JP2019508732A - 変換要素、および、このタイプの変換要素を備えた放射放出半導体装置 - Google Patents
変換要素、および、このタイプの変換要素を備えた放射放出半導体装置 Download PDFInfo
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Abstract
【選択図】図1A
Description
1a 上面
1b 底面
11 キャリア
11a 成長面
12 中間領域
121 第1の部分領域
122 第2の部分領域
13 活性領域
131 障壁
132 量子井戸
14 第1の構造要素
15 第2の構造要素
151 水平面
152 凸部
16 第3の構造要素
2 励起光源
3 結合領域
Claims (15)
- 変換要素(1)であって、
− 半導体材料によって形成されており、かつ、複数の障壁(131)および量子井戸(132)を備えた活性領域(13)と、
− 前記変換要素(1)の上面(1a)に配置されている複数の第1の構造要素(14)と、
− 前記複数の第1の構造要素(14)とは反対の前記活性領域(13)の側に配置されている複数の第2の構造要素(15)および/または複数の第3の構造要素(16)と、
を有する、変換要素(1)。 - 電気接続部が存在しない、
請求項1に記載の変換要素(1)。 - キャリア(11)が存在しない、
請求項1または請求項2のいずれかに記載の変換要素(1)。 - − 放射に対して透過性の材料によって形成されているキャリア(11)、
を有し、
− 前記複数の第2の構造要素(15)が、前記活性領域(13)の側の前記キャリア(11)の外面に配置されている、および/または、
− 前記複数の第3の構造要素(16)が、前記活性領域(13)とは反対側の前記キャリア(11)の外面に配置されている、
請求項1または請求項2のいずれかに記載の変換要素(1)。 - 前記複数の第1の構造要素(14)が、前記変換要素(1)から電磁放射が放出される確率を高め、かつ、前記複数の第2の構造要素(15)および前記複数の第3の構造要素(16)が、前記活性領域(13)内に電磁放射が入射する確率を高める、
請求項1から請求項4のいずれか1項に記載の変換要素(1)。 - 前記複数の第2の構造要素(15)および/または前記複数の第3の構造要素(16)が、前記変換要素(1)から電磁放射が放出される確率を高め、かつ、前記複数の第1の構造要素(14)が、前記活性領域(13)内に電磁放射が入射する確率を高める、
請求項1から請求項4のいずれか1項に記載の変換要素(1)。 - 前記複数の第2の構造要素(15)および前記複数の第3の構造要素(16)を備えている、
請求項1から請求項6のいずれか1項に記載の変換要素(1)。 - 前記活性領域(13)が、少なくとも10個、特に、少なくとも35個の量子井戸(132)を備えている、
請求項1から請求項7のいずれか1項に記載の変換要素(1)。 - 前記複数の第1の構造要素(14)が、前記活性領域(13)におけるV欠陥によって形成されている、
請求項1から請求項8のいずれか1項に記載の変換要素(1)。 - 前記複数の第1の構造要素(14)および/または前記複数の第2の構造要素(15)および/または前記複数の第3の構造要素(16)が、少なくとも1回のエッチング工程によって形成されている、
請求項1から請求項9のいずれか1項に記載の変換要素(1)。 - キャリア(11)が、前記活性領域(13)の側の成長面(11a)を有する、前記活性領域(13)のための成長基板、の一部であり、
前記複数の第2の構造要素(15)が、前記活性領域(13)の側の前記キャリア(11)の前記成長面(11a)に配置されている複数の凸部(152)を有する水平面(151)、を備えている、
請求項1から請求項10のいずれか1項に記載の変換要素(1)。 - 前記複数の第3の構造要素(16)が、前記活性領域(13)とは反対側のキャリア(11)の前記外面を粗面化することによって形成されている、
請求項1から請求項11のいずれか1項に記載の変換要素(1)。 - 放射放出半導体装置であって、
− 動作時に一次放射を生成する励起光源(2)と、
− 請求項1から請求項12のいずれか1項に記載の変換要素(1)と、
を有し、
− 前記励起光源(2)が前記変換要素(1)に機械的に結合されており、
− 前記変換要素(1)の前記複数の第1の構造要素(14)が、前記励起光源(2)の側の前記活性領域(13)の面に配置されており、
− 前記複数の第1の構造要素(14)が、前記励起光源(2)と、前記複数の第2の構造要素(15)または前記複数の第3の構造要素(16)との間に配置されており、
− 前記変換要素(1)の前記活性領域(13)において、前記一次放射によって励起されたときに二次放射が生成される、
放射放出半導体装置。 - 放射放出半導体装置であって、
− 動作時に一次放射を生成する励起光源(2)と、
− 請求項1から請求項12のいずれか1項に記載の変換要素(1)と、
を有し、
− 前記励起光源(2)が前記変換要素(1)に機械的に結合されており、
− 前記変換要素(1)の前記複数の第1の構造要素(14)が、前記励起光源(2)とは反対側の前記活性領域(13)の面に配置されており、
− 少なくとも、前記複数の第2の構造要素(15)、または少なくとも、前記複数の第3の構造要素(16)が、前記励起光源(2)と前記複数の第1の構造要素(14)との間に配置されており、
− 前記変換要素(1)の前記活性領域(13)において、前記一次放射によって励起されたときに二次放射が生成される、
放射放出半導体装置。 - 結合領域(3)が、前記変換要素(1)と前記励起光源(2)との間に直接配置されており、かつ、前記変換要素(1)と前記励起光源(2)との間の機械的結合をもたらす、
請求項13および請求項14に記載の放射放出半導体装置。
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DE102016101442.7A DE102016101442A1 (de) | 2016-01-27 | 2016-01-27 | Konversionselement und strahlungsemittierendes Halbleiterbauelement mit einem solchen Konversionselement |
DE102016101442.7 | 2016-01-27 | ||
PCT/EP2017/050895 WO2017129446A1 (de) | 2016-01-27 | 2017-01-17 | Konversionselement und strahlungsemittierendes halbleiterbauelement mit einem solchen konversionselement |
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CN112005390A (zh) * | 2018-04-23 | 2020-11-27 | 克里公司 | 包括具有图案化表面的覆板的半导体发光装置 |
DE102019100624A1 (de) * | 2019-01-11 | 2020-07-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches halbleiterbauelement mit erster und zweiter dielektrischer schicht und verfahren zur herstellung des optoelektronischen halbleiterbauelements |
DE102019103492A1 (de) * | 2019-02-12 | 2020-08-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches bauelement |
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CN108604623A (zh) | 2018-09-28 |
CN108604623B (zh) | 2021-12-28 |
TWI636592B (zh) | 2018-09-21 |
TW201733171A (zh) | 2017-09-16 |
US20180375002A1 (en) | 2018-12-27 |
US11557698B2 (en) | 2023-01-17 |
WO2017129446A1 (de) | 2017-08-03 |
DE102016101442A1 (de) | 2017-07-27 |
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