JP2019507972A5 - - Google Patents

Download PDF

Info

Publication number
JP2019507972A5
JP2019507972A5 JP2018531145A JP2018531145A JP2019507972A5 JP 2019507972 A5 JP2019507972 A5 JP 2019507972A5 JP 2018531145 A JP2018531145 A JP 2018531145A JP 2018531145 A JP2018531145 A JP 2018531145A JP 2019507972 A5 JP2019507972 A5 JP 2019507972A5
Authority
JP
Japan
Prior art keywords
band filter
multiplexer structure
passive substrate
substrate
high band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018531145A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019507972A (ja
Filing date
Publication date
Priority claimed from US15/067,106 external-priority patent/US9954267B2/en
Application filed filed Critical
Publication of JP2019507972A publication Critical patent/JP2019507972A/ja
Publication of JP2019507972A5 publication Critical patent/JP2019507972A5/ja
Pending legal-status Critical Current

Links

JP2018531145A 2015-12-28 2016-12-05 ３ｄガラス貫通ビアフィルタと統合された２ｄ受動オンガラスフィルタを使用するマルチプレクサ構成 Pending JP2019507972A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562271893P 2015-12-28 2015-12-28
US62/271,893 2015-12-28
US15/067,106 2016-03-10
US15/067,106 US9954267B2 (en) 2015-12-28 2016-03-10 Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter
PCT/US2016/064962 WO2017116616A1 (en) 2015-12-28 2016-12-05 Multiplexer design using a 2d passive on glass filter integrated with a 3d through glass via filter

Publications (2)

Publication Number Publication Date
JP2019507972A JP2019507972A (ja) 2019-03-22
JP2019507972A5 true JP2019507972A5 (enExample) 2019-07-25

Family

ID=59088028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018531145A Pending JP2019507972A (ja) 2015-12-28 2016-12-05 ３ｄガラス貫通ビアフィルタと統合された２ｄ受動オンガラスフィルタを使用するマルチプレクサ構成

Country Status (9)

Country Link
US (1) US9954267B2 (enExample)
EP (1) EP3378160B1 (enExample)
JP (1) JP2019507972A (enExample)
KR (1) KR102093160B1 (enExample)
CN (1) CN108476014A (enExample)
BR (1) BR112018012738A2 (enExample)
CA (1) CA3004764C (enExample)
TW (1) TWI639316B (enExample)
WO (1) WO2017116616A1 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10944379B2 (en) * 2016-12-14 2021-03-09 Qualcomm Incorporated Hybrid passive-on-glass (POG) acoustic filter
US20190035621A1 (en) * 2017-07-25 2019-01-31 Qualcomm Incorporated Shaped circuit wafers
US10043136B1 (en) * 2017-10-12 2018-08-07 International Business Machines Corporation Reducing the number of input lines to superconducting quantum processors installed inside dilution refrigerators
US10582609B2 (en) 2017-10-30 2020-03-03 Qualcomm Incorporated Integration of through glass via (TGV) filter and acoustic filter
JP2019106429A (ja) * 2017-12-11 2019-06-27 凸版印刷株式会社 ガラス配線基板、その製造方法及び半導体装置
TWI678952B (zh) 2017-12-13 2019-12-01 欣興電子股份有限公司 線路板結構及其製作方法
TWI669997B (zh) * 2018-01-25 2019-08-21 欣興電子股份有限公司 線路板結構及其製作方法
JP7509035B2 (ja) * 2018-05-24 2024-07-02 Ｔｏｐｐａｎホールディングス株式会社 回路基板
US10840884B2 (en) 2018-05-24 2020-11-17 Qualcomm Incorporated Bulk acoustic wave (BAW) and passive-on-glass (POG) filter co-integration
WO2020098185A1 (zh) * 2018-11-16 2020-05-22 安徽安努奇科技有限公司 频分器
US10879169B2 (en) * 2018-12-26 2020-12-29 Qualcomm Incorporated Integrated inductors for power management circuits
US11121699B2 (en) * 2019-02-19 2021-09-14 Qualcomm Incorporated Wideband filter with resonators and inductors
JP7609067B2 (ja) 2019-06-18 2025-01-07 Ｔｏｐｐａｎホールディングス株式会社 Ｌｃ共振回路を有する多層配線基板、およびｌｃ共振回路を有する多層配線基板を用いた電子部品パッケージ
JP7512594B2 (ja) * 2020-01-10 2024-07-09 Ｔｏｐｐａｎホールディングス株式会社 回路基板
US11296670B2 (en) 2020-01-23 2022-04-05 Qualcomm Incorporated Impedance matching transceiver
TWI780668B (zh) * 2020-05-28 2022-10-11 日商村田製作所股份有限公司 用於半導體複合裝置之模組
US11652468B2 (en) * 2020-07-07 2023-05-16 Qualcomm Incorporated High performance tunable filter
CN112511126B (zh) * 2020-10-30 2022-03-15 诺思(天津)微系统有限责任公司 多工器和改善多工器隔离度的方法以及通信设备
JP7524966B2 (ja) * 2020-11-06 2024-07-30 株式会社村田製作所 フィルタ装置およびそれを搭載した高周波フロントエンド回路
CN115516761A (zh) * 2021-04-23 2022-12-23 京东方科技集团股份有限公司 集成有无源器件的基板及其制备方法
JP7712828B2 (ja) * 2021-09-14 2025-07-24 Tdk株式会社 積層型電子部品
JP7737274B2 (ja) * 2021-09-14 2025-09-10 Tdk株式会社 積層型電子部品
WO2023177581A1 (en) * 2022-03-17 2023-09-21 Northrop Grumman Systems Corporation Acoustic resonator filter bank system
WO2024040517A1 (zh) * 2022-08-25 2024-02-29 京东方科技集团股份有限公司 滤波器及其制备方法、电子设备
US20240429587A1 (en) * 2023-06-22 2024-12-26 Qualcomm Incorporated Low emission three-dimensional frequency multiplexer

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6240622B1 (en) * 1999-07-09 2001-06-05 Micron Technology, Inc. Integrated circuit inductors
JP3939192B2 (ja) * 2002-04-24 2007-07-04 三洋電機株式会社 分波器
JP2004072582A (ja) * 2002-08-08 2004-03-04 Matsushita Electric Ind Co Ltd 高周波デバイス
US7135943B2 (en) 2004-07-11 2006-11-14 Chi Mei Communication Sytems, Inc. Diplexer formed in multi-layered substrate
JP4423210B2 (ja) * 2005-01-21 2010-03-03 京セラ株式会社 高周波モジュール及びそれを用いた通信機器
EP2352226A4 (en) * 2008-10-24 2013-12-04 Murata Manufacturing Co ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
US9048112B2 (en) * 2010-06-29 2015-06-02 Qualcomm Incorporated Integrated voltage regulator with embedded passive device(s) for a stacked IC
US20120190152A1 (en) * 2011-01-25 2012-07-26 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for Fabricating Integrated Passive Devices on Glass Substrates
US8736399B2 (en) 2011-04-06 2014-05-27 M/A-Com Technology Solutions Holdings, Inc. Triplexer topology
US8666338B2 (en) * 2012-01-23 2014-03-04 Qualcomm Incorporated Multi-mode bypass driver amplifier with tunable load matching
US8803615B2 (en) * 2012-01-23 2014-08-12 Qualcomm Incorporated Impedance matching circuit with tunable notch filters for power amplifier
US9331720B2 (en) * 2012-01-30 2016-05-03 Qualcomm Incorporated Combined directional coupler and impedance matching circuit
US8884717B2 (en) 2012-04-13 2014-11-11 Cyntec Co., Ltd. Diplexer
CN103490793B (zh) * 2012-06-12 2015-08-19 太阳诱电株式会社 高频电路模块
US9203373B2 (en) 2013-01-11 2015-12-01 Qualcomm Incorporated Diplexer design using through glass via technology
US9935166B2 (en) 2013-03-15 2018-04-03 Qualcomm Incorporated Capacitor with a dielectric between a via and a plate of the capacitor
US9425761B2 (en) * 2013-05-31 2016-08-23 Qualcomm Incorporated High pass filters and low pass filters using through glass via technology
US9264013B2 (en) 2013-06-04 2016-02-16 Qualcomm Incorporated Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods
JP6409255B2 (ja) * 2013-07-31 2018-10-24 株式会社村田製作所 デュプレクサ
US9906318B2 (en) 2014-04-18 2018-02-27 Qualcomm Incorporated Frequency multiplexer
US9847804B2 (en) * 2014-04-30 2017-12-19 Skyworks Solutions, Inc. Bypass path loss reduction

Similar Documents

Publication Publication Date Title
JP2019507972A5 (enExample)
JP6099794B2 (ja) 絶縁層および第２の層を有する積層されたチップセットおよびそれを形成する方法
JP2019508878A5 (enExample)
US9641149B2 (en) Matching segment circuit to which radio frequency is applied and radio frequency integrated devices using the matching segment circuit
JP2016527743A5 (enExample)
JP2016174170A5 (enExample)
JP6336582B2 (ja) 集積回路（ｉｃ）における磁気結合を低減させるためのシステムならびに関連構成要素および方法
CN103888095A (zh) 双工器和多工器
JP2016511941A5 (enExample)
JP2014103666A5 (enExample)
US9997844B2 (en) Contactless millimeter wave coupler, an electronic apparatus and a connector cable
US8471651B2 (en) Microelectromechanical filter
WO2018000507A1 (zh) 射频发射电路、控制方法及移动终端
CN103618124B (zh) 一种叠层片式双工器
JPWO2010079614A1 (ja) フィルタ素子、分波器および電子装置
CN103078157B (zh) 一种压电声波双工器模块
KR102037557B1 (ko) 통합형 음향 위상 어레이
CN103208669A (zh) 一种压电声波双工器系统
CN106329037A (zh) 一种无源信号分离集成电路
CN107565927A (zh) 体声波滤波器
CN103178321A (zh) Siw谐振器及其加工方法
JP2014200031A (ja) アンテナ及び無線通信装置
WO2017160280A1 (en) Integrated substrate communication frontend with balanced filter
US20130044032A1 (en) Antenna
TWI245459B (en) A miniature monopole antenna for wireless systems