JP2019508878A5 - - Google Patents

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Publication number
JP2019508878A5
JP2019508878A5 JP2018534945A JP2018534945A JP2019508878A5 JP 2019508878 A5 JP2019508878 A5 JP 2019508878A5 JP 2018534945 A JP2018534945 A JP 2018534945A JP 2018534945 A JP2018534945 A JP 2018534945A JP 2019508878 A5 JP2019508878 A5 JP 2019508878A5
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JP
Japan
Prior art keywords
radio frequency
circuit structure
frequency circuit
filter
buried oxide
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JP2018534945A
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English (en)
Japanese (ja)
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JP6692908B2 (ja
JP2019508878A (ja
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Priority claimed from US15/151,285 external-priority patent/US10256863B2/en
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Publication of JP2019508878A5 publication Critical patent/JP2019508878A5/ja
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Publication of JP6692908B2 publication Critical patent/JP6692908B2/ja
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JP2018534945A 2016-01-11 2016-11-29 アンテナスイッチとダイプレクサのモノリシックな集積 Active JP6692908B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662277451P 2016-01-11 2016-01-11
US62/277,451 2016-01-11
US15/151,285 2016-05-10
US15/151,285 US10256863B2 (en) 2016-01-11 2016-05-10 Monolithic integration of antenna switch and diplexer
PCT/US2016/063973 WO2017123332A1 (en) 2016-01-11 2016-11-29 Monolithic integration of antenna switch and diplexer

Publications (3)

Publication Number Publication Date
JP2019508878A JP2019508878A (ja) 2019-03-28
JP2019508878A5 true JP2019508878A5 (enExample) 2019-06-13
JP6692908B2 JP6692908B2 (ja) 2020-05-13

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ID=59275018

Family Applications (1)

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JP2018534945A Active JP6692908B2 (ja) 2016-01-11 2016-11-29 アンテナスイッチとダイプレクサのモノリシックな集積

Country Status (9)

Country Link
US (1) US10256863B2 (enExample)
EP (1) EP3403278A1 (enExample)
JP (1) JP6692908B2 (enExample)
KR (1) KR102085549B1 (enExample)
CN (1) CN108701682B (enExample)
BR (1) BR112018013958B1 (enExample)
CA (1) CA3007083A1 (enExample)
TW (1) TWI681536B (enExample)
WO (1) WO2017123332A1 (enExample)

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US10297576B2 (en) 2016-04-18 2019-05-21 Skyworks Solutions, Inc. Reduced form factor radio frequency system-in-package
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JP2021048565A (ja) * 2019-09-20 2021-03-25 株式会社村田製作所 高周波モジュールおよび通信装置
TWI896571B (zh) * 2019-11-01 2025-09-11 美商予力半導體公司 電子裝置以及製造一電子裝置之方法
US11387316B2 (en) 2019-12-02 2022-07-12 Analog Devices International Unlimited Company Monolithic back-to-back isolation elements with floating top plate
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US11503704B2 (en) * 2019-12-30 2022-11-15 General Electric Company Systems and methods for hybrid glass and organic packaging for radio frequency electronics
JP2021158554A (ja) * 2020-03-27 2021-10-07 株式会社村田製作所 高周波モジュールおよび通信装置
JP2021158556A (ja) * 2020-03-27 2021-10-07 株式会社村田製作所 高周波モジュールおよび通信装置
TWI748451B (zh) * 2020-05-14 2021-12-01 芯巧科技股份有限公司 在同一晶圓上形成複數相隔離基底層的半導體裝置製程及其半導體裝置
CN111968972B (zh) * 2020-07-13 2024-03-26 深圳市汇芯通信技术有限公司 一种集成芯片及其制作方法和集成电路
US20220293513A1 (en) * 2021-03-11 2022-09-15 Qualcomm Incorporated Power decoupling metal-insulator-metal capacitor
CN119906455B (zh) * 2025-03-31 2025-07-04 深圳飞骧科技股份有限公司 射频开关芯片结构

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