JP2019508878A5 - - Google Patents
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- Publication number
- JP2019508878A5 JP2019508878A5 JP2018534945A JP2018534945A JP2019508878A5 JP 2019508878 A5 JP2019508878 A5 JP 2019508878A5 JP 2018534945 A JP2018534945 A JP 2018534945A JP 2018534945 A JP2018534945 A JP 2018534945A JP 2019508878 A5 JP2019508878 A5 JP 2019508878A5
- Authority
- JP
- Japan
- Prior art keywords
- radio frequency
- circuit structure
- frequency circuit
- filter
- buried oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662277451P | 2016-01-11 | 2016-01-11 | |
| US62/277,451 | 2016-01-11 | ||
| US15/151,285 US10256863B2 (en) | 2016-01-11 | 2016-05-10 | Monolithic integration of antenna switch and diplexer |
| US15/151,285 | 2016-05-10 | ||
| PCT/US2016/063973 WO2017123332A1 (en) | 2016-01-11 | 2016-11-29 | Monolithic integration of antenna switch and diplexer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019508878A JP2019508878A (ja) | 2019-03-28 |
| JP2019508878A5 true JP2019508878A5 (enExample) | 2019-06-13 |
| JP6692908B2 JP6692908B2 (ja) | 2020-05-13 |
Family
ID=59275018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018534945A Active JP6692908B2 (ja) | 2016-01-11 | 2016-11-29 | アンテナスイッチとダイプレクサのモノリシックな集積 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10256863B2 (enExample) |
| EP (1) | EP3403278B1 (enExample) |
| JP (1) | JP6692908B2 (enExample) |
| KR (1) | KR102085549B1 (enExample) |
| CN (1) | CN108701682B (enExample) |
| BR (1) | BR112018013958B1 (enExample) |
| CA (1) | CA3007083A1 (enExample) |
| TW (1) | TWI681536B (enExample) |
| WO (1) | WO2017123332A1 (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9825597B2 (en) | 2015-12-30 | 2017-11-21 | Skyworks Solutions, Inc. | Impedance transformation circuit for amplifier |
| US10269769B2 (en) * | 2016-04-18 | 2019-04-23 | Skyworks Solutions, Inc. | System in package with vertically arranged radio frequency componentry |
| US10062670B2 (en) | 2016-04-18 | 2018-08-28 | Skyworks Solutions, Inc. | Radio frequency system-in-package with stacked clocking crystal |
| US10297576B2 (en) | 2016-04-18 | 2019-05-21 | Skyworks Solutions, Inc. | Reduced form factor radio frequency system-in-package |
| US10362678B2 (en) | 2016-04-18 | 2019-07-23 | Skyworks Solutions, Inc. | Crystal packaging with conductive pillars |
| TWI800014B (zh) | 2016-12-29 | 2023-04-21 | 美商天工方案公司 | 前端系統及相關裝置、積體電路、模組及方法 |
| US10515924B2 (en) | 2017-03-10 | 2019-12-24 | Skyworks Solutions, Inc. | Radio frequency modules |
| US20190198461A1 (en) * | 2017-12-21 | 2019-06-27 | Qualcomm Incorporated | Forming a modified layer within a radio frequency (rf) substrate for forming a layer transferred rf filter-on-insulator wafer |
| US10580903B2 (en) | 2018-03-13 | 2020-03-03 | Psemi Corporation | Semiconductor-on-insulator transistor with improved breakdown characteristics |
| US10658386B2 (en) | 2018-07-19 | 2020-05-19 | Psemi Corporation | Thermal extraction of single layer transfer integrated circuits |
| US10573674B2 (en) | 2018-07-19 | 2020-02-25 | Psemi Corporation | SLT integrated circuit capacitor structure and methods |
| US10672806B2 (en) | 2018-07-19 | 2020-06-02 | Psemi Corporation | High-Q integrated circuit inductor structure and methods |
| KR20210077679A (ko) * | 2018-09-07 | 2021-06-25 | 르파운드리 에스.알.엘. | 낮은 기판 손실을 갖는 집적 나선형 인덕터의 제조 방법 |
| US10777636B1 (en) | 2019-06-12 | 2020-09-15 | Psemi Corporation | High density IC capacitor structure |
| US11450469B2 (en) | 2019-08-28 | 2022-09-20 | Analog Devices Global Unlimited Company | Insulation jacket for top coil of an isolated transformer |
| JP2021048565A (ja) * | 2019-09-20 | 2021-03-25 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
| JP2021052376A (ja) * | 2019-09-20 | 2021-04-01 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
| WO2021087285A1 (en) * | 2019-11-01 | 2021-05-06 | Empower Semiconductor, Inc. | Configurable capacitor |
| US11387316B2 (en) | 2019-12-02 | 2022-07-12 | Analog Devices International Unlimited Company | Monolithic back-to-back isolation elements with floating top plate |
| CN110767606B (zh) * | 2019-12-24 | 2020-04-17 | 杭州见闻录科技有限公司 | 一种具有复合功能的电子元器件及其制造方法 |
| US11503704B2 (en) * | 2019-12-30 | 2022-11-15 | General Electric Company | Systems and methods for hybrid glass and organic packaging for radio frequency electronics |
| JP2021158554A (ja) * | 2020-03-27 | 2021-10-07 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
| JP2021158556A (ja) * | 2020-03-27 | 2021-10-07 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
| TWI748451B (zh) * | 2020-05-14 | 2021-12-01 | 芯巧科技股份有限公司 | 在同一晶圓上形成複數相隔離基底層的半導體裝置製程及其半導體裝置 |
| CN111968972B (zh) * | 2020-07-13 | 2024-03-26 | 深圳市汇芯通信技术有限公司 | 一种集成芯片及其制作方法和集成电路 |
| US20220293513A1 (en) * | 2021-03-11 | 2022-09-15 | Qualcomm Incorporated | Power decoupling metal-insulator-metal capacitor |
| CN119906455B (zh) * | 2025-03-31 | 2025-07-04 | 深圳飞骧科技股份有限公司 | 射频开关芯片结构 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3924471B2 (ja) * | 2002-01-30 | 2007-06-06 | 株式会社リコー | スタンダードセルまたはマクロセルを含む半導体集積回路、およびその配置配線方法 |
| US7098070B2 (en) * | 2004-11-16 | 2006-08-29 | International Business Machines Corporation | Device and method for fabricating double-sided SOI wafer scale package with through via connections |
| US7473979B2 (en) * | 2006-05-30 | 2009-01-06 | International Business Machines Corporation | Semiconductor integrated circuit devices having high-Q wafer back-side capacitors |
| JP2008011297A (ja) * | 2006-06-30 | 2008-01-17 | Fujitsu Ltd | 撮像装置及び増幅回路 |
| US7531407B2 (en) | 2006-07-18 | 2009-05-12 | International Business Machines Corporation | Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating same |
| JP4361569B2 (ja) * | 2007-01-29 | 2009-11-11 | 株式会社リコー | スタンダードセルまたはマクロセルを含む半導体集積回路 |
| US8145172B2 (en) * | 2008-11-25 | 2012-03-27 | Silicon Laboratories Inc. | Low-cost receiver using tracking filter |
| JP2011193191A (ja) * | 2010-03-15 | 2011-09-29 | Renesas Electronics Corp | 半導体集積回路およびそれを内蔵した高周波モジュール |
| KR101881732B1 (ko) * | 2011-06-30 | 2018-07-27 | 무라타 일렉트로닉스 오와이 | 시스템-인-패키지 디바이스를 제조하는 방법 및 시스템-인-패키지 디바이스 |
| US8786079B2 (en) * | 2011-08-10 | 2014-07-22 | Skyworks Solutions, Inc. | Antenna switch modules and methods of making the same |
| US9496255B2 (en) * | 2011-11-16 | 2016-11-15 | Qualcomm Incorporated | Stacked CMOS chipset having an insulating layer and a secondary layer and method of forming same |
| US8803615B2 (en) * | 2012-01-23 | 2014-08-12 | Qualcomm Incorporated | Impedance matching circuit with tunable notch filters for power amplifier |
| TWI529939B (zh) | 2012-02-08 | 2016-04-11 | 新力股份有限公司 | High frequency semiconductor device and its manufacturing method |
| US9684127B2 (en) * | 2012-03-02 | 2017-06-20 | Purdue Research Foundation | Passive optical diode on semiconductor substrate |
| JP5865275B2 (ja) | 2013-01-25 | 2016-02-17 | 株式会社東芝 | 高周波半導体スイッチ |
| US9478507B2 (en) * | 2013-03-27 | 2016-10-25 | Qualcomm Incorporated | Integrated circuit assembly with faraday cage |
| US9634640B2 (en) | 2013-05-06 | 2017-04-25 | Qualcomm Incorporated | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
| US9548522B2 (en) | 2013-11-22 | 2017-01-17 | Skyworks Solutions, Inc. | Systems, circuits and methods related to low-loss bypass of a radio-frequency filter or diplexer |
| WO2015130670A1 (en) * | 2014-02-25 | 2015-09-03 | Skyworks Solutions, Inc. | Systems, devices and methods related to improved radio-frequency modules |
| US20160029436A1 (en) * | 2014-07-24 | 2016-01-28 | Hidria Aet | Air heater having two-piece ceramic holder and ceramic holder for air heater and methods of assembly |
| US10042376B2 (en) * | 2015-03-30 | 2018-08-07 | Tdk Corporation | MOS capacitors for variable capacitor arrays and methods of forming the same |
-
2016
- 2016-05-10 US US15/151,285 patent/US10256863B2/en active Active
- 2016-11-29 BR BR112018013958-0A patent/BR112018013958B1/pt active IP Right Grant
- 2016-11-29 WO PCT/US2016/063973 patent/WO2017123332A1/en not_active Ceased
- 2016-11-29 EP EP16819739.0A patent/EP3403278B1/en active Active
- 2016-11-29 CA CA3007083A patent/CA3007083A1/en not_active Abandoned
- 2016-11-29 CN CN201680078376.1A patent/CN108701682B/zh active Active
- 2016-11-29 KR KR1020187019299A patent/KR102085549B1/ko active Active
- 2016-11-29 JP JP2018534945A patent/JP6692908B2/ja active Active
- 2016-12-14 TW TW105141312A patent/TWI681536B/zh active
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