JP2007171046A - ウェハ型温度センサとこれを用いた温度測定装置、温度測定機能を有する熱処理装置および温度測定方法 - Google Patents

ウェハ型温度センサとこれを用いた温度測定装置、温度測定機能を有する熱処理装置および温度測定方法 Download PDF

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JP2007171046A
JP2007171046A JP2005370810A JP2005370810A JP2007171046A JP 2007171046 A JP2007171046 A JP 2007171046A JP 2005370810 A JP2005370810 A JP 2005370810A JP 2005370810 A JP2005370810 A JP 2005370810A JP 2007171046 A JP2007171046 A JP 2007171046A
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wafer
temperature
frequency signal
oscillation
temperature sensor
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JP2005370810A
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JP2007171046A5 (enExample
Inventor
Nobuyuki Sata
信幸 左田
Takahiro Kitano
高広 北野
Tetsuo Fukuoka
哲夫 福岡
Toshiyuki Matsumoto
松本　　俊行
Tomohide Minami
朋秀 南
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2005370810A priority Critical patent/JP2007171046A/ja
Priority to US11/642,827 priority patent/US7977609B2/en
Publication of JP2007171046A publication Critical patent/JP2007171046A/ja
Publication of JP2007171046A5 publication Critical patent/JP2007171046A5/ja
Pending legal-status Critical Current

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  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2005370810A 2005-12-22 2005-12-22 ウェハ型温度センサとこれを用いた温度測定装置、温度測定機能を有する熱処理装置および温度測定方法 Pending JP2007171046A (ja)

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JP2005370810A JP2007171046A (ja) 2005-12-22 2005-12-22 ウェハ型温度センサとこれを用いた温度測定装置、温度測定機能を有する熱処理装置および温度測定方法
US11/642,827 US7977609B2 (en) 2005-12-22 2006-12-21 Temperature measuring device using oscillating frequency signals

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JP2005370810A JP2007171046A (ja) 2005-12-22 2005-12-22 ウェハ型温度センサとこれを用いた温度測定装置、温度測定機能を有する熱処理装置および温度測定方法

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JP2007171046A5 JP2007171046A5 (enExample) 2009-01-08

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011164951A (ja) * 2010-02-10 2011-08-25 Saxa Inc 無線送信機、無線受信機および無線送受信システム
JP2013167456A (ja) * 2012-02-14 2013-08-29 Seiko Epson Corp 温度センサー及び電気光学装置
KR20190052992A (ko) * 2017-11-09 2019-05-17 한국표준과학연구원 방열 기능을 갖는 웨이퍼 센서 및 그 제조 방법
CN111397760A (zh) * 2020-03-24 2020-07-10 华帝股份有限公司 一种用于灶具的非接触式温度检测装置及其控制方法
WO2022129527A1 (de) * 2020-12-18 2022-06-23 Att Advanced Temperature Test Systems Gmbh Modulares wafer-chuck-system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3031376B1 (ja) * 1994-09-07 2000-04-10 三菱自動車工業株式会社 内燃エンジンの排気浄化触媒装置
JP2002168699A (ja) * 2000-12-01 2002-06-14 Yamatake Corp 非接触温度測定装置および非接触温度測定方法
WO2004051713A2 (en) * 2002-12-03 2004-06-17 Sensarray Corporation Integrated process condition sensing wafer and data analysis system
JP2004271458A (ja) * 2003-03-11 2004-09-30 Yoshikawa Rf System Kk センサ付データキャリア
JP2005115919A (ja) * 2003-09-19 2005-04-28 Mitsubishi Materials Corp 無線温度センサ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3031376B1 (ja) * 1994-09-07 2000-04-10 三菱自動車工業株式会社 内燃エンジンの排気浄化触媒装置
JP2002168699A (ja) * 2000-12-01 2002-06-14 Yamatake Corp 非接触温度測定装置および非接触温度測定方法
WO2004051713A2 (en) * 2002-12-03 2004-06-17 Sensarray Corporation Integrated process condition sensing wafer and data analysis system
JP2004271458A (ja) * 2003-03-11 2004-09-30 Yoshikawa Rf System Kk センサ付データキャリア
JP2005115919A (ja) * 2003-09-19 2005-04-28 Mitsubishi Materials Corp 無線温度センサ

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011164951A (ja) * 2010-02-10 2011-08-25 Saxa Inc 無線送信機、無線受信機および無線送受信システム
JP2013167456A (ja) * 2012-02-14 2013-08-29 Seiko Epson Corp 温度センサー及び電気光学装置
KR20190052992A (ko) * 2017-11-09 2019-05-17 한국표준과학연구원 방열 기능을 갖는 웨이퍼 센서 및 그 제조 방법
KR102039429B1 (ko) * 2017-11-09 2019-11-04 한국표준과학연구원 단열 기능을 갖는 웨이퍼 센서 및 그 제조 방법
CN111397760A (zh) * 2020-03-24 2020-07-10 华帝股份有限公司 一种用于灶具的非接触式温度检测装置及其控制方法
WO2022129527A1 (de) * 2020-12-18 2022-06-23 Att Advanced Temperature Test Systems Gmbh Modulares wafer-chuck-system

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