CA2997532A1 - Techniques to identify a process corner - Google Patents
Techniques to identify a process corner Download PDFInfo
- Publication number
- CA2997532A1 CA2997532A1 CA2997532A CA2997532A CA2997532A1 CA 2997532 A1 CA2997532 A1 CA 2997532A1 CA 2997532 A CA2997532 A CA 2997532A CA 2997532 A CA2997532 A CA 2997532A CA 2997532 A1 CA2997532 A1 CA 2997532A1
- Authority
- CA
- Canada
- Prior art keywords
- output frequency
- integrated circuit
- value
- aro2
- aro1
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims abstract description 233
- 230000008569 process Effects 0.000 title claims abstract description 191
- 230000007257 malfunction Effects 0.000 claims abstract description 19
- 238000004891 communication Methods 0.000 claims description 9
- 239000000470 constituent Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 2
- 230000006870 function Effects 0.000 description 12
- 230000008901 benefit Effects 0.000 description 8
- 230000005669 field effect Effects 0.000 description 8
- 101100491995 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) aro-1 gene Proteins 0.000 description 7
- 101100216944 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) aro-2 gene Proteins 0.000 description 7
- 230000000644 propagated effect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 230000001902 propagating effect Effects 0.000 description 5
- 230000001052 transient effect Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
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- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/30—Marginal testing, e.g. by varying supply voltage
- G01R31/3004—Current or voltage test
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Semiconductor Integrated Circuits (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562232486P | 2015-09-25 | 2015-09-25 | |
| US62/232,486 | 2015-09-25 | ||
| US15/015,547 US10191106B2 (en) | 2015-09-25 | 2016-02-04 | Techniques to identify a process corner |
| US15/015,547 | 2016-02-04 | ||
| PCT/US2016/049028 WO2017053006A1 (en) | 2015-09-25 | 2016-08-26 | Techniques to identify a process corner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2997532A1 true CA2997532A1 (en) | 2017-03-30 |
Family
ID=56990952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2997532A Abandoned CA2997532A1 (en) | 2015-09-25 | 2016-08-26 | Techniques to identify a process corner |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10191106B2 (enExample) |
| EP (1) | EP3353561B1 (enExample) |
| JP (1) | JP2019500575A (enExample) |
| KR (1) | KR20180056761A (enExample) |
| CN (1) | CN108027402B (enExample) |
| BR (1) | BR112018006092A2 (enExample) |
| CA (1) | CA2997532A1 (enExample) |
| TW (1) | TW201721163A (enExample) |
| WO (1) | WO2017053006A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10394982B2 (en) | 2014-02-26 | 2019-08-27 | International Business Machines Corporation | Partial parameters and projection thereof included within statistical timing analysis |
| CN114639610B (zh) * | 2020-12-15 | 2024-06-07 | 长鑫存储技术有限公司 | 工艺角检测电路与工艺角检测方法 |
| CN114138726B (zh) * | 2021-11-12 | 2025-09-09 | 国微集团(深圳)有限公司 | 一种针对存在相邻边均相互垂直的多边形的gdsii版图数据的处理方法 |
| CN114414999A (zh) * | 2022-02-28 | 2022-04-29 | 北京智芯微电子科技有限公司 | 一种芯片工艺角检测电路、方法和芯片 |
| TWI829433B (zh) | 2022-11-16 | 2024-01-11 | 創意電子股份有限公司 | 晶片特性量測方法、測試裝置以及非暫態電腦可讀取媒體 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0653843A3 (en) * | 1993-11-17 | 1996-05-01 | Hewlett Packard Co | CMOS circuits with adaptive voltage threshold. |
| US5631596A (en) | 1994-08-09 | 1997-05-20 | Lsi Logic Corporation | Process monitor for CMOS integrated circuits |
| US5486786A (en) | 1994-08-09 | 1996-01-23 | Lsi Logic Corporation | Process monitor for CMOS integrated circuits |
| US6850075B1 (en) * | 2000-12-22 | 2005-02-01 | Cypress Semiconductor Corp. | SRAM self-timed write stress test mode |
| US7126365B2 (en) * | 2002-04-16 | 2006-10-24 | Transmeta Corporation | System and method for measuring negative bias thermal instability with a ring oscillator |
| US6894528B2 (en) * | 2002-09-17 | 2005-05-17 | Sun Microsystems, Inc. | Process monitor based keeper scheme for dynamic circuits |
| JP2006041951A (ja) * | 2004-07-27 | 2006-02-09 | Fujitsu Ltd | プロセスばらつき検知装置およびプロセスばらつき検知方法 |
| US7330080B1 (en) | 2004-11-04 | 2008-02-12 | Transmeta Corporation | Ring based impedance control of an output driver |
| US7627839B1 (en) | 2005-11-14 | 2009-12-01 | National Semiconductor Corporation | Process corner indicator and estimation circuit |
| US20090027131A1 (en) * | 2007-07-25 | 2009-01-29 | Shingo Suzuki | Ring oscillators for cmos transistor beta ratio monitoring |
| JP5452983B2 (ja) * | 2009-06-03 | 2014-03-26 | 株式会社メガチップス | プロセスモニタ回路およびプロセス特性の判定方法 |
| US8674774B2 (en) | 2009-09-07 | 2014-03-18 | Nec Corporation | Aging diagnostic device, aging diagnostic method |
| JP5529555B2 (ja) | 2010-01-20 | 2014-06-25 | ルネサスエレクトロニクス株式会社 | 半導体集積回路、動作電圧制御方法 |
| TWI422847B (zh) * | 2010-09-01 | 2014-01-11 | Univ Nat Chiao Tung | 全晶片上寬工作電壓溫度製程電壓的感測系統 |
| US8441310B2 (en) * | 2010-12-07 | 2013-05-14 | Broadcom Corporation | Power control based on dual loop with multiple process detection circuits |
| JP5226094B2 (ja) * | 2011-02-23 | 2013-07-03 | 株式会社半導体理工学研究センター | 半導体記憶装置 |
| US8954764B2 (en) | 2012-03-05 | 2015-02-10 | Csr Technology Inc. | Method and apparatus for dynamic power management |
| US8801281B1 (en) | 2012-05-24 | 2014-08-12 | Pixelworks, Inc. | On-chip temperature detection using an oscillator |
| KR20140023726A (ko) * | 2012-08-17 | 2014-02-27 | 에스케이하이닉스 주식회사 | 반도체 장치, 반도체 시스템 및 그의 모니터링 방법 |
| US9112484B1 (en) * | 2012-12-20 | 2015-08-18 | Mie Fujitsu Semiconductor Limited | Integrated circuit process and bias monitors and related methods |
| US8976574B2 (en) * | 2013-03-13 | 2015-03-10 | Qualcomm Incorporated | Process corner sensor for bit-cells |
| JP2017079336A (ja) * | 2014-01-31 | 2017-04-27 | 国立大学法人東北大学 | サイドチャネル攻撃の検知装置、サイドチャネル攻撃の検知装置によるサイドチャネル攻撃の検知方法 |
| CN104101827B (zh) * | 2014-06-25 | 2016-08-31 | 东南大学 | 一种基于自定时振荡环的工艺角检测电路 |
| KR102298158B1 (ko) * | 2014-08-25 | 2021-09-03 | 삼성전자주식회사 | 반도체 장치와 이를 포함하는 위상 동기 회로 |
-
2016
- 2016-02-04 US US15/015,547 patent/US10191106B2/en active Active
- 2016-08-26 WO PCT/US2016/049028 patent/WO2017053006A1/en not_active Ceased
- 2016-08-26 CA CA2997532A patent/CA2997532A1/en not_active Abandoned
- 2016-08-26 KR KR1020187011636A patent/KR20180056761A/ko not_active Withdrawn
- 2016-08-26 EP EP16770592.0A patent/EP3353561B1/en active Active
- 2016-08-26 BR BR112018006092-5A patent/BR112018006092A2/pt not_active IP Right Cessation
- 2016-08-26 JP JP2018515037A patent/JP2019500575A/ja not_active Ceased
- 2016-08-26 CN CN201680055568.0A patent/CN108027402B/zh active Active
- 2016-09-10 TW TW105129442A patent/TW201721163A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN108027402B (zh) | 2020-06-16 |
| US10191106B2 (en) | 2019-01-29 |
| CN108027402A (zh) | 2018-05-11 |
| TW201721163A (zh) | 2017-06-16 |
| EP3353561A1 (en) | 2018-08-01 |
| WO2017053006A1 (en) | 2017-03-30 |
| BR112018006092A2 (pt) | 2018-10-16 |
| KR20180056761A (ko) | 2018-05-29 |
| US20170089974A1 (en) | 2017-03-30 |
| EP3353561B1 (en) | 2019-09-18 |
| JP2019500575A (ja) | 2019-01-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |
Effective date: 20200831 |