JP2007171046A - Wafer-type temperature sensor, temperature measuring apparatus using the same, heat treatment apparatus having temperature-measuring function, and temperature-measuring method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer-type temperature sensor capable of eliminating the need for A/D converter, adapted to automation, enhancing resistance to heat, and measuring the temperature distribution of a wafer. <P>SOLUTION: The wafer-type temperature sensor 10 is provided with the wafer 1 and a plurality of temperature sensors 2a, 2b, ..., each being with the upper surface of the wafer 1 partitioned into a plurality of regions. The temperature sensors 2a, 2b, ... are each provided with an oscillation circuit for generating frequency signals, based on the temperature of a corresponding region within a frequency band that is different region by region, in response to the input of the supply voltage. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a wafer-type temperature sensor, a temperature measurement device using the same, a heat treatment device having a temperature measurement function, and a temperature measurement method, for example, an apparatus and method for measuring the temperature of a heating plate for heating a wafer.

  In the photolithography process in the manufacture of semiconductor devices, heat treatment (pre-baking) after applying a resist solution to the surface of a semiconductor wafer (hereinafter referred to as “wafer”), or heat treatment (post-posting) after pattern exposure. Various heat treatments such as exposure baking) and cooling treatment performed after each heat treatment are performed by, for example, a heating / cooling apparatus in which the wafer is maintained at a predetermined temperature.

  13 is a longitudinal sectional view of a conventional heating / cooling device 60, and FIG. 14 is a transverse sectional view taken along line AA in FIG.

  In FIG. 13, a cooling plate 61 for cooling and a heating plate 62 for heating are provided side by side in a housing 90 of the heating / cooling device 60. The cooling plate 61 and the heating plate 62 are formed in a thick disk shape. The cooling plate 61 incorporates, for example, a Peltier element (not shown), and can cool the cooling plate 61 to a predetermined temperature.

  Also, below the cooling plate 61, there are provided lifting pins 63 for supporting the wafer and lifting it when the wafer is placed on the cooling plate 61. The elevating pins 63 are movable up and down by an elevating drive mechanism 64, and are configured to penetrate the cooling plate 61 from below the cooling plate 61 and protrude onto the cooling plate 61.

  On the other hand, the heating plate 62 incorporates a heater 65 and a heating plate temperature sensor 62a, and the controller 66 controls the amount of heat generated by the heater 65 based on the temperature of the heating plate temperature sensor 62a. To maintain the set temperature. Below the heating plate 62, as with the cooling plate 61, an elevating pin 67 and an elevating drive mechanism 68 are provided, and the elevating pin 67 allows the wafer to be placed on the heating plate 62.

  Further, as shown in FIG. 13, a transfer device 69 is provided between the cooling plate 61 and the heating plate 62 for transferring the wafer to the heating plate 62 and transferring the wafer from the heating plate 62 to the cooling plate 61. It has been. On the cooling plate 62 side of the casing 90 of the heating / cooling device 60, a transfer port 70 for carrying the wafer into and out of the heating / cooling device 60 is provided.

  In addition, a shutter 71 for maintaining the atmosphere in the heating / cooling device 60 at a predetermined atmosphere is provided at the transport port 70. A transfer arm 80 is provided so as to face the shutter 71, and when the shutter 71 is opened, the wafer is transferred from the transfer port 70 by the transfer arm 80. The transferred wafer is transferred onto the heating plate 62 by the transfer device 69.

  Using such a heating / cooling device 60, the temperature distribution of the wafer placed on the heating plate 62 is measured in advance to grasp the temperature characteristics on the heating plate 62, and the correction is made appropriately based on the result. Thus, it is important to uniformly heat the wafer on the heating plate 62. Conventionally, in order to measure the temperature distribution of the wafer on such a heating plate 62, a temperature measurement device is used to grasp the temperature distribution of the wafer before actual wafer processing and to correct the temperature distribution of the wafer. It was.

  FIG. 15 is a diagram illustrating various examples of a conventional temperature measuring apparatus. The example shown in FIG. 15A is for temperature detection using a temperature measurement wafer K of the same material and shape as an actual wafer, and thermocouples distributed on the temperature measurement wafer K. A plurality of temperature sensors 101 and a transmission device 103 are provided, and the temperature sensor 101 and the transmission device 103 are connected by a cable 102. Then, data detected by each temperature sensor 101 is transmitted wirelessly, a receiving device is provided inside or outside the heating / cooling device 60, and the wirelessly transmitted data is received. Since the temperature data detected by each temperature sensor 101 is an analog value, the transmitter 103 needs to incorporate an A / D converter in order to convert the analog temperature data into digital data. However, since the A / D converter has the characteristic that the conversion accuracy deteriorates when the temperature rises, even in the atmosphere where the temperature rises to 250 ° C., even if the temperature can be measured up to about 150 ° C. Cannot be used.

In Japanese Patent Laid-Open No. 2002-124457 (Patent Document 1), as shown in FIG. 15B, a disk S provided with the transmitter 103 shown in FIG. 15A separately from the temperature measuring wafer K is disclosed. In the example, each temperature sensor 101 of the temperature measurement wafer K is connected to the transmission device 103 by a cable 102. In this example, only the temperature measurement wafer K can be placed on the heating plate 62, and the disk S can be separated from the heating plate 62 by being positioned above the temperature measurement wafer K. The accuracy of the A / D converter built in the transmitter 103 is not deteriorated by high temperature.
JP 2002-124457 A

  However, it is difficult to carry by the transfer device 69 and the transfer arm 80 shown in FIG. 14 with the disk S positioned on the upper side of the temperature measurement wafer K, and the transfer device 69 and the transfer arm 80 are special. You need to prepare something.

  Therefore, an object of the present invention is to eliminate the need for an A / D converter, which is suitable for automation, can improve the heat resistance, and can measure the temperature distribution on the upper surface of the wafer, a temperature measuring device using the same, and a temperature measuring device. It is providing the heat processing apparatus and temperature measuring method which have a measurement function.

  The present invention is a wafer-type temperature sensor, and includes a wafer and a plurality of temperature sensors that are divided into a plurality of regions on the wafer upper surface, and each of the temperature sensors has a power supply voltage. Oscillating means that oscillates in response to being given and outputs an oscillation frequency signal based on the temperature corresponding to each region is provided.

  Thus, by supplying a power supply voltage to each of the plurality of oscillation means, a frequency signal corresponding to the temperature can be generated for each region of the wafer. Therefore, by receiving each frequency signal, The temperature of each region can be measured.

  Specifically, the oscillating means includes a temperature-dependent element whose characteristic changes according to a temperature change, and changes the oscillation frequency in the frequency band in response to the characteristic change of the temperature-dependent element.

  In one embodiment, the oscillating means outputs an oscillation frequency signal based on the temperature of a corresponding region in a different frequency band for each region, and in another embodiment, the oscillating means corresponds to each region in the same frequency band. Outputs an oscillation frequency signal based on the temperature of the region.

  In another aspect of the present invention, the wafer and the upper surface of the wafer are divided into a plurality of regions, arranged in each of the divided regions, and oscillates when a power supply voltage is applied, to a temperature corresponding to each region. A wafer type temperature sensor including an oscillation means for outputting an oscillation frequency signal based on the power supply means for supplying a power supply voltage to the oscillation means, and an oscillation frequency signal oscillated by a plurality of oscillation means. A discriminating unit that discriminates the temperature of the region; and a communication unit that outputs an oscillation frequency signal oscillated by the oscillating unit to the discriminating unit.

  In one embodiment, the plurality of oscillating means outputs an oscillation frequency signal based on the temperature of the corresponding region in a different frequency band for each region, and the determining means is an oscillation frequency signal oscillated by the plurality of oscillating means. And determining the frequency band in which the oscillation frequency signal is included, identifying the region of the wafer corresponding to the frequency band, determining the temperature of the region based on the oscillation frequency signal, and the communication means The oscillation frequency signal in the frequency band is output wirelessly to the discrimination means. Automatic conveyance is possible by wirelessly transmitting an oscillation frequency signal from the oscillation means to the discrimination means.

  In another embodiment, the plurality of oscillating means outputs an oscillating frequency signal based on the temperature of the corresponding area within the same frequency band for each area, and the communication means uses the oscillating frequency signal in the frequency band as a determination means. Output. By transmitting the oscillation frequency signal from the oscillating means to the determining means by wire, the predetermined area of the wafer can be specified, so that it is not necessary to divide the frequency band for each area.

  In the temperature measurement device according to the embodiment that communicates wirelessly, the power supply means generates a power supply voltage as a microwave signal, and the communication means includes a communication antenna provided at a distance from the wafer-type temperature sensor, and a communication antenna. Transmitting means for transmitting the microwave signal generated by the power supply means, and receiving means for receiving the oscillation frequency signal in the frequency band oscillated by the oscillating means via the communication antenna.

  The wafer-type temperature sensor includes a transmission unit that is connected to the output of the oscillation unit and transmits an oscillation frequency signal, and an element antenna that is connected to the transmission unit and radiates the transmitted oscillation frequency signal wirelessly.

  Still another aspect of the present invention is a heat treatment apparatus having a temperature measurement function, in which a casing surrounded entirely, a stage for heating or cooling a wafer in the casing, and a wafer upper surface divided into a plurality of regions A wafer type temperature sensor including an oscillating means disposed in each divided area, oscillating in response to application of a power supply voltage, and outputting an oscillation frequency signal based on a temperature corresponding to each area; And a communication antenna that captures a frequency signal transmitted wirelessly from the oscillation means of the wafer type temperature sensor.

  Specifically, the stage includes a heating plate that heats the wafer and a cooling plate that cools the wafer that has been heat-treated by the heating plate while moving, and the communication antenna includes a heating plate and a cooling plate in the housing. It is arrange | positioned on the ceiling of the housing | casing between. Temperature measurement even when the wafer-type temperature sensor is placed on the heating plate and moved from the heating plate to the cooling plate by placing the antenna on the ceiling of the housing between the heating plate and the cooling plate Is possible.

  Specifically, the stage includes a heating plate that heats the wafer, a cooling plate that cools the wafer heat-treated by the heating plate, and further includes an openable / closable cover member that covers the heating plate, and a communication antenna. Includes an auxiliary antenna provided above the cooling plate and disposed in the cover member.

  Still another aspect of the present invention is a temperature measurement method for measuring the temperature of a wafer in a heat treatment apparatus having a stage for mounting and heating or cooling the wafer, and the upper surface of the wafer is divided into a plurality of regions. A wafer type temperature sensor that oscillates a frequency signal based on the temperature of the corresponding region in a different frequency band for each region in response to the fact that the oscillation means is arranged in each divided region and power is input. One of the frequency bands transmitted from the wafer type temperature sensor and oscillated from the oscillation means of the wafer type temperature sensor by transmitting the microwave to the wafer type temperature sensor as a power source The process of receiving the frequency signal in the signal and the frequency band containing the frequency signal based on the received frequency signal are identified to identify the region of the wafer. Its comprising a step of determining the temperature of the region based on the frequency signal, and a step of conveying fetches the wafer-type temperature sensor from the stage.

  According to the present invention, since the temperature is determined based on the oscillation frequency signal oscillated by the oscillating means arranged in a plurality of regions on the wafer, the oscillating means can function as an A / D converter. The A / D converter is not required, which is suitable for automation, can improve the heat resistance, and can measure the temperature distribution of the wafer.

  FIG. 1 is an external perspective view showing a wafer type temperature sensor according to one embodiment of the present invention, and FIG. 2 is a circuit diagram showing an oscillation circuit constituting the wafer type temperature sensor shown in FIG.

  In FIG. 1, a wafer type temperature sensor 10 includes a wafer 1 and a plurality of temperature sensors 2a, 2b... Arranged in a plurality of regions X, Y,. Including. The wafer type temperature sensor 10 is placed on the heating plate 62 shown in FIG. 11 and measures the temperature distribution of the processing wafer placed on the heating plate 62 in advance to measure the temperature on the heating plate 62. It is provided for measuring the temperature at which the wafer for processing on the heating plate 62 is uniformly heated by grasping the characteristics and appropriately correcting based on the result.

More preferably, the temperature sensors 2a, 2b... Are constituted by an oscillation circuit 2 as an oscillation means. The oscillation circuit 2 includes an operational amplifier 21, a capacitor C1 is connected between the inverting input terminal (−) of the operational amplifier 21 and the ground, a resistor Rs is connected between the inverting input terminal and the output terminal, and a non-inverting input terminal (+ ) And the ground, and a resistor R2 is connected between the normal rotation input terminal and the output terminal. The resistor Rs is an element having temperature dependency in which the resistance value changes according to the temperature. The capacitor C1 and the operational amplifier 21 also have temperature dependency. The oscillation frequency f ₀ of the oscillation circuit 2 is defined by a constant of the capacitor C1 and the resistor Rs, and is represented by f ₀ ≈1 / (2 · C1 · Rs).

  A transmission / reception circuit 22 is connected to the output of the oscillation circuit 2, and an element antenna 23 is connected to the transmission / reception circuit 22. The transmission / reception circuit 22 receives a microwave signal transmitted from the logger 12 shown in FIG. 4 to be described later via the element antenna 23, converts it into a power supply voltage, supplies it to the operational amplifier 21, and outputs the oscillation frequency signal of the oscillation circuit 2. Send to logger 12. In order to share the power supply voltage to the oscillation circuit 2, a battery is incorporated in the wafer type temperature sensor 10 without transmitting a microwave from the logger 12, and the power supply voltage is supplied from the battery to each oscillation circuit 2. It may be.

FIG. 3 is a diagram showing temperature characteristics of the oscillation circuit 2 shown in FIG. 3, the vertical axis represents the oscillation frequency f _0, the horizontal axis represents the temperature. The capacitance of the capacitor C1 of the oscillation circuit 2 shown in FIG. 2 is 10 pF, the resistance value of the resistor Rs is 500Ω, and Tcr = 0.3% / ° C. indicating temperature dependence. For example, when the temperature is 0 ° C., the resistance value of the resistor Rs is 500Ω, and the oscillation circuit 2 oscillates at an oscillation frequency f ₀ of 30 MHz as shown in FIG.

As the temperature rises, the resistance value of the resistor Rs gradually increases, and the oscillation frequency f ₀ of the oscillation circuit 2 decreases. For example, when the temperature rises to 250 ° C., the resistance value of the resistor Rs rises to 1047Ω, and the oscillation frequency f ₀ of the oscillation circuit 2 falls to 14.3 MHz. In this example, when the temperature changes by 0.05 ° C., the change of the oscillation frequency f ₀ becomes 4 kHz to 2 kHz in 1 sec. In the conventional example, a temperature change can be detected only at an accuracy of 0.1 ° C. at 150 ° C., but in this embodiment, a temperature change can be measured at an accuracy of 0.05 ° C. at 250 ° C. Can be increased.

Therefore, if a counter device having a frequency bandwidth of 225 MHz, a gate interval of 1 sec and a resolution of 10 to 12 digits is used, the temperature of the wafer temperature sensor 10 can be measured based on the oscillation frequency f ₀ of the oscillation circuit 2. Become. Since the oscillation circuit 2 can output a pulse signal whose oscillation frequency f ₀ changes according to the temperature, it has the function of an A / D converter, so that it is not necessary to incorporate an A / D converter. The temperature can be accurately measured even at a high temperature of 250 ° C. or higher.

  Further, the oscillation circuit 2 is sealed and embedded in the surface of the wafer temperature sensor 10, so that the oscillation circuit 2 is not deteriorated by the atmospheric gas in the measurement environment, and high reliability can be obtained.

  A method for measuring the temperature of the wafer-type temperature sensor 10 using the oscillation circuit 2 configured as described above will be described. The frequency change range within the measurement temperature range of the temperature sensor 2a arranged in the predetermined region X on the wafer type temperature sensor 10 shown in FIG. 1 is defined as f1 to f2, and the temperature arranged in the predetermined region Y. The frequency band is varied according to the region to be measured such that the frequency change range within the measurement temperature range of the sensor 2b is f3 to f4. If f1 <f2 <f3 <f4, if the frequency band of f1 to f2 is detected, the predetermined region X in the wafer-type temperature sensor 10 can be specified, and which frequency is within the frequency band of f1 to f2. Can be determined, the temperature in the region X can be measured. Further, if the frequency band of f3 to f4 is detected, the predetermined region Y in the wafer type temperature sensor 10 can be specified, and if the frequency within the frequency band of f3 to f4 can be determined, the temperature in the region Y can be determined. It can be measured.

  FIG. 4 is a diagram showing an example of measuring the temperature by arranging the wafer type temperature sensor 10 shown in FIG. 1 in the heating / cooling device 60a, and FIG. 5 is a specific block diagram of the logger 12 shown in FIG. FIG.

  In FIG. 4, the heating / cooling device 60a is configured in substantially the same manner as the heating / cooling device 60 shown in FIGS. The heating plate 62 described with reference to FIG. 11 is disposed in the housing 60b, and the heating plate 62 incorporates a heating plate temperature sensor 62a. The cooling plate 61 is not shown. An antenna 11 is disposed on the ceiling of the housing 60b. The antenna 11 is configured by, for example, a coil obtained by winding a conductor in a spiral shape. The antenna 11 transmits a high-frequency signal having a predetermined frequency bandwidth from the logger 12 as transmission / reception means into the housing 60 b, receives the oscillation frequency signal oscillated by the oscillation circuit 2, and gives it to the logger 12. The logger 12 calculates and displays the temperature of the wafer type temperature sensor 10 based on the received oscillation frequency signal, and outputs the calculated temperature data to the computer 13. The controller 14 controls a heater (not shown) built in the heating plate 62 based on the temperature detected by the heating plate temperature sensor 62a.

  Next, the configuration and operation of the logger 12 will be described with reference to FIG. The antenna 11 shown in FIG. 4 is connected to the switching circuit 121. Under the control of the control circuit 122, the switching circuit 121 is switched to the transmission circuit 123 side as transmission means when transmitting microwaves, and is switched to the reception circuit 124 side as reception means when receiving the oscillation frequency signal from the oscillation circuit 2. . A microwave signal is given from the microwave generation circuit 125 to the transmission circuit 123.

  The reception circuit 124 receives the oscillation frequency signal output from the oscillation circuit 2 via the antenna 11, extracts measurement data of the measurement temperature corresponding to the oscillation frequency, and outputs the measurement data to the sampling circuit 126. The sampling circuit 126 samples the measured temperature data at each sampling time to obtain time series data, and stores the time series data in the storage circuit 127. Based on the data stored in the storage circuit 127, the control circuit 122 performs numerical processing such as an average value or a deviation value and displays the result on the display 129. Further, the control circuit 122 outputs data from the output terminal 128 and supplies it to the computer 13 shown in FIG.

  FIG. 6 is a circuit diagram showing another example of the oscillation circuit included in the wafer temperature sensor 10 according to the embodiment of the present invention. The oscillation circuit 2 shown in FIG. 2 uses the operational amplifier 21, whereas the oscillation circuit 2c shown in FIG. 6 is configured by a Colpitts oscillation circuit. That is, the capacitor C2 is connected between the base of the transistor Tr and the ground, the coil L1 is connected between the base and the collector of the transistor Tr, and the capacitor C3 is connected between the collector and the ground. Yes. The emitter of the transistor Tr is grounded, the transmission / reception circuit 22 described in FIG. 2 is connected to the collector of the transistor Tr, and the communication antenna 23 is connected to the transmission / reception circuit 22.

  In the oscillation circuit 2c shown in FIG. 6, the coil L1 has a temperature dependency in which the inductance changes depending on the temperature, and the transistor Tr also has a temperature dependency in which the current amplification factor changes in accordance with the temperature. ing. The transmission / reception circuit 22 receives the microwave from the logger 12 via the element antenna 23, converts the microwave into a power supply voltage, and supplies the power supply voltage to the oscillation circuit 2c. The oscillation circuit 2 c self-oscillates when a power supply voltage is applied, and the oscillation frequency signal is transmitted from the transmission / reception circuit 22 to the logger 12 via the element antenna 23. Since the coil L1 and the transistor Tr have temperature dependence, the oscillation frequency changes according to the temperature. Therefore, if the oscillation circuit 2c is embedded as the temperature sensors 2a, 2b in the regions X, Y... Of the wafer type temperature sensor 10 shown in FIG. 1, the temperature of each part in the wafer type temperature sensor 10 can be measured. Become.

  FIG. 7 is a circuit diagram showing still another example of the oscillation circuit included in the wafer type temperature sensor according to the embodiment of the present invention. The oscillation circuit 2d shown in FIG. 7 is an oscillation circuit configured by a ring oscillator. In the oscillation circuit 2d, three inverters INV1 to INV3 are connected in series, the output terminal of the inverter INV3 is connected to the input terminal of the inverter INV1, the capacitor C4 is connected between the input terminal of the inverter INV2 and the ground, and the inverter INV3 A capacitor C5 is connected between the input terminal and the ground.

  The inverters INV1 to INV3 are composed of MOS transistors, and the current drive capability has temperature dependence, so that the charge / discharge current changes depending on the temperature. For this reason, the drive current depends on the oscillation frequency. By giving the output of the inverter INV3 to the transmission / reception circuit 22, the oscillation frequency signal can be output to the logger 12 via the element antenna 23.

  The transmission / reception circuit 22 receives the microwave from the logger 12 via the element antenna 23, converts the microwave into a power supply voltage, and supplies the power supply voltage to the oscillation circuit 2d. The oscillation circuit 2 d oscillates by itself, and the oscillation frequency signal is transmitted from the transmission / reception circuit 22 to the logger 12 via the element antenna 23. Since the inverters INV1 to INV3 have temperature dependence, the oscillation frequency changes corresponding to the temperature. Therefore, if the oscillation circuit 2c is embedded as the temperature sensors 2a, 2b in the regions X, Y... Of the wafer type temperature sensor 10 shown in FIG. 1, the temperature of each part in the wafer type temperature sensor 10 can be measured. Become.

  The oscillation circuit is not limited to the Colpitts oscillation circuit shown in FIG. 6 or the ring oscillator oscillation circuit shown in FIG. 7, but is an Hartley oscillation circuit or other oscillation circuit whose oscillation frequency changes according to temperature. It may be used.

  FIG. 8 is a diagram showing an embodiment in which the temperature sensors 2 a and 2 b of the wafer type temperature sensor 10 and the logger 16 are connected by wire. The oscillation output of each temperature sensor 2a, 2b ... of the wafer type temperature sensor 10 and the logger 16 are connected by a cable 18, and the power input terminal of each temperature sensor 2a, 2b ... and the power supply circuit 17 are connected by a cable 19. Has been. In the logger 16, the oscillation frequency signal is directly input to the sampling circuit 126 via the cable 17 except for the antenna 11, the switching circuit 121, the transmission circuit 123, the reception circuit 124 and the microwave generation circuit 125 of the logger 12 shown in FIG. 5. The

  In the embodiment shown in FIG. 8, since the oscillation frequency signals of the temperature sensors 2a, 2b... Can be directly sampled, it is not necessary to determine each area on the wafer type temperature sensor 10. For this reason, what is necessary is just to select the oscillation frequency of each temperature sensor 2a, 2b ... in the frequency within the same frequency band.

  FIGS. 9A to 9C are views for explaining a method of measuring the temperature of the heating plate 62 and the cooling plate 61 by the temperature measuring device according to one embodiment of the present invention. In FIG. 9A, a cooling plate 61 and a heating plate 62 are arranged in the housing 60b in the same manner as described in FIG. The cooling plate 61 and the heating plate 62 are provided with the drive lifting mechanism described with reference to FIG. On the heating plate 62, a chamber cover 71 is provided as a cover member that can be opened and closed.

  The antenna 11 described with reference to FIG. 4 is disposed on the ceiling between the cooling plate 61 and the heating plate 62 of the housing 60b. Since the antenna 11 is not provided directly above the heating plate 62, an increase in temperature of the antenna 11 can be avoided. The chamber cover 71 is formed with a radio wave transmission window (not shown). Note that the logger 12, the computer 13, and the controller 14 shown in FIG. 4 are placed in a room temperature atmosphere away from the heating plate 62.

  Next, a temperature measurement method will be described with reference to FIGS. First, the wafer-type temperature sensor 10 is transported from a transport port (not shown) of the housing 60b by the transport arm described in FIG. 11, and the chamber cover 71 on the heating plate 62 is lifted and opened, so that the transport described in FIG. The apparatus transfers the wafer temperature sensor 10 onto the heating plate 62 and aligns the position. Thereafter, as shown in FIG. 9A, the chamber cover 71 is lowered and the upper portion of the heating plate 62 is closed, and the microwave signal is radiated from the antenna 11 as described with reference to FIG. Power is supplied to the oscillation circuit on the sensor 10, and an oscillation frequency signal is radiated and captured by the antenna 11. When the heat treatment is completed, as shown in FIG. 9B, the chamber cover 71 is raised again, and the wafer type temperature sensor 10 is moved from the heating plate 62 toward the cooling plate 51 by the transfer device.

  Even during the conveyance, a microwave signal is radiated from the antenna 11 to the wafer type temperature sensor 10, and an oscillation frequency signal corresponding to each temperature of the wafer type temperature sensor 10 is captured by the antenna 11. Furthermore, as shown in FIG. 9C, since the microwave can be transmitted from the antenna 11 even after the wafer type temperature sensor 10 is conveyed onto the cooling plate 51, each temperature of the wafer type temperature sensor 10 can be transmitted. An oscillation frequency signal corresponding to the signal is captured by the antenna 11. Therefore, the temperature after cooling can be detected by the wafer temperature sensor 10. Thereafter, the wafer type temperature sensor 10 is discharged.

  As described above, in the example shown in FIGS. 9A to 9C, the microwave signal can be transmitted and the oscillation frequency signal can be received by the antenna 11 even during heating by the heating plate 62 and cooling by the cooling plate 61. Therefore, the measurement of the heating temperature and the cooling temperature can be continuously performed by the wafer type temperature sensor 10.

  FIGS. 10A to 10C are views for explaining another example in which the temperature of the heating plate and the cooling plate is measured by the temperature measuring device according to one embodiment of the present invention.

  In this example, the antenna 11 is disposed on the ceiling portion of the casing 60 b above the cooling plate 61, and the auxiliary antenna 15 is disposed in the chamber cover 71. A plurality of auxiliary antennas 15 may be provided in the chamber cover 71. The chamber cover 71 is opened, and the wafer type temperature sensor 10 is conveyed onto the heating plate 62. As shown in FIG. 10A, a microwave signal is radiated from the auxiliary antenna 15, power is supplied to the wafer temperature sensor 10, and a frequency signal corresponding to the measured temperature of each region is transmitted by the auxiliary antenna 15. Captured.

  When the heat treatment is completed, as shown in FIG. 10B, the chamber cover 71 is opened, and the wafer type temperature sensor 10 is moved from the heating plate 62 to the cooling plate 61 side. At this time, the transmission of the microwave signal is switched from the auxiliary antenna 15 to the antenna 11 on the cooling plate 61, and the microwave signal is radiated to the wafer-type temperature sensor 10 being transferred. The oscillation frequency signal is captured by the antenna 11. As shown in FIG. 10C, after the wafer type temperature sensor 10 is transferred onto the cooling plate 61, a microwave signal is transmitted from the antenna 11, and the wafer type temperature sensor 10 generates an oscillation frequency signal corresponding to each temperature. Is output.

  In this example, the auxiliary antenna 15 is formed of a metal material having a characteristic of withstanding high heat of 200 ° C. or higher. The logger 12, the computer 13, and the controller 14 shown in FIG. It is placed in a remote room temperature atmosphere.

  10A to 10C, transmission / reception is performed via the auxiliary antenna 15 during heating by the heating plate 62, and transmission / reception is performed via the antenna 11 during cooling by the cooling plate 61. Therefore, the measurement of the heating temperature and the cooling temperature can be continuously performed.

  FIGS. 11A to 11C are views for explaining still another example in which the temperature of the heating plate and the cooling plate is measured by the temperature measuring device having the temperature measuring function of one embodiment of the present invention.

  In the example shown in FIG. 8 and FIG. 9, the cooling plate 61 and the conveying device 69 are separately provided as shown in FIG. 14, whereas the example shown in FIG. Is configured to have a transport function. The other configuration is the same as that of FIG.

  First, the chamber cover 71 is raised and opened, the wafer type temperature sensor 10 having the cooling plate 63 conveyed to the conveyance port is conveyed onto the heating plate 62, the chamber cover 71 is lowered and the heating plate 62 is closed, and the antenna A high frequency signal having a predetermined bandwidth is radiated from 11, and a frequency signal is returned from the SAW element 2 on the wafer type temperature sensor 10 to the antenna 11. When the heat treatment is completed, as shown in FIG. 11B, the chamber cover 71 is raised, the cooling plate 63 is moved onto the heating plate 62, and the wafer type temperature sensor 10 is pulled out from the heating plate 62.

  Even during the conveyance, a high frequency signal having a predetermined bandwidth is radiated from the antenna 11 to the wafer type temperature sensor 10, and a frequency signal corresponding to each region of the wafer type temperature sensor 10 is sent back. Further, as shown in FIG. 11C, the cooling plate 63 stops the conveyance. Even in this state, the wafer-type temperature sensor 10 can transmit a high-frequency signal having a predetermined frequency bandwidth from the antenna 11, so that a frequency signal corresponding to each region of the wafer-type temperature sensor 10 is sent back. Thereafter, the wafer temperature sensor 10 is taken out by the transfer arm.

  FIGS. 12A to 12C are views for explaining still another example in which the temperature of the heating plate and the cooling plate is measured by the temperature measuring device having the temperature measuring function of one embodiment of the present invention.

  In this example, the antenna 11 is disposed on the ceiling of the casing 60c above the cooling plate 61 and the auxiliary antenna 15 is disposed in the chamber cover 71 in the same manner as in FIG. It is made to have. The transfer operation, heating operation, and cooling operation are the same as in FIG. 9, and the exchange of signals between the wafer temperature sensor 10 and the antennas 11 and 15 is the same as in FIG.

  As mentioned above, although embodiment of this invention was described with reference to drawings, this invention is not limited to the thing of embodiment shown in figure. Various modifications and variations can be made to the illustrated embodiment within the same range or equivalent range as the present invention.

  The wafer-type temperature sensor of the present invention, a temperature measuring device using the same, a heat treatment device having a temperature measuring function, and a temperature measuring method are used for measuring the surface temperature of a cooling plate or a heating plate in a heating / cooling device. The

It is an external appearance perspective view which shows the wafer type temperature sensor in one Embodiment of this invention. It is a figure which shows the oscillation circuit which comprises the wafer type temperature sensor shown in FIG. It is a figure which shows the temperature characteristic of the oscillation circuit shown in FIG. It is a figure which shows the example which arrange | positions the wafer type temperature sensor shown in FIG. 1 in a heating / cooling apparatus, and measures temperature. FIG. 5 is a specific block diagram of the logger shown in FIG. 4. It is a circuit diagram which shows the other example of the oscillation circuit contained in the wafer type temperature sensor of one Embodiment of this invention. It is a circuit diagram which shows the further another example of the oscillation circuit contained in the wafer type temperature sensor of one Embodiment of this invention. It is a figure which shows embodiment which connected the wafer type temperature sensor and the logger with the wire communication. It is a figure for demonstrating an example which measures the temperature of a heating plate and a cooling plate with the temperature measuring apparatus in one Embodiment of this invention. It is a figure for demonstrating the other example which measures the temperature of a heating plate and a cooling plate with the temperature measuring apparatus in one Embodiment of this invention. It is a figure for demonstrating the further another example which measures the temperature of a heating plate and a cooling plate with the temperature measurement apparatus which has the temperature measurement function of one Embodiment of this invention. It is a figure for demonstrating the further another example which measures the temperature of a heating plate and a cooling plate with the temperature measurement apparatus which has the temperature measurement function of one Embodiment of this invention. It is a longitudinal cross-sectional view of the conventional heating / cooling device. It is a cross-sectional view along line AA in FIG. It is a figure which shows the various examples of the conventional temperature measuring apparatus.

Explanation of symbols

  1 Wafer, 2, 2c, 2d Oscillator, 2a, 2b Temperature sensor, 10 Wafer type temperature sensor, 11 Antenna, 12, 16 Logger, 13 Computer, 14 Controller, 15 Auxiliary antenna, 17 Power supply circuit, 18, 19 Cable, 21 operational amplifier, 22 transmission / reception circuit, 23 element antenna, 60a heating / cooling device, 60b, 60c housing, 61, 63 cooling plate, 62 heating plate, 62a heating plate temperature sensor, 71 chamber cover, 121 switching circuit, 122 control circuit , 123 transmitter circuit, 124 receiver circuit, 125 microwave generator circuit, 126 sampling circuit, 127 memory circuit, 128 output terminal, 129 display, R1, R2, Rs resistor, C1-C5 capacitor, L1 coil, Tr transistor, INV1 ~ INV3 Converter.

Claims (13)

A wafer,
The wafer upper surface is divided into a plurality of regions, and a plurality of temperature sensors arranged in each divided region,
Each of the temperature sensors includes a oscillating unit that oscillates in response to application of a power supply voltage and outputs an oscillation frequency signal based on a temperature corresponding to each region.   2. The wafer type temperature sensor according to claim 1, wherein the oscillating means includes a temperature-dependent element whose characteristics change in accordance with a temperature change, and changes the oscillation frequency in response to the characteristic change of the temperature-dependent element.   3. The wafer type temperature sensor according to claim 1, wherein the oscillation unit outputs an oscillation frequency signal based on a temperature of a corresponding region within a different frequency band for each region.   3. The wafer type temperature sensor according to claim 1, wherein the oscillation means outputs an oscillation frequency signal based on a temperature of a corresponding region within the same frequency band for each region. The wafer and the wafer upper surface are divided into a plurality of regions, arranged in each of the divided regions, oscillates when a power supply voltage is applied, and outputs an oscillation frequency signal based on the temperature corresponding to each region. A wafer type temperature sensor including an oscillation means;
Power supply means for supplying the power supply voltage to the oscillation means;
Discriminating means for discriminating the temperature of each region in the wafer based on the oscillation frequency signal oscillated by the plurality of oscillating means;
A temperature measurement apparatus comprising: communication means for outputting an oscillation frequency signal oscillated by the oscillation means to the discrimination means. The plurality of oscillating means outputs an oscillation frequency signal based on the temperature of a corresponding region in a different frequency band for each region,
The discriminating unit discriminates a frequency band including the oscillation frequency signal based on the oscillation frequency signal oscillated by the plurality of oscillation units, specifies a region of the wafer corresponding to the frequency band, and Determine the temperature of the region based on the oscillation frequency signal,
The temperature measuring device according to claim 5, wherein the communication unit wirelessly outputs an oscillation frequency signal in the frequency band to the determination unit. The power supply means generates the power supply voltage as a microwave signal,
The communication means includes
A communication antenna provided at a distance from the wafer-type temperature sensor;
Transmitting means for transmitting a microwave signal generated by the power supply means via the communication antenna;
The temperature measuring apparatus according to claim 6, further comprising: a receiving unit that receives an oscillation frequency signal in the frequency band oscillated by the oscillating unit via the communication antenna. The wafer-type temperature sensor is
Transmitting means connected to the output of the oscillating means for transmitting the oscillation frequency signal;
The temperature measuring device according to claim 7, further comprising: an element antenna connected to the transmitting unit and radiating the transmitted oscillation frequency signal wirelessly. The plurality of oscillating means outputs an oscillation frequency signal based on the temperature at a corresponding position in the same frequency band for each region,
The temperature measuring device according to claim 5, wherein the communication unit outputs an oscillation frequency signal in the frequency band in a wired manner to the determination unit. A heat treatment apparatus having a temperature measurement function,
A casing surrounded by the entire circumference,
A stage for heating or cooling the wafer in the housing;
An oscillation means for dividing the upper surface of the wafer into a plurality of areas, arranged in each of the divided areas, oscillating when a power supply voltage is applied, and outputting an oscillation frequency signal based on a temperature corresponding to each area is included. A wafer-type temperature sensor;
A heat treatment apparatus having a temperature measurement function, comprising: a communication antenna disposed in the housing and capturing a frequency signal transmitted wirelessly from the oscillation means of the wafer type temperature sensor. The stage includes a heating plate that heat-treats the wafer, and a cooling plate that cools the wafer heat-treated by the heating plate,
The heat treatment apparatus having a temperature measurement function according to claim 10, wherein the communication antenna is disposed on a ceiling of the casing between the heating plate and the cooling plate in the casing. The stage includes a heating plate that heat-treats the wafer, and a cooling plate that cools the wafer heat-treated by the heating plate,
Furthermore, including a cover member that can be opened and closed to cover the heating plate,
The heat treatment apparatus having a temperature measurement function according to claim 10, wherein the communication antenna includes an auxiliary antenna provided above the cooling plate and disposed in the cover member. In a heat treatment apparatus equipped with a stage for placing and heating or cooling a wafer, a temperature measurement method for measuring the temperature of the wafer,
The upper surface of the wafer is divided into a plurality of regions, and oscillation means is arranged in each of the divided regions, and based on the temperature of the corresponding region in a different frequency band for each region according to the input of power. Transporting and positioning a wafer-type temperature sensor that oscillates a frequency signal on the stage;
Heating or cooling the stage;
Transmitting microwaves to the wafer type temperature sensor as a power source and receiving a frequency signal in any frequency band oscillated from the oscillation means of the wafer type temperature sensor;
Determining a region of the wafer based on the received frequency signal to determine a frequency band including the frequency signal, and determining a temperature of the region based on the frequency signal;
And a step of taking out and transporting the wafer-type temperature sensor from the stage.

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