JP2019507972A - ３ｄガラス貫通ビアフィルタと統合された２ｄ受動オンガラスフィルタを使用するマルチプレクサ構成 - Google Patents

３ｄガラス貫通ビアフィルタと統合された２ｄ受動オンガラスフィルタを使用するマルチプレクサ構成 Download PDF

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JP2019507972A
JP2019507972A JP2018531145A JP2018531145A JP2019507972A JP 2019507972 A JP2019507972 A JP 2019507972A JP 2018531145 A JP2018531145 A JP 2018531145A JP 2018531145 A JP2018531145 A JP 2018531145A JP 2019507972 A JP2019507972 A JP 2019507972A
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Prior art keywords
band filter
substrate
multiplexer structure
passive substrate
passive
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Japanese (ja)
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JP2019507972A5 (enExample
Inventor
チャンハン・ホビー・ユン
デイク・ダニエル・キム
マリオ・フランシスコ・ヴェレス
チェンジエ・ズオ
デイヴィッド・フランシス・バーディ
ジョンヘ・キム
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クアルコム，インコーポレイテッド
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H7/463—Duplexers

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Filters And Equalizers (AREA)
  • Transceivers (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
JP2018531145A 2015-12-28 2016-12-05 ３ｄガラス貫通ビアフィルタと統合された２ｄ受動オンガラスフィルタを使用するマルチプレクサ構成 Pending JP2019507972A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562271893P 2015-12-28 2015-12-28
US62/271,893 2015-12-28
US15/067,106 2016-03-10
US15/067,106 US9954267B2 (en) 2015-12-28 2016-03-10 Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter
PCT/US2016/064962 WO2017116616A1 (en) 2015-12-28 2016-12-05 Multiplexer design using a 2d passive on glass filter integrated with a 3d through glass via filter

Publications (2)

Publication Number Publication Date
JP2019507972A true JP2019507972A (ja) 2019-03-22
JP2019507972A5 JP2019507972A5 (enExample) 2019-07-25

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JP2018531145A Pending JP2019507972A (ja) 2015-12-28 2016-12-05 ３ｄガラス貫通ビアフィルタと統合された２ｄ受動オンガラスフィルタを使用するマルチプレクサ構成

Country Status (9)

Country Link
US (1) US9954267B2 (enExample)
EP (1) EP3378160B1 (enExample)
JP (1) JP2019507972A (enExample)
KR (1) KR102093160B1 (enExample)
CN (1) CN108476014A (enExample)
BR (1) BR112018012738A2 (enExample)
CA (1) CA3004764C (enExample)
TW (1) TWI639316B (enExample)
WO (1) WO2017116616A1 (enExample)

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JPWO2020255791A1 (enExample) * 2019-06-18 2020-12-24
WO2022097492A1 (ja) * 2020-11-06 2022-05-12 株式会社村田製作所 フィルタ装置およびそれを搭載した高周波フロントエンド回路
JP2023042196A (ja) * 2021-09-14 2023-03-27 Tdk株式会社 積層型電子部品
JP2023042197A (ja) * 2021-09-14 2023-03-27 Tdk株式会社 積層型電子部品

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US10944379B2 (en) * 2016-12-14 2021-03-09 Qualcomm Incorporated Hybrid passive-on-glass (POG) acoustic filter
US20190035621A1 (en) * 2017-07-25 2019-01-31 Qualcomm Incorporated Shaped circuit wafers
US10043136B1 (en) * 2017-10-12 2018-08-07 International Business Machines Corporation Reducing the number of input lines to superconducting quantum processors installed inside dilution refrigerators
US10582609B2 (en) 2017-10-30 2020-03-03 Qualcomm Incorporated Integration of through glass via (TGV) filter and acoustic filter
JP2019106429A (ja) * 2017-12-11 2019-06-27 凸版印刷株式会社 ガラス配線基板、その製造方法及び半導体装置
TWI678952B (zh) 2017-12-13 2019-12-01 欣興電子股份有限公司 線路板結構及其製作方法
TWI669997B (zh) * 2018-01-25 2019-08-21 欣興電子股份有限公司 線路板結構及其製作方法
JP7509035B2 (ja) * 2018-05-24 2024-07-02 Ｔｏｐｐａｎホールディングス株式会社 回路基板
US10840884B2 (en) 2018-05-24 2020-11-17 Qualcomm Incorporated Bulk acoustic wave (BAW) and passive-on-glass (POG) filter co-integration
WO2020098185A1 (zh) * 2018-11-16 2020-05-22 安徽安努奇科技有限公司 频分器
US10879169B2 (en) * 2018-12-26 2020-12-29 Qualcomm Incorporated Integrated inductors for power management circuits
US11121699B2 (en) * 2019-02-19 2021-09-14 Qualcomm Incorporated Wideband filter with resonators and inductors
JP7512594B2 (ja) * 2020-01-10 2024-07-09 Ｔｏｐｐａｎホールディングス株式会社 回路基板
US11296670B2 (en) 2020-01-23 2022-04-05 Qualcomm Incorporated Impedance matching transceiver
TWI780668B (zh) * 2020-05-28 2022-10-11 日商村田製作所股份有限公司 用於半導體複合裝置之模組
US11652468B2 (en) * 2020-07-07 2023-05-16 Qualcomm Incorporated High performance tunable filter
CN112511126B (zh) * 2020-10-30 2022-03-15 诺思(天津)微系统有限责任公司 多工器和改善多工器隔离度的方法以及通信设备
CN115516761A (zh) * 2021-04-23 2022-12-23 京东方科技集团股份有限公司 集成有无源器件的基板及其制备方法
WO2023177581A1 (en) * 2022-03-17 2023-09-21 Northrop Grumman Systems Corporation Acoustic resonator filter bank system
WO2024040517A1 (zh) * 2022-08-25 2024-02-29 京东方科技集团股份有限公司 滤波器及其制备方法、电子设备
US20240429587A1 (en) * 2023-06-22 2024-12-26 Qualcomm Incorporated Low emission three-dimensional frequency multiplexer

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JP2004072582A (ja) * 2002-08-08 2004-03-04 Matsushita Electric Ind Co Ltd 高周波デバイス
JP2006203652A (ja) * 2005-01-21 2006-08-03 Kyocera Corp 高周波モジュール及びそれを用いた通信機器
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US20140354372A1 (en) * 2013-06-04 2014-12-04 Qualcomm Incorporated Systems for reducing magnetic coupling in integrated circuits (ics), and related components and methods
JP2015029238A (ja) * 2013-07-31 2015-02-12 株式会社村田製作所 デュプレクサ

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US7135943B2 (en) 2004-07-11 2006-11-14 Chi Mei Communication Sytems, Inc. Diplexer formed in multi-layered substrate
US9048112B2 (en) * 2010-06-29 2015-06-02 Qualcomm Incorporated Integrated voltage regulator with embedded passive device(s) for a stacked IC
US20120190152A1 (en) * 2011-01-25 2012-07-26 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for Fabricating Integrated Passive Devices on Glass Substrates
US8736399B2 (en) 2011-04-06 2014-05-27 M/A-Com Technology Solutions Holdings, Inc. Triplexer topology
US8666338B2 (en) * 2012-01-23 2014-03-04 Qualcomm Incorporated Multi-mode bypass driver amplifier with tunable load matching
US8803615B2 (en) * 2012-01-23 2014-08-12 Qualcomm Incorporated Impedance matching circuit with tunable notch filters for power amplifier
US9331720B2 (en) * 2012-01-30 2016-05-03 Qualcomm Incorporated Combined directional coupler and impedance matching circuit
US8884717B2 (en) 2012-04-13 2014-11-11 Cyntec Co., Ltd. Diplexer
CN103490793B (zh) * 2012-06-12 2015-08-19 太阳诱电株式会社 高频电路模块
US9203373B2 (en) 2013-01-11 2015-12-01 Qualcomm Incorporated Diplexer design using through glass via technology
US9935166B2 (en) 2013-03-15 2018-04-03 Qualcomm Incorporated Capacitor with a dielectric between a via and a plate of the capacitor
US9425761B2 (en) * 2013-05-31 2016-08-23 Qualcomm Incorporated High pass filters and low pass filters using through glass via technology
US9906318B2 (en) 2014-04-18 2018-02-27 Qualcomm Incorporated Frequency multiplexer
US9847804B2 (en) * 2014-04-30 2017-12-19 Skyworks Solutions, Inc. Bypass path loss reduction

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JP2003318701A (ja) * 2002-04-24 2003-11-07 Sanyo Electric Co Ltd 分波器
JP2004072582A (ja) * 2002-08-08 2004-03-04 Matsushita Electric Ind Co Ltd 高周波デバイス
JP2006203652A (ja) * 2005-01-21 2006-08-03 Kyocera Corp 高周波モジュール及びそれを用いた通信機器
WO2010047031A1 (ja) * 2008-10-24 2010-04-29 株式会社 村田製作所 電子部品、およびその製造方法
US20140354372A1 (en) * 2013-06-04 2014-12-04 Qualcomm Incorporated Systems for reducing magnetic coupling in integrated circuits (ics), and related components and methods
JP2015029238A (ja) * 2013-07-31 2015-02-12 株式会社村田製作所 デュプレクサ

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2020255791A1 (enExample) * 2019-06-18 2020-12-24
WO2020255791A1 (ja) * 2019-06-18 2020-12-24 凸版印刷株式会社 Ｌｃ共振回路を有する多層配線基板、およびｌｃ共振回路を有する多層配線基板を用いた電子部品パッケージ
US12101074B2 (en) 2019-06-18 2024-09-24 Toppan Inc. Multilayer circuit board with LC resonant circuit and electronic component package including multilayer circuit board with LC resonant circuit
JP7609067B2 (ja) 2019-06-18 2025-01-07 Ｔｏｐｐａｎホールディングス株式会社 Ｌｃ共振回路を有する多層配線基板、およびｌｃ共振回路を有する多層配線基板を用いた電子部品パッケージ
WO2022097492A1 (ja) * 2020-11-06 2022-05-12 株式会社村田製作所 フィルタ装置およびそれを搭載した高周波フロントエンド回路
JPWO2022097492A1 (enExample) * 2020-11-06 2022-05-12
JP7524966B2 (ja) 2020-11-06 2024-07-30 株式会社村田製作所 フィルタ装置およびそれを搭載した高周波フロントエンド回路
US12407318B2 (en) 2020-11-06 2025-09-02 Murata Manufacturing Co., Ltd. Filter device and high-frequency front end circuit having same mounted thereon
JP2023042196A (ja) * 2021-09-14 2023-03-27 Tdk株式会社 積層型電子部品
JP2023042197A (ja) * 2021-09-14 2023-03-27 Tdk株式会社 積層型電子部品
JP7712828B2 (ja) 2021-09-14 2025-07-24 Tdk株式会社 積層型電子部品
JP7737274B2 (ja) 2021-09-14 2025-09-10 Tdk株式会社 積層型電子部品

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WO2017116616A1 (en) 2017-07-06
CA3004764A1 (en) 2017-07-06
CA3004764C (en) 2021-01-26
US20170187345A1 (en) 2017-06-29
TWI639316B (zh) 2018-10-21
EP3378160A1 (en) 2018-09-26
US9954267B2 (en) 2018-04-24
CN108476014A (zh) 2018-08-31
KR102093160B1 (ko) 2020-03-25
BR112018012738A2 (pt) 2018-12-04
KR20180097539A (ko) 2018-08-31
TW201733280A (zh) 2017-09-16
EP3378160B1 (en) 2019-04-24

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