JP2019505092A5 - - Google Patents
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- JP2019505092A5 JP2019505092A5 JP2018536478A JP2018536478A JP2019505092A5 JP 2019505092 A5 JP2019505092 A5 JP 2019505092A5 JP 2018536478 A JP2018536478 A JP 2018536478A JP 2018536478 A JP2018536478 A JP 2018536478A JP 2019505092 A5 JP2019505092 A5 JP 2019505092A5
- Authority
- JP
- Japan
- Prior art keywords
- heater
- spatially adjustable
- temperature
- controller
- heating elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000010438 heat treatment Methods 0.000 claims description 76
- 229910052751 metal Inorganic materials 0.000 claims description 47
- 239000002184 metal Substances 0.000 claims description 47
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 13
- 238000009529 body temperature measurement Methods 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 11
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- 229910052697 platinum Inorganic materials 0.000 claims description 6
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 11
- 230000001105 regulatory effect Effects 0.000 description 11
- 239000000835 fiber Substances 0.000 description 8
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 7
- 238000005240 physical vapour deposition Methods 0.000 description 7
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 7
- 229910052721 tungsten Inorganic materials 0.000 description 7
- 239000010937 tungsten Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
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- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 4
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- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 229920005570 flexible polymer Polymers 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910001120 nichrome Inorganic materials 0.000 description 4
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- 238000007747 plating Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
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- 238000005259 measurement Methods 0.000 description 2
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- 229910052759 nickel Inorganic materials 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920001084 poly(chloroprene) Polymers 0.000 description 2
- 229920006260 polyaryletherketone Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 238000001947 vapour-phase growth Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
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- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
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- 238000000151 deposition Methods 0.000 description 1
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- 238000000206 photolithography Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000013641 positive control Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023010117A JP7780852B2 (ja) | 2016-01-22 | 2023-01-26 | マルチゾーン静電チャックのためのセンサシステム |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662286064P | 2016-01-22 | 2016-01-22 | |
| US62/286,064 | 2016-01-22 | ||
| US15/409,362 | 2017-01-18 | ||
| US15/409,362 US10582570B2 (en) | 2016-01-22 | 2017-01-18 | Sensor system for multi-zone electrostatic chuck |
| PCT/US2017/014233 WO2017127611A1 (en) | 2016-01-22 | 2017-01-20 | Sensor system for multi-zone electrostatic chuck |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023010117A Division JP7780852B2 (ja) | 2016-01-22 | 2023-01-26 | マルチゾーン静電チャックのためのセンサシステム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019505092A JP2019505092A (ja) | 2019-02-21 |
| JP2019505092A5 true JP2019505092A5 (enExample) | 2021-10-14 |
| JP7253922B2 JP7253922B2 (ja) | 2023-04-07 |
Family
ID=59360775
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018536478A Active JP7253922B2 (ja) | 2016-01-22 | 2017-01-20 | マルチゾーン静電チャックのためのセンサシステム |
| JP2023010117A Active JP7780852B2 (ja) | 2016-01-22 | 2023-01-26 | マルチゾーン静電チャックのためのセンサシステム |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023010117A Active JP7780852B2 (ja) | 2016-01-22 | 2023-01-26 | マルチゾーン静電チャックのためのセンサシステム |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10582570B2 (enExample) |
| JP (2) | JP7253922B2 (enExample) |
| KR (2) | KR20250079252A (enExample) |
| CN (2) | CN117198968A (enExample) |
| TW (2) | TWI771859B (enExample) |
| WO (1) | WO2017127611A1 (enExample) |
Families Citing this family (60)
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| JP6335341B2 (ja) * | 2014-07-23 | 2018-05-30 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 可変型温度制御式基板支持アセンブリ |
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| US9779974B2 (en) * | 2015-06-22 | 2017-10-03 | Lam Research Corporation | System and method for reducing temperature transition in an electrostatic chuck |
| US10381248B2 (en) | 2015-06-22 | 2019-08-13 | Lam Research Corporation | Auto-correction of electrostatic chuck temperature non-uniformity |
| JP6775997B2 (ja) * | 2016-05-13 | 2020-10-28 | 株式会社エンプラス | 電気部品用ソケット |
| US10908195B2 (en) * | 2016-06-15 | 2021-02-02 | Watlow Electric Manufacturing Company | System and method for controlling power to a heater |
| US11621180B2 (en) * | 2016-10-31 | 2023-04-04 | Nissin Ion Equipment Co., Ltd. | Heating device |
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| KR102944324B1 (ko) | 2019-02-15 | 2026-03-25 | 램 리써치 코포레이션 | 멀티-패터닝 프로세스들을 위한 멀티-존 가열된 기판 지지부를 사용한 트리밍 및 증착 프로파일 제어 |
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2017
- 2017-01-18 US US15/409,362 patent/US10582570B2/en active Active
- 2017-01-19 TW TW110100240A patent/TWI771859B/zh active
- 2017-01-19 TW TW106101829A patent/TWI717453B/zh active
- 2017-01-20 KR KR1020257017869A patent/KR20250079252A/ko active Pending
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- 2017-01-20 CN CN202311247052.4A patent/CN117198968A/zh active Pending
- 2017-01-20 KR KR1020187024255A patent/KR102817112B1/ko active Active
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- 2017-01-20 WO PCT/US2017/014233 patent/WO2017127611A1/en not_active Ceased
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