JP5755231B2 - 錫及び錫合金の無電解めっき法 - Google Patents
錫及び錫合金の無電解めっき法 Download PDFInfo
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- JP5755231B2 JP5755231B2 JP2012525940A JP2012525940A JP5755231B2 JP 5755231 B2 JP5755231 B2 JP 5755231B2 JP 2012525940 A JP2012525940 A JP 2012525940A JP 2012525940 A JP2012525940 A JP 2012525940A JP 5755231 B2 JP5755231 B2 JP 5755231B2
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
Description
本発明は、プリント回路板、IC基板、半導体ウェハなどの製造における最終仕上げとしての錫及び錫合金の無電解めっき法に関する。
錫表面は、最終仕上げとしてプリント回路板、IC基板、半導体ウェハ及び関連素子の製造に使用されており、即ち、その後の組立て段階のためのはんだ付け可能な又は接着可能な表面として働く。錫は最も基板の銅の造形上へ堆積されており、これを接触パッドと呼ぶ。本出願のために選択される方法は、最も一般的に適用される方法として浸漬めっきを伴う無電解めっき法による錫の堆積である。銅表面上への錫又は錫合金の浸漬めっき法は、交換反応、セメント合着又は置換めっきとも呼ばれ、以下の式(1)の通りである:
Sn2++2Cu→Sn+2Cu+ (1)
本発明の課題は、錫及び錫合金の層、特に1μm以上の厚さを有する層を、銅接触パッド上に浸漬めっきする方法であって、a)錫及び錫合金の堆積の間の接触パッドからの銅の溶解を最小限にしながら、b)はんだの信頼性を低下させる、電気めっき銅と無電解めっき銅の界面を形成しない、前記方法を提供することである。
この課題は、(i)銅接触パッドを有する表面、及び前記接触パッドの表面を曝露する開口部を有するはんだマスクの層を基板に提供する工程、(ii)銅の犠牲層を無電解めっきによって接触パッドに堆積させる工程及び(iii)錫又は錫合金を、工程(ii)で堆積された銅の犠牲層上に浸漬めっきによって堆積させる工程を含む、錫又は錫合金の無電解めっき法であって、前記銅の犠牲層が錫又は錫合金の浸漬めっきの間に完全に溶解することを特徴とする、前記無電解めっき法によって達成される。
図1は、無電解めっきによって堆積された銅層が、錫又は錫合金の浸漬めっきの間に完全に溶解する、本発明の請求項1に記載の方法を示す。
101 基板
102 接触パッド
103 銅の犠牲層
104 錫又は錫合金の層
105 はんだマスク層
本発明による錫及び錫合金の無電解めっき法は、
(i)接触パッド102及び前記パッド102の表面を曝露するはんだマスク層105を有する基板101を提供する工程、
(ii)無電解めっきによって銅の犠牲層103を接触パッド102上に堆積させる工程及び
(iii)錫又は錫合金層104を、浸漬めっきによって、工程(ii)で堆積された銅の犠牲層103上に堆積させる工程
を含み、その際、工程(ii)で堆積された銅の犠牲層103は、工程(iii)での錫又は錫合金層104の堆積の間に完全に溶解する。
本発明をここで、以下の限定されない実施例を参照して例証する。
層厚さの測定
無電解めっきによって堆積された錫及び銅層の厚さを、市販のX線けい光(XRF)ツールを使用して監視した。更に、回路基板試料を断面し且つ上記層の厚さを、光学顕微鏡を用いて調査した。
はんだ継手の信頼性を、ハンダボール(450μmの直径を有するIndium SAC305ボール)を、錫表面及び400μmの直径及び印刷フラックス(Alpha WS9160−M7)を有する接触パッドの上に配置することによって試験した。試験片を、典型的な鉛のないはんだ形材において窒素雰囲気下でリフローした。次いではんだ継ぎ手信頼性を、熟成の前及び後にソルダパンプをせん断分離することによって決定した。得られる平均的な剪断力をグラムで示す。
破損モード1 → 5%未満のはんだ継手界面での破損、最も望ましい。
破損モード2 → 5〜25%のはんだ継手界面での破損、やや望ましい。
基板の接触パッドを、洗浄及びエッチング後に浸漬錫めっきした。
接触パッドの表面を洗浄及びエッチングした後、銅の層を無電解めっき浴から堆積させ、その後、無電解めっきした銅表面の活性化及び錫の浸漬めっきを行った。
接触パッドの表面を洗浄及びエッチングした後、銅の層を無電解めっき浴から堆積させ、その後、無電解めっきした銅表面の活性化及び錫の浸漬めっきを行った。
Claims (5)
- (i)銅の接触パッドを有する基板及び前記接触パッドを曝露するはんだマスク層を提供する工程、
(ii)銅の犠牲層を、無電解めっき法によって銅の接触パッドの上に堆積させる工程及び
(iii)錫又は錫合金を、浸漬めっき法によって、工程(ii)で堆積された銅の犠牲層の上に堆積させる工程
を含む、錫及び錫合金の無電解めっき法であって、
厚さ比が0.3〜0.7の範囲であり且つ
ここで規定される厚さ比が、工程(ii)での堆積直後の銅の犠牲層の厚さと、工程(iii)で堆積された錫又は錫合金層の厚さとの比であり、
工程(iii)で堆積された錫又は錫合金の厚さが1μm〜10μmの範囲である、前記無電解めっき法。 - 銅の犠牲層が完全に溶解し、さらに工程(iii)において錫めっき層厚さの50%以下の銅接触パッドの一部が溶解する、請求項1記載の方法。
- 錫合金がSn−Ag、Sn−Ag−Cu、Sn−Cu、及びSn−Ni合金からなる群から選択される、請求項1又は2に記載の方法。
- 錫めっき組成物が
Sn2+イオンの源、
酸、
有機硫黄化合物、及び
任意に少なくとも1つの更なる金属の源
を含む、請求項1から3までのいずれか1項に記載の方法。 - 錫又は錫合金層が工程(iii)の後に、無機リン酸、有機リン酸、無機リン酸の塩及び有機リン酸の塩からなる群から選択されるリン化合物を含む組成物で処理される、請求項1から4までのいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09168492.8 | 2009-08-24 | ||
EP09168492A EP2298960A1 (en) | 2009-08-24 | 2009-08-24 | Method for electroless plating of tin and tin alloys |
PCT/EP2010/005330 WO2011023411A1 (en) | 2009-08-24 | 2010-08-24 | Method for electroless plating of tin and tin alloys |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013502512A JP2013502512A (ja) | 2013-01-24 |
JP5755231B2 true JP5755231B2 (ja) | 2015-07-29 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012525940A Active JP5755231B2 (ja) | 2009-08-24 | 2010-08-24 | 錫及び錫合金の無電解めっき法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9458541B2 (ja) |
EP (2) | EP2298960A1 (ja) |
JP (1) | JP5755231B2 (ja) |
KR (1) | KR101689914B1 (ja) |
CN (1) | CN102482781B (ja) |
TW (1) | TWI480421B (ja) |
WO (1) | WO2011023411A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6676620B2 (ja) * | 2014-08-15 | 2020-04-08 | アトテック・ドイチュラント・ゲーエムベーハーAtotech Deutschland Gmbh | 銅回路、銅合金回路、およびタッチスクリーンデバイスの光反射率の低減方法 |
CN107109619A (zh) * | 2014-12-29 | 2017-08-29 | 应用材料公司 | 用于沉积处理期间掩蔽基板的掩蔽布置、用于在基板上的层沉积的沉积设备、和用于清洁掩蔽布置的方法 |
CN108735408B (zh) * | 2017-04-21 | 2020-02-21 | 李文熙 | 高导电卑金属电极或合金低欧姆芯片电阻器的制作方法 |
US10774425B2 (en) | 2017-05-30 | 2020-09-15 | Macdermid Enthone Inc. | Elimination of H2S in immersion tin plating solution |
US10566267B2 (en) | 2017-10-05 | 2020-02-18 | Texas Instruments Incorporated | Die attach surface copper layer with protective layer for microelectronic devices |
EP3800277B1 (en) * | 2019-10-02 | 2023-05-10 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for performing immersion tin process in the production of a component carrier |
EP4108804A1 (en) | 2019-10-10 | 2022-12-28 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method and apparatus for performing immersion tin process or copper plating process in the production of a component carrier |
Family Cites Families (15)
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US3917486A (en) * | 1973-07-24 | 1975-11-04 | Kollmorgen Photocircuits | Immersion tin bath composition and process for using same |
JPH0370083A (ja) | 1989-08-08 | 1991-03-26 | Sharp Corp | Cad/cae一体型システム |
JP2787142B2 (ja) * | 1991-03-01 | 1998-08-13 | 上村工業 株式会社 | 無電解錫、鉛又はそれらの合金めっき方法 |
US5211831A (en) | 1991-11-27 | 1993-05-18 | Mcgean-Rohco, Inc. | Process for extending the life of a displacement plating bath |
JPH09170083A (ja) * | 1995-12-20 | 1997-06-30 | Mitsubishi Electric Corp | スズまたはスズ合金の無電解めっき方法 |
DE19755185B4 (de) * | 1997-12-11 | 2004-04-08 | Ami Doduco Gmbh | Austausch Zinnbad |
JP2000309876A (ja) * | 1999-04-23 | 2000-11-07 | Okuno Chem Ind Co Ltd | 置換型無電解錫−銀合金めっき液 |
DE10132478C1 (de) | 2001-07-03 | 2003-04-30 | Atotech Deutschland Gmbh | Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung |
US6750133B2 (en) * | 2002-10-24 | 2004-06-15 | Intel Corporation | Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps |
JP2006009039A (ja) * | 2004-06-21 | 2006-01-12 | Rambo Chemicals (Hong Kong) Ltd | ウィスカー成長が抑制されたスズ系めっき皮膜及びその形成方法 |
US7148569B1 (en) * | 2004-09-07 | 2006-12-12 | Altera Corporation | Pad surface finish for high routing density substrate of BGA packages |
GB0507887D0 (en) | 2005-04-20 | 2005-05-25 | Rohm & Haas Elect Mat | Immersion method |
TWI330053B (en) | 2006-08-14 | 2010-09-01 | Unimicron Technology Corp | Conductive connection structure formed on the surface of circuit board and manufacturing method thereof |
US7572723B2 (en) * | 2006-10-25 | 2009-08-11 | Freescale Semiconductor, Inc. | Micropad for bonding and a method therefor |
US7807572B2 (en) * | 2008-01-04 | 2010-10-05 | Freescale Semiconductor, Inc. | Micropad formation for a semiconductor |
-
2009
- 2009-08-24 EP EP09168492A patent/EP2298960A1/en not_active Withdrawn
-
2010
- 2010-08-24 JP JP2012525940A patent/JP5755231B2/ja active Active
- 2010-08-24 WO PCT/EP2010/005330 patent/WO2011023411A1/en active Application Filing
- 2010-08-24 US US13/390,700 patent/US9458541B2/en active Active
- 2010-08-24 EP EP10749619A patent/EP2470686B1/en active Active
- 2010-08-24 KR KR1020127004693A patent/KR101689914B1/ko active IP Right Grant
- 2010-08-24 CN CN201080037591.XA patent/CN102482781B/zh active Active
- 2010-08-24 TW TW099128310A patent/TWI480421B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201132798A (en) | 2011-10-01 |
EP2298960A1 (en) | 2011-03-23 |
US20120148733A1 (en) | 2012-06-14 |
CN102482781B (zh) | 2014-10-22 |
EP2470686B1 (en) | 2013-04-03 |
CN102482781A (zh) | 2012-05-30 |
TWI480421B (zh) | 2015-04-11 |
KR20120051034A (ko) | 2012-05-21 |
WO2011023411A1 (en) | 2011-03-03 |
KR101689914B1 (ko) | 2016-12-26 |
US9458541B2 (en) | 2016-10-04 |
JP2013502512A (ja) | 2013-01-24 |
EP2470686A1 (en) | 2012-07-04 |
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