BR112018006092A2 - técnicas para identificar um corner de processo - Google Patents
técnicas para identificar um corner de processoInfo
- Publication number
- BR112018006092A2 BR112018006092A2 BR112018006092-5A BR112018006092A BR112018006092A2 BR 112018006092 A2 BR112018006092 A2 BR 112018006092A2 BR 112018006092 A BR112018006092 A BR 112018006092A BR 112018006092 A2 BR112018006092 A2 BR 112018006092A2
- Authority
- BR
- Brazil
- Prior art keywords
- rim2
- rim1
- output frequency
- process corner
- identifying
- Prior art date
Links
- DOSMHBDKKKMIEF-UHFFFAOYSA-N 2-[3-(diethylamino)-6-diethylazaniumylidenexanthen-9-yl]-5-[3-[3-[4-(1-methylindol-3-yl)-2,5-dioxopyrrol-3-yl]indol-1-yl]propylsulfamoyl]benzenesulfonate Chemical compound C1=CC(=[N+](CC)CC)C=C2OC3=CC(N(CC)CC)=CC=C3C(C=3C(=CC(=CC=3)S(=O)(=O)NCCCN3C4=CC=CC=C4C(C=4C(NC(=O)C=4C=4C5=CC=CC=C5N(C)C=4)=O)=C3)S([O-])(=O)=O)=C21 DOSMHBDKKKMIEF-UHFFFAOYSA-N 0.000 abstract 4
- 230000007257 malfunction Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/30—Marginal testing, e.g. by varying supply voltage
- G01R31/3004—Current or voltage test
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Semiconductor Integrated Circuits (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562232486P | 2015-09-25 | 2015-09-25 | |
| US62/232,486 | 2015-09-25 | ||
| US15/015,547 US10191106B2 (en) | 2015-09-25 | 2016-02-04 | Techniques to identify a process corner |
| US15/015,547 | 2016-02-04 | ||
| PCT/US2016/049028 WO2017053006A1 (en) | 2015-09-25 | 2016-08-26 | Techniques to identify a process corner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR112018006092A2 true BR112018006092A2 (pt) | 2018-10-16 |
Family
ID=56990952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR112018006092-5A BR112018006092A2 (pt) | 2015-09-25 | 2016-08-26 | técnicas para identificar um corner de processo |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10191106B2 (enExample) |
| EP (1) | EP3353561B1 (enExample) |
| JP (1) | JP2019500575A (enExample) |
| KR (1) | KR20180056761A (enExample) |
| CN (1) | CN108027402B (enExample) |
| BR (1) | BR112018006092A2 (enExample) |
| CA (1) | CA2997532A1 (enExample) |
| TW (1) | TW201721163A (enExample) |
| WO (1) | WO2017053006A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10394982B2 (en) | 2014-02-26 | 2019-08-27 | International Business Machines Corporation | Partial parameters and projection thereof included within statistical timing analysis |
| CN114639610B (zh) * | 2020-12-15 | 2024-06-07 | 长鑫存储技术有限公司 | 工艺角检测电路与工艺角检测方法 |
| CN114138726B (zh) * | 2021-11-12 | 2025-09-09 | 国微集团(深圳)有限公司 | 一种针对存在相邻边均相互垂直的多边形的gdsii版图数据的处理方法 |
| CN114414999A (zh) * | 2022-02-28 | 2022-04-29 | 北京智芯微电子科技有限公司 | 一种芯片工艺角检测电路、方法和芯片 |
| TWI829433B (zh) | 2022-11-16 | 2024-01-11 | 創意電子股份有限公司 | 晶片特性量測方法、測試裝置以及非暫態電腦可讀取媒體 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0653843A3 (en) * | 1993-11-17 | 1996-05-01 | Hewlett Packard Co | CMOS circuits with adaptive voltage threshold. |
| US5486786A (en) | 1994-08-09 | 1996-01-23 | Lsi Logic Corporation | Process monitor for CMOS integrated circuits |
| US5631596A (en) | 1994-08-09 | 1997-05-20 | Lsi Logic Corporation | Process monitor for CMOS integrated circuits |
| US6850075B1 (en) * | 2000-12-22 | 2005-02-01 | Cypress Semiconductor Corp. | SRAM self-timed write stress test mode |
| US7126365B2 (en) * | 2002-04-16 | 2006-10-24 | Transmeta Corporation | System and method for measuring negative bias thermal instability with a ring oscillator |
| US6894528B2 (en) * | 2002-09-17 | 2005-05-17 | Sun Microsystems, Inc. | Process monitor based keeper scheme for dynamic circuits |
| JP2006041951A (ja) * | 2004-07-27 | 2006-02-09 | Fujitsu Ltd | プロセスばらつき検知装置およびプロセスばらつき検知方法 |
| US7330080B1 (en) | 2004-11-04 | 2008-02-12 | Transmeta Corporation | Ring based impedance control of an output driver |
| US7627839B1 (en) | 2005-11-14 | 2009-12-01 | National Semiconductor Corporation | Process corner indicator and estimation circuit |
| US20090027131A1 (en) * | 2007-07-25 | 2009-01-29 | Shingo Suzuki | Ring oscillators for cmos transistor beta ratio monitoring |
| JP5452983B2 (ja) * | 2009-06-03 | 2014-03-26 | 株式会社メガチップス | プロセスモニタ回路およびプロセス特性の判定方法 |
| WO2011027553A1 (ja) | 2009-09-07 | 2011-03-10 | 日本電気株式会社 | 経年劣化診断装置、経年劣化診断方法 |
| JP5529555B2 (ja) | 2010-01-20 | 2014-06-25 | ルネサスエレクトロニクス株式会社 | 半導体集積回路、動作電圧制御方法 |
| TWI422847B (zh) * | 2010-09-01 | 2014-01-11 | Univ Nat Chiao Tung | 全晶片上寬工作電壓溫度製程電壓的感測系統 |
| US8441310B2 (en) * | 2010-12-07 | 2013-05-14 | Broadcom Corporation | Power control based on dual loop with multiple process detection circuits |
| JP5226094B2 (ja) * | 2011-02-23 | 2013-07-03 | 株式会社半導体理工学研究センター | 半導体記憶装置 |
| US8954764B2 (en) | 2012-03-05 | 2015-02-10 | Csr Technology Inc. | Method and apparatus for dynamic power management |
| US8801281B1 (en) | 2012-05-24 | 2014-08-12 | Pixelworks, Inc. | On-chip temperature detection using an oscillator |
| KR20140023726A (ko) * | 2012-08-17 | 2014-02-27 | 에스케이하이닉스 주식회사 | 반도체 장치, 반도체 시스템 및 그의 모니터링 방법 |
| US9112484B1 (en) * | 2012-12-20 | 2015-08-18 | Mie Fujitsu Semiconductor Limited | Integrated circuit process and bias monitors and related methods |
| US8976574B2 (en) * | 2013-03-13 | 2015-03-10 | Qualcomm Incorporated | Process corner sensor for bit-cells |
| JP2017079336A (ja) * | 2014-01-31 | 2017-04-27 | 国立大学法人東北大学 | サイドチャネル攻撃の検知装置、サイドチャネル攻撃の検知装置によるサイドチャネル攻撃の検知方法 |
| CN104101827B (zh) * | 2014-06-25 | 2016-08-31 | 东南大学 | 一种基于自定时振荡环的工艺角检测电路 |
| KR102298158B1 (ko) * | 2014-08-25 | 2021-09-03 | 삼성전자주식회사 | 반도체 장치와 이를 포함하는 위상 동기 회로 |
-
2016
- 2016-02-04 US US15/015,547 patent/US10191106B2/en active Active
- 2016-08-26 CA CA2997532A patent/CA2997532A1/en not_active Abandoned
- 2016-08-26 JP JP2018515037A patent/JP2019500575A/ja not_active Ceased
- 2016-08-26 WO PCT/US2016/049028 patent/WO2017053006A1/en not_active Ceased
- 2016-08-26 EP EP16770592.0A patent/EP3353561B1/en active Active
- 2016-08-26 CN CN201680055568.0A patent/CN108027402B/zh active Active
- 2016-08-26 KR KR1020187011636A patent/KR20180056761A/ko not_active Withdrawn
- 2016-08-26 BR BR112018006092-5A patent/BR112018006092A2/pt not_active IP Right Cessation
- 2016-09-10 TW TW105129442A patent/TW201721163A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN108027402A (zh) | 2018-05-11 |
| CN108027402B (zh) | 2020-06-16 |
| WO2017053006A1 (en) | 2017-03-30 |
| TW201721163A (zh) | 2017-06-16 |
| US20170089974A1 (en) | 2017-03-30 |
| JP2019500575A (ja) | 2019-01-10 |
| US10191106B2 (en) | 2019-01-29 |
| EP3353561B1 (en) | 2019-09-18 |
| EP3353561A1 (en) | 2018-08-01 |
| KR20180056761A (ko) | 2018-05-29 |
| CA2997532A1 (en) | 2017-03-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 6A ANUIDADE. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2685 DE 21-06-2022 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |