KR20180056761A - 프로세스 코너를 식별하기 위한 기법들 - Google Patents

프로세스 코너를 식별하기 위한 기법들 Download PDF

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Publication number
KR20180056761A
KR20180056761A KR1020187011636A KR20187011636A KR20180056761A KR 20180056761 A KR20180056761 A KR 20180056761A KR 1020187011636 A KR1020187011636 A KR 1020187011636A KR 20187011636 A KR20187011636 A KR 20187011636A KR 20180056761 A KR20180056761 A KR 20180056761A
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KR
South Korea
Prior art keywords
output frequency
integrated circuit
aro2
value
aro1
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KR1020187011636A
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English (en)
Korean (ko)
Inventor
유 푸
기비 샘슨
켄드릭 호이 렁 위엔
Original Assignee
퀄컴 인코포레이티드
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Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/30—Marginal testing, e.g. by varying supply voltage
    • G01R31/3004—Current or voltage test
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020187011636A 2015-09-25 2016-08-26 프로세스 코너를 식별하기 위한 기법들 Withdrawn KR20180056761A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562232486P 2015-09-25 2015-09-25
US62/232,486 2015-09-25
US15/015,547 US10191106B2 (en) 2015-09-25 2016-02-04 Techniques to identify a process corner
US15/015,547 2016-02-04
PCT/US2016/049028 WO2017053006A1 (en) 2015-09-25 2016-08-26 Techniques to identify a process corner

Publications (1)

Publication Number Publication Date
KR20180056761A true KR20180056761A (ko) 2018-05-29

Family

ID=56990952

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187011636A Withdrawn KR20180056761A (ko) 2015-09-25 2016-08-26 프로세스 코너를 식별하기 위한 기법들

Country Status (9)

Country Link
US (1) US10191106B2 (enExample)
EP (1) EP3353561B1 (enExample)
JP (1) JP2019500575A (enExample)
KR (1) KR20180056761A (enExample)
CN (1) CN108027402B (enExample)
BR (1) BR112018006092A2 (enExample)
CA (1) CA2997532A1 (enExample)
TW (1) TW201721163A (enExample)
WO (1) WO2017053006A1 (enExample)

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US10394982B2 (en) * 2014-02-26 2019-08-27 International Business Machines Corporation Partial parameters and projection thereof included within statistical timing analysis
CN114639610B (zh) * 2020-12-15 2024-06-07 长鑫存储技术有限公司 工艺角检测电路与工艺角检测方法
CN114138726B (zh) * 2021-11-12 2025-09-09 国微集团(深圳)有限公司 一种针对存在相邻边均相互垂直的多边形的gdsii版图数据的处理方法
CN114414999A (zh) * 2022-02-28 2022-04-29 北京智芯微电子科技有限公司 一种芯片工艺角检测电路、方法和芯片
TWI829433B (zh) 2022-11-16 2024-01-11 創意電子股份有限公司 晶片特性量測方法、測試裝置以及非暫態電腦可讀取媒體

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US5486786A (en) 1994-08-09 1996-01-23 Lsi Logic Corporation Process monitor for CMOS integrated circuits
US6850075B1 (en) * 2000-12-22 2005-02-01 Cypress Semiconductor Corp. SRAM self-timed write stress test mode
US7126365B2 (en) * 2002-04-16 2006-10-24 Transmeta Corporation System and method for measuring negative bias thermal instability with a ring oscillator
US6894528B2 (en) * 2002-09-17 2005-05-17 Sun Microsystems, Inc. Process monitor based keeper scheme for dynamic circuits
JP2006041951A (ja) * 2004-07-27 2006-02-09 Fujitsu Ltd プロセスばらつき検知装置およびプロセスばらつき検知方法
US7330080B1 (en) 2004-11-04 2008-02-12 Transmeta Corporation Ring based impedance control of an output driver
US7627839B1 (en) 2005-11-14 2009-12-01 National Semiconductor Corporation Process corner indicator and estimation circuit
US20090027131A1 (en) * 2007-07-25 2009-01-29 Shingo Suzuki Ring oscillators for cmos transistor beta ratio monitoring
JP5452983B2 (ja) * 2009-06-03 2014-03-26 株式会社メガチップス プロセスモニタ回路およびプロセス特性の判定方法
US8674774B2 (en) 2009-09-07 2014-03-18 Nec Corporation Aging diagnostic device, aging diagnostic method
JP5529555B2 (ja) * 2010-01-20 2014-06-25 ルネサスエレクトロニクス株式会社 半導体集積回路、動作電圧制御方法
TWI422847B (zh) * 2010-09-01 2014-01-11 Univ Nat Chiao Tung 全晶片上寬工作電壓溫度製程電壓的感測系統
US8441310B2 (en) * 2010-12-07 2013-05-14 Broadcom Corporation Power control based on dual loop with multiple process detection circuits
JP5226094B2 (ja) * 2011-02-23 2013-07-03 株式会社半導体理工学研究センター 半導体記憶装置
US8954764B2 (en) 2012-03-05 2015-02-10 Csr Technology Inc. Method and apparatus for dynamic power management
US8801281B1 (en) 2012-05-24 2014-08-12 Pixelworks, Inc. On-chip temperature detection using an oscillator
KR20140023726A (ko) * 2012-08-17 2014-02-27 에스케이하이닉스 주식회사 반도체 장치, 반도체 시스템 및 그의 모니터링 방법
US9112484B1 (en) * 2012-12-20 2015-08-18 Mie Fujitsu Semiconductor Limited Integrated circuit process and bias monitors and related methods
US8976574B2 (en) * 2013-03-13 2015-03-10 Qualcomm Incorporated Process corner sensor for bit-cells
JP2017079336A (ja) * 2014-01-31 2017-04-27 国立大学法人東北大学 サイドチャネル攻撃の検知装置、サイドチャネル攻撃の検知装置によるサイドチャネル攻撃の検知方法
CN104101827B (zh) * 2014-06-25 2016-08-31 东南大学 一种基于自定时振荡环的工艺角检测电路
KR102298158B1 (ko) * 2014-08-25 2021-09-03 삼성전자주식회사 반도체 장치와 이를 포함하는 위상 동기 회로

Also Published As

Publication number Publication date
EP3353561B1 (en) 2019-09-18
BR112018006092A2 (pt) 2018-10-16
WO2017053006A1 (en) 2017-03-30
US20170089974A1 (en) 2017-03-30
US10191106B2 (en) 2019-01-29
JP2019500575A (ja) 2019-01-10
CN108027402A (zh) 2018-05-11
EP3353561A1 (en) 2018-08-01
CA2997532A1 (en) 2017-03-30
TW201721163A (zh) 2017-06-16
CN108027402B (zh) 2020-06-16

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PA0105 International application

Patent event date: 20180424

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination