CN108476014A - 使用与3d贯穿玻璃通孔滤波器集成的2d无源玻璃滤波器的多路复用器设计 - Google Patents

使用与3d贯穿玻璃通孔滤波器集成的2d无源玻璃滤波器的多路复用器设计 Download PDF

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Publication number
CN108476014A
CN108476014A CN201680076967.5A CN201680076967A CN108476014A CN 108476014 A CN108476014 A CN 108476014A CN 201680076967 A CN201680076967 A CN 201680076967A CN 108476014 A CN108476014 A CN 108476014A
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CN
China
Prior art keywords
band filter
substrate
low
passive
multiplexer structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680076967.5A
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English (en)
Chinese (zh)
Inventor
C·H·芸
D·D·金
M·F·维勒兹
左丞杰
D·F·伯迪
金钟海
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Qualcomm Inc
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Qualcomm Inc
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Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN108476014A publication Critical patent/CN108476014A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H7/463—Duplexers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Filters And Equalizers (AREA)
  • Transceivers (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
CN201680076967.5A 2015-12-28 2016-12-05 使用与3d贯穿玻璃通孔滤波器集成的2d无源玻璃滤波器的多路复用器设计 Pending CN108476014A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562271893P 2015-12-28 2015-12-28
US62/271,893 2015-12-28
US15/067,106 2016-03-10
US15/067,106 US9954267B2 (en) 2015-12-28 2016-03-10 Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter
PCT/US2016/064962 WO2017116616A1 (en) 2015-12-28 2016-12-05 Multiplexer design using a 2d passive on glass filter integrated with a 3d through glass via filter

Publications (1)

Publication Number Publication Date
CN108476014A true CN108476014A (zh) 2018-08-31

Family

ID=59088028

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680076967.5A Pending CN108476014A (zh) 2015-12-28 2016-12-05 使用与3d贯穿玻璃通孔滤波器集成的2d无源玻璃滤波器的多路复用器设计

Country Status (9)

Country Link
US (1) US9954267B2 (enExample)
EP (1) EP3378160B1 (enExample)
JP (1) JP2019507972A (enExample)
KR (1) KR102093160B1 (enExample)
CN (1) CN108476014A (enExample)
BR (1) BR112018012738A2 (enExample)
CA (1) CA3004764C (enExample)
TW (1) TWI639316B (enExample)
WO (1) WO2017116616A1 (enExample)

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CN114208405A (zh) * 2019-06-18 2022-03-18 凸版印刷株式会社 具有lc谐振电路的多层配线基板以及利用具有lc谐振电路的多层配线基板的电子元件封装
WO2022222124A1 (zh) * 2021-04-23 2022-10-27 京东方科技集团股份有限公司 集成有无源器件的基板及其制备方法
WO2023177581A1 (en) * 2022-03-17 2023-09-21 Northrop Grumman Systems Corporation Acoustic resonator filter bank system
WO2024040517A1 (zh) * 2022-08-25 2024-02-29 京东方科技集团股份有限公司 滤波器及其制备方法、电子设备

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US10944379B2 (en) * 2016-12-14 2021-03-09 Qualcomm Incorporated Hybrid passive-on-glass (POG) acoustic filter
US20190035621A1 (en) * 2017-07-25 2019-01-31 Qualcomm Incorporated Shaped circuit wafers
US10043136B1 (en) * 2017-10-12 2018-08-07 International Business Machines Corporation Reducing the number of input lines to superconducting quantum processors installed inside dilution refrigerators
US10582609B2 (en) 2017-10-30 2020-03-03 Qualcomm Incorporated Integration of through glass via (TGV) filter and acoustic filter
JP2019106429A (ja) * 2017-12-11 2019-06-27 凸版印刷株式会社 ガラス配線基板、その製造方法及び半導体装置
TWI678952B (zh) 2017-12-13 2019-12-01 欣興電子股份有限公司 線路板結構及其製作方法
TWI669997B (zh) * 2018-01-25 2019-08-21 欣興電子股份有限公司 線路板結構及其製作方法
JP7509035B2 (ja) * 2018-05-24 2024-07-02 Ｔｏｐｐａｎホールディングス株式会社 回路基板
US10840884B2 (en) 2018-05-24 2020-11-17 Qualcomm Incorporated Bulk acoustic wave (BAW) and passive-on-glass (POG) filter co-integration
WO2020098185A1 (zh) * 2018-11-16 2020-05-22 安徽安努奇科技有限公司 频分器
US10879169B2 (en) * 2018-12-26 2020-12-29 Qualcomm Incorporated Integrated inductors for power management circuits
JP7512594B2 (ja) * 2020-01-10 2024-07-09 Ｔｏｐｐａｎホールディングス株式会社 回路基板
US11296670B2 (en) 2020-01-23 2022-04-05 Qualcomm Incorporated Impedance matching transceiver
TWI780668B (zh) * 2020-05-28 2022-10-11 日商村田製作所股份有限公司 用於半導體複合裝置之模組
US11652468B2 (en) * 2020-07-07 2023-05-16 Qualcomm Incorporated High performance tunable filter
CN112511126B (zh) * 2020-10-30 2022-03-15 诺思(天津)微系统有限责任公司 多工器和改善多工器隔离度的方法以及通信设备
JP7524966B2 (ja) * 2020-11-06 2024-07-30 株式会社村田製作所 フィルタ装置およびそれを搭載した高周波フロントエンド回路
JP7712828B2 (ja) * 2021-09-14 2025-07-24 Tdk株式会社 積層型電子部品
JP7737274B2 (ja) * 2021-09-14 2025-09-10 Tdk株式会社 積層型電子部品
US20240429587A1 (en) * 2023-06-22 2024-12-26 Qualcomm Incorporated Low emission three-dimensional frequency multiplexer

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WO2014197364A1 (en) * 2013-06-04 2014-12-11 Qualcomm Incorporated SYSTEMS FOR REDUCING MAGNETIC COUPLING IN INTEGRATED CIRCUITS (ICs), AND RELATED COMPONENTS AND METHODS

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113439390A (zh) * 2019-02-19 2021-09-24 高通股份有限公司 使用过基板通孔或过模具通孔以及rdl来实现的baw滤波器和3d电感器的共同封装
CN114208405A (zh) * 2019-06-18 2022-03-18 凸版印刷株式会社 具有lc谐振电路的多层配线基板以及利用具有lc谐振电路的多层配线基板的电子元件封装
CN114208405B (zh) * 2019-06-18 2024-11-08 凸版印刷株式会社 具有lc谐振电路的多层配线基板以及利用具有lc谐振电路的多层配线基板的电子元件封装
WO2022222124A1 (zh) * 2021-04-23 2022-10-27 京东方科技集团股份有限公司 集成有无源器件的基板及其制备方法
US12324169B2 (en) 2021-04-23 2025-06-03 Boe Technology Group Co., Ltd. Substrate integrated with passive device and method for manufacturing the same
WO2023177581A1 (en) * 2022-03-17 2023-09-21 Northrop Grumman Systems Corporation Acoustic resonator filter bank system
US12451867B2 (en) 2022-03-17 2025-10-21 Northrop Grumman Systems Corporation Acoustic resonator filter bank system
WO2024040517A1 (zh) * 2022-08-25 2024-02-29 京东方科技集团股份有限公司 滤波器及其制备方法、电子设备

Also Published As

Publication number Publication date
WO2017116616A1 (en) 2017-07-06
JP2019507972A (ja) 2019-03-22
CA3004764A1 (en) 2017-07-06
CA3004764C (en) 2021-01-26
US20170187345A1 (en) 2017-06-29
TWI639316B (zh) 2018-10-21
EP3378160A1 (en) 2018-09-26
US9954267B2 (en) 2018-04-24
KR102093160B1 (ko) 2020-03-25
BR112018012738A2 (pt) 2018-12-04
KR20180097539A (ko) 2018-08-31
TW201733280A (zh) 2017-09-16
EP3378160B1 (en) 2019-04-24

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