) 2005-12-22 2006-12-21 Temperature measuring device using oscillating frequency signals

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005370810A JP2007171046A (ja) 2005-12-22 2005-12-22 ウェハ型温度センサとこれを用いた温度測定装置、温度測定機能を有する熱処理装置および温度測定方法

Publications (2)

Publication Number Publication Date
JP2007171046A JP2007171046A (ja) 2007-07-05
JP2007171046A5 true JP2007171046A5 (enExample) 2009-01-08

Family

ID=38297794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005370810A Pending JP2007171046A (ja) 2005-12-22 2005-12-22 ウェハ型温度センサとこれを用いた温度測定装置、温度測定機能を有する熱処理装置および温度測定方法

Country Status (1)

Country Link
JP (1) JP2007171046A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5552824B2 (ja) * 2010-02-10 2014-07-16 サクサ株式会社 無線送信機、無線受信機および無線送受信システム
JP5916030B2 (ja) * 2012-02-14 2016-05-11 セイコーエプソン株式会社 温度センサー及び電気光学装置
KR102039429B1 (ko) * 2017-11-09 2019-11-04 한국표준과학연구원 단열 기능을 갖는 웨이퍼 센서 및 그 제조 방법
CN111397760A (zh) * 2020-03-24 2020-07-10 华帝股份有限公司 一种用于灶具的非接触式温度检测装置及其控制方法
DE102020007791A1 (de) * 2020-12-18 2022-06-23 Att Advanced Temperature Test Systems Gmbh Modulares Wafer-Chuck-System

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3031376B1 (ja) * 1994-09-07 2000-04-10 三菱自動車工業株式会社 内燃エンジンの排気浄化触媒装置
JP3791590B2 (ja) * 2000-12-01 2006-06-28 株式会社山武 非接触温度測定装置
US7151366B2 (en) * 2002-12-03 2006-12-19 Sensarray Corporation Integrated process condition sensing wafer and data analysis system
JP2004271458A (ja) * 2003-03-11 2004-09-30 Yoshikawa Rf System Kk センサ付データキャリア
JP2005115919A (ja) * 2003-09-19 2005-04-28 Mitsubishi Materials Corp 無線温度センサ

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