JP2019500575A - プロセスコーナーを識別する技法 - Google Patents

プロセスコーナーを識別する技法 Download PDF

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Publication number
JP2019500575A
JP2019500575A JP2018515037A JP2018515037A JP2019500575A JP 2019500575 A JP2019500575 A JP 2019500575A JP 2018515037 A JP2018515037 A JP 2018515037A JP 2018515037 A JP2018515037 A JP 2018515037A JP 2019500575 A JP2019500575 A JP 2019500575A
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Japan
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output frequency
integrated circuit
value
aro1
aro2
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Japanese (ja)
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JP2019500575A5 (enExample
Inventor
ユ・プ
ギビー・サムソン
ケンドリック・ホイ・レオン・ユエン
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クアルコム，インコーポレイテッド
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/30—Marginal testing, e.g. by varying supply voltage
    • G01R31/3004—Current or voltage test
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2018515037A 2015-09-25 2016-08-26 プロセスコーナーを識別する技法 Ceased JP2019500575A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562232486P 2015-09-25 2015-09-25
US62/232,486 2015-09-25
US15/015,547 US10191106B2 (en) 2015-09-25 2016-02-04 Techniques to identify a process corner
US15/015,547 2016-02-04
PCT/US2016/049028 WO2017053006A1 (en) 2015-09-25 2016-08-26 Techniques to identify a process corner

Publications (2)

Publication Number Publication Date
JP2019500575A true JP2019500575A (ja) 2019-01-10
JP2019500575A5 JP2019500575A5 (enExample) 2019-09-12

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ID=56990952

Family Applications (1)

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JP2018515037A Ceased JP2019500575A (ja) 2015-09-25 2016-08-26 プロセスコーナーを識別する技法

Country Status (9)

Country Link
US (1) US10191106B2 (enExample)
EP (1) EP3353561B1 (enExample)
JP (1) JP2019500575A (enExample)
KR (1) KR20180056761A (enExample)
CN (1) CN108027402B (enExample)
BR (1) BR112018006092A2 (enExample)
CA (1) CA2997532A1 (enExample)
TW (1) TW201721163A (enExample)
WO (1) WO2017053006A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10394982B2 (en) 2014-02-26 2019-08-27 International Business Machines Corporation Partial parameters and projection thereof included within statistical timing analysis
CN114639610B (zh) * 2020-12-15 2024-06-07 长鑫存储技术有限公司 工艺角检测电路与工艺角检测方法
CN114138726B (zh) * 2021-11-12 2025-09-09 国微集团(深圳)有限公司 一种针对存在相邻边均相互垂直的多边形的gdsii版图数据的处理方法
CN114414999A (zh) * 2022-02-28 2022-04-29 北京智芯微电子科技有限公司 一种芯片工艺角检测电路、方法和芯片
TWI829433B (zh) 2022-11-16 2024-01-11 創意電子股份有限公司 晶片特性量測方法、測試裝置以及非暫態電腦可讀取媒體

Citations (8)

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JPH07202679A (ja) * 1993-11-17 1995-08-04 Hewlett Packard Co <Hp> Ｃｍｏｓ回路
JP2006041951A (ja) * 2004-07-27 2006-02-09 Fujitsu Ltd プロセスばらつき検知装置およびプロセスばらつき検知方法
JP2008503882A (ja) * 2004-06-16 2008-02-07 トランスメータ・コーポレーション 負バイアス温度不安定性を測定するシステム及び方法
JP2010283054A (ja) * 2009-06-03 2010-12-16 Kawasaki Microelectronics Inc プロセスモニタ回路およびプロセス特性の判定方法
JP2011151146A (ja) * 2010-01-20 2011-08-04 Renesas Electronics Corp 半導体集積回路、動作電圧制御方法
JP2012174317A (ja) * 2011-02-23 2012-09-10 Handotai Rikougaku Kenkyu Center:Kk 半導体記憶装置
US20140049310A1 (en) * 2012-08-17 2014-02-20 SK Hynix Inc. Semiconductor device, semiconductor system, and monitoring method thereof
WO2015114944A1 (ja) * 2014-01-31 2015-08-06 国立大学法人東北大学 サイドチャネル攻撃の検知装置、サイドチャネル攻撃の検知装置によるサイドチャネル攻撃の検知方法

Family Cites Families (16)

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US5631596A (en) 1994-08-09 1997-05-20 Lsi Logic Corporation Process monitor for CMOS integrated circuits
US5486786A (en) 1994-08-09 1996-01-23 Lsi Logic Corporation Process monitor for CMOS integrated circuits
US6850075B1 (en) * 2000-12-22 2005-02-01 Cypress Semiconductor Corp. SRAM self-timed write stress test mode
US6894528B2 (en) * 2002-09-17 2005-05-17 Sun Microsystems, Inc. Process monitor based keeper scheme for dynamic circuits
US7330080B1 (en) 2004-11-04 2008-02-12 Transmeta Corporation Ring based impedance control of an output driver
US7627839B1 (en) 2005-11-14 2009-12-01 National Semiconductor Corporation Process corner indicator and estimation circuit
US20090027131A1 (en) * 2007-07-25 2009-01-29 Shingo Suzuki Ring oscillators for cmos transistor beta ratio monitoring
US8674774B2 (en) 2009-09-07 2014-03-18 Nec Corporation Aging diagnostic device, aging diagnostic method
TWI422847B (zh) * 2010-09-01 2014-01-11 Univ Nat Chiao Tung 全晶片上寬工作電壓溫度製程電壓的感測系統
US8441310B2 (en) * 2010-12-07 2013-05-14 Broadcom Corporation Power control based on dual loop with multiple process detection circuits
US8954764B2 (en) 2012-03-05 2015-02-10 Csr Technology Inc. Method and apparatus for dynamic power management
US8801281B1 (en) 2012-05-24 2014-08-12 Pixelworks, Inc. On-chip temperature detection using an oscillator
US9112484B1 (en) * 2012-12-20 2015-08-18 Mie Fujitsu Semiconductor Limited Integrated circuit process and bias monitors and related methods
US8976574B2 (en) * 2013-03-13 2015-03-10 Qualcomm Incorporated Process corner sensor for bit-cells
CN104101827B (zh) * 2014-06-25 2016-08-31 东南大学 一种基于自定时振荡环的工艺角检测电路
KR102298158B1 (ko) * 2014-08-25 2021-09-03 삼성전자주식회사 반도체 장치와 이를 포함하는 위상 동기 회로

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07202679A (ja) * 1993-11-17 1995-08-04 Hewlett Packard Co <Hp> Ｃｍｏｓ回路
JP2008503882A (ja) * 2004-06-16 2008-02-07 トランスメータ・コーポレーション 負バイアス温度不安定性を測定するシステム及び方法
JP2006041951A (ja) * 2004-07-27 2006-02-09 Fujitsu Ltd プロセスばらつき検知装置およびプロセスばらつき検知方法
JP2010283054A (ja) * 2009-06-03 2010-12-16 Kawasaki Microelectronics Inc プロセスモニタ回路およびプロセス特性の判定方法
JP2011151146A (ja) * 2010-01-20 2011-08-04 Renesas Electronics Corp 半導体集積回路、動作電圧制御方法
JP2012174317A (ja) * 2011-02-23 2012-09-10 Handotai Rikougaku Kenkyu Center:Kk 半導体記憶装置
US20140049310A1 (en) * 2012-08-17 2014-02-20 SK Hynix Inc. Semiconductor device, semiconductor system, and monitoring method thereof
WO2015114944A1 (ja) * 2014-01-31 2015-08-06 国立大学法人東北大学 サイドチャネル攻撃の検知装置、サイドチャネル攻撃の検知装置によるサイドチャネル攻撃の検知方法

Also Published As

Publication number Publication date
CN108027402B (zh) 2020-06-16
US10191106B2 (en) 2019-01-29
CN108027402A (zh) 2018-05-11
TW201721163A (zh) 2017-06-16
EP3353561A1 (en) 2018-08-01
WO2017053006A1 (en) 2017-03-30
BR112018006092A2 (pt) 2018-10-16
CA2997532A1 (en) 2017-03-30
KR20180056761A (ko) 2018-05-29
US20170089974A1 (en) 2017-03-30
EP3353561B1 (en) 2019-09-18

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