JP2019504512A - プリント回路の表面仕上げ、使用方法、及びそれから製造されるアセンブリ - Google Patents
プリント回路の表面仕上げ、使用方法、及びそれから製造されるアセンブリ Download PDFInfo
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Abstract
Description
本出願は、「A NOVEL ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) SURFACE FINISH FOR BETTER RELIABILITY OF ELECTRONIC ASSEMBLIES」と題する2016年1月8日出願(整理番号3037−001−02)の米国仮特許出願第62/276,485号の優先権を主張し、その内容は、本明細書の開示と矛盾しない範囲で参照により本明細書に組み込まれる。
手順の例は、次の工程を含む。
1.圧縮空気を使用して、部品からほこりや金属粒子を除去する。
2.部品をアセトン浴に60秒間浸漬する。
3.取り出したら直ちに70%イソプロピルアルコール溶液に15秒間浸漬する。
4.流水下でイソプロピルアルコールを洗い流す。
5.脱イオン(DI)水浴中に部品を浸漬して、180秒間超音波処理する。
6.脱イオン水浴から部品を取り出して、水滴がなくなるまで圧縮空気で余分な水を除去する。
7.部品を17.5%硝酸溶液中に60秒間浸漬する。
8.部品を5%硫酸溶液中に30秒間浸漬する。
9.5%硫酸溶液から部品を取り出し、脱イオン水を流しながらすすぐ。
10.成分を脱イオン水浴中に浸漬して、180秒間超音波処理する。
11.脱イオン水浴から部品を取り除き、圧縮空気で完全に乾燥する。
12.活性化及びめっき工程で処理する準備ができるまで、糸くずの出ない布ですぐに部品を完全に覆う。
13.パラジウム系溶液(0.1g/L PdCl2、1ml/L HCl(濃度37%))(供給時の濃度で使用)(室温で使用)を用いて、Pd溶液含有浴中に部品を短時間浸漬する。部品を非常に短時間、2秒以下の間だけ浸漬し、直ちに取り出す。
14.取り出した後、すぐに部品を脱イオン水浴中に浸漬し、浴中で部品を10秒間攪拌して、部品の表面から残ったPd溶液の大部分を除去する。
15.部品を浴から取り除き、加圧した水のジェットを用いて十分にすすぎ、部品のあらゆる部分をきれいにする。
16.この徹底したすすぎを繰り返す。徹底したすすぎは非常に重要である。部品表面上に残渣が残ってはならない。
式中、R1は、C18以下の第1の置換又は非置換の脂肪族基であり、
式中、R2は、C18以下の第2の置換又は非置換の脂肪族基であり、
式中、R3は、C18以下の第3の置換又は非置換の脂肪族基であり、
式中、A1は、置換又は非置換の芳香族基であり、
式中、A2は、第2の置換又は非置換の芳香族基であり、
式中、A3は、第3の置換又は非置換の芳香族基である。
従来のENIG表面処理の類似の画像の金層は、金層が部分的に互いに垂直にずれて不連続であることを示す)。薄い金属間化合物領域602が金層110のすぐ下にある。無電解ニッケル層106は、画像の下部まで延在している。
式中、R1は、C18以下の第1の置換又は非置換の脂肪族基であり、
式中、R2は、C18以下の第2の置換又は非置換の脂肪族基であり、
式中、R3は、C18以下の第3の置換又は非置換の脂肪族基であり、
式中、A1は、置換又は非置換の芳香族基であり、
式中、A2は、第2の置換又は非置換の芳香族基であり、
式中、A3は、第3の置換又は非置換の芳香族基である。
Claims (51)
- 電気回路アセンブリを製造する方法であって、
基材を入手することであって、前記基材の少なくとも一部は導電材料層を備える、基材を入手することと、
マスクを前記基材の前記表面に施すことであって、前記マスクは個々の導電体を更に画定する導電体領域を画定するために選択される、マスクを前記基材の前記表面に施すことと、
ニッケルを前記マスクによって画定される前記導電体領域上に施すことと、
バリア層を前記ニッケル上へ施すことであって、前記バリア層は反応性窒素含有分子の少なくとも一部を含む、バリア層を前記ニッケル上へ施すことと、を含む、方法。 - 前記個々の導電体が前記導電材料層上にニッケル−バリア層−金(NBG)表面処理を備えるように、前記バリア層上へ金層を施すことを更に含む、請求項1に記載の方法。
- 前記バリア層上に前記金層を施すことは浸漬コーティングを含む、請求項2に記載の方法。
- 前記バリア層上に前記金層を施すことは前記金を電気めっきすることを含む、請求項2に記載の方
法。 - 前記施されたニッケルもバリア層も担持しない前記導電材料層の露出領域をエッチングし、個々の導電体を形成することを更に含む、請求項1に記載の方法。
- 金層を施す前にエッチングを実行する、請求項5に記載の方法。
- 金層を施す後にエッチングを実行する、請求項5に記載の方法。
- 前記マスクを介して活性化剤を前記導電材料上へ施し、前記個々の導電体を画定することと、
前記マスクを取り除くことと、を更に含み、
前記ニッケルを施すことは、無電解ニッケルを前記導電材料層に施された前記活性化剤要素へ施すことを含む、請求項1に記載の方法。 - 前記活性化剤要素を施すことは、前記マスクされた基材をパラジウム溶液へ十分な時間曝して前記
導電体領域の浸漬コーティングを実施することを含み、前記浸漬コーティングはパラジウム原子の薄
層を備える活性化剤要素を施す結果となり、
無電解ニッケルを施すことは、ニッケル合金を前記活性化剤要素へ接着することを含む、請求項8に記載の方法。 - ニッケルを施すことは、前記マスクによって覆われていない前記導電体領域上に前記ニッケルを電
気めっきすることを含む、請求項1に記載の方法。 - 前記基材は繊維ガラス強化エポキシ材料を含む、請求項1に記載の方法。
- 前記基材はポリイミド材料を含む、請求項1に記載の方法。
- 前記導電材料層の露出部分は銅を含む、請求項1に記載の方法。
- 前記基材は半導体を備える、請求項1に記載の方法。
- 前記導電材料層の露出部分はアルミニウムを含む、請求項14に記載の方法。
- 無電解ニッケル、バリア層、及び金を含む前記導電体領域上にはんだペーストのパターンを塗布することであって、前記はんだペーストのパターンは部品実装パッドに対応する、はんだペーストのパターンを塗布することと、
複数の表面実装部品を選び取り、前記部品実装パッド上へ配置することと、
前記はんだペーストをリフローさせて、前記導電体領域と前記表面実装部品との間でそれぞれのはんだ接合部を形成して電気回路を形成することと、
前記電気回路を冷却して洗浄することと、を更に含む請求項1に記載の方法。 - 前記はんだ接合部は、前記バリア層なしで製造されるはんだ接合部と比較して高いリン濃度を有す
る領域の減少により特徴付けられる、請求項16に記載の方法。 - 前記はんだ接合部は、前記バリア層なしで製造されるはんだ接合部と比較して金属間化合物のより
狭い領域によって特徴付けられる、請求項16に記載の方法。 - 前記はんだ接合部は、前記バリア層なしで製造されるはんだ接合部と比較して脆性破壊の可能性の減少によって特徴付けられる、請求項16に記載の方法。
- 前記バリア層を前記ニッケルへ施すことは、
反応性窒素含有分子の水溶液を調製することと、
前記反応性窒素含有分子の前記水溶液を前記ニッケルに曝すことと、を含む、請求項1に記載の方法。 - 前記反応性窒素含有分子の前記水溶液を調製することは、pHを約12に調整することと、
前記反応性窒素含有分子の前記水溶液を曝しながら、前記水溶液の温度を30〜80℃に維持することを更に含むことと、を含む、請求項20に記載の方法。 - 前記反応性窒素含有分子の前記水溶液が5〜40分間前記ニッケルに曝される、請求項20に記載
の方法。 - 反応性窒素含有分子の水溶液を調製することは、芳香族アミンの水溶液を調製することを含む、請求項20に記載の方法。
- 反応性窒素含有分子の水溶液を調製することは、脂肪族アミンの水溶液を調製することを含む、請求項20に記載の方法。
- 脂肪族アミンの水溶液を調製することは、0.1〜1モル濃度の1,4−ジアミンブタンの溶液を
調製することを含む、請求項24に記載の方法。 - 反応性窒素含有分子の水溶液を調製することは、アミン置換シロキサンの水溶液を調製することを
含む、請求項20に記載の方法。 - 前記バリア層を前記ニッケルへ施すことは、
前記反応性窒素含有分子を蒸気中に溶解させることと、
前記窒素含有分子を前記蒸気から前記ニッケル上に凝結させることと、を含む、請求項1に記載の方法。 - 前記バリア層を前記ニッケルへ施すことは、
転写フィルムによって支持されるポリマーマトリックス中に前記反応性窒素含有分子を埋め込むことと、
前記窒素含有分子を前記ポリマーマトリックスから拡散させて前記ニッケル上に凝縮させるために、前記転写フィルムに熱を加えることと、を含む、請求項1に記載の方法。 - 前記バリア層は、前記ニッケル層が形成された後に前記ニッケル上に前記ニッケルとは別に施され
る、請求項1に記載の方法。 - 組成物であって、
脱イオン水と、
前記脱イオン水溶液中に0.1〜1.0モル濃度の濃度で3〜9個の炭素を有するジアミン又はトリアミンと、
前記脱イオン水中で11〜13のpHにするのに十分な濃度の水酸化アンモニウムと、を含む、組成物。 - 前記ジアミン又はトリアミンが1,4ジアミンブタンを含む、請求項30に記載の組成物。
- 前記ジアミン又はトリアミンがジエチレントリアミンを含む、請求項30に記載の組成物。
- 前記水酸化アンモニウムはpH12をもたらすのに十分な濃度である、請求項30に記載の組成物。
- 請求項1に記載の方法に従って製造される電気回路アセンブリを備える、電子デバイス。
- 衝撃及び/又は振動に対する耐性が改善された電気製品であって、
複数の露出する導電パッドを支持する誘電体基材と、
前記複数の露出する導電パッドの少なくとも一部にはんだ付けされた複数の表面実装電気部品と、を備え、
前記複数の露出する導電パッドは、銅から形成される第1の金属層と、
前記銅の上に形成される無電解ニッケルと、
前記無電解ニッケル上に堆積されるアルキルアミンを含むバリア層と、を備える、電気製品。 - 前記複数の露出する導電パッドは、
前記無電解ニッケル及び前記バリア層上に施される浸漬コーティングされる金を更に備える、請求項35に記載の電気製品。 - 光通信製品であって、
半導体ダイと、
前記半導体ダイ上に配置される平面金属領域であって、
アルミニウムから形成される第1の金属層と、
前記アルミニウム上に形成される無電解ニッケルと、
前記無電解ニッケル上に堆積されるアルキルアミンを含むバリア層と、
前記無電解ニッケル及び前記バリア層上に形成される浸漬金層と、を備える平面金属領域と、
前記平面金属領域の上に形成される導波路と、を備える、光通信製品。 - 組成物であって、
少なくとも1つの追加の金属を含む導体層のすぐ上にある無電解ニッケル(Ni−P)−バリア層−金(Au)表面処理を含み、
導電パッド構造体として表される前記表面処理は、無電解ニッケル浸漬金(ENIG)表面仕上げと比較して、その表面近傍での高い炭素濃度、及びその表面近傍でのより限定された金濃度を有する、組成物。 - 実質的に連続するAu層を更に備える、請求項38に記載の組成物。
- 前記金と前記無電解ニッケルとの間に連続する金属間化合物層を更に備える、請求項39に記載の
組成物。 - 前記バリア層は、少なくとも1つの反応性窒素含有分子を含む水溶液から堆積される、請求項38
に記載の組成物。 - 前記バリア層は、
R1−NH2、NH2−R1−NH2、NH2−R1−NH2NH2、NH2−R1−NH2−R2−NH2、R1−N−R2H、R1−N−R2R3、A1−NH2、NH2−A1−NH2、NH2−A1−NH2NH2、A1−N−A2H、A1−N−A2A3、A1−N−R1H、A1−N−A2R1、A1−N−R1R2、NH2置換シロキサン、及びアミン置換シロキサン
(式中、R1は、C18以下の第1の置換又は非置換の脂肪族基であり、
式中、R2は、C18以下の第2の置換又は非置換の脂肪族基であり、
式中、R3は、C18以下の第3の置換又は非置換の脂肪族基であり、
式中、A1は、置換又は非置換の芳香族基であり、
式中、A2は、第2の置換又は非置換の芳香族基であり、
式中、A3は、第3の置換又は非置換の芳香族基である)からなる群に対応する少なくとも1つの反応性窒素含有分子を含む水溶液から堆積される、請求項41に記載の組成物。 - 前記窒素含有分子は1〜6個の炭素原子を含む、請求項42に記載の組成物。
- 前記窒素含有分子は3〜5個の炭素原子を含む、請求項43に記載の組成物。
- 前記窒素含有分子は1,4ジアミンブタンを含む、請求項41に記載の組成物。
- 前記窒素含有分子はジエチレントリアミンを含む、請求項41に記載の組成物。
- 前記水溶液は更に水酸化アンモニウムを含む、請求項41に記載の組成物。
- 前記水溶液は、pHが約12に平衡する、請求項41に記載の組成物。
- 前記水溶液は乳化剤を含む、請求項41に記載の組成物。
- 前記少なくとも1つの追加の金属は銅を含む、請求項38に記載の組成物。
- 前記少なくとも1つの追加の金属はアルミニウムを含む、請求項38に記載の組成物。
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US10902967B2 (en) | 2021-01-26 |
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