JP2019220726A - 波長変換材料の気密シールを有するledモジュール - Google Patents
波長変換材料の気密シールを有するledモジュール Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 80
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 94
- 239000002096 quantum dot Substances 0.000 claims abstract description 30
- 239000011230 binding agent Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000000565 sealant Substances 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 10
- 239000008393 encapsulating agent Substances 0.000 claims description 4
- 239000003566 sealing material Substances 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 27
- 238000007789 sealing Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 28
- 230000004907 flux Effects 0.000 description 10
- 239000003570 air Substances 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000012080 ambient air Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004901 spalling Methods 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 231100000701 toxic element Toxicity 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H01L33/64—Heat extraction or cooling elements
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
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- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
Claims (13)
- 第1の熱伝導率を有する基板と、
前記基板上の発光ダイオードと、
前記発光ダイオードを取り囲む波長変換材料であり、当該波長変換材料は、バインダ内に分散された量子ドットを有し、前記第1の熱伝導率よりも実質的に低い第2の熱伝導率を有し、且つ前記発光ダイオードの総体積よりも実質的に大きい総体積を有する、波長変換材料と、
前記波長変換材料上に又は隣接して位置付けられ、前記第2の熱伝導率よりも高い第3の熱伝導率を有する透明プレートと、
前記透明プレートと前記基板との間に気密シールを形成する密封材と、
を有し、
前記発光ダイオードは、前記基板又は前記透明プレートの何れか内のキャビティの中に置かれている、
発光デバイス。 - 前記キャビティは前記基板内にある、請求項1に記載の発光デバイス。
- 前記キャビティは前記透明プレート内にある、請求項1に記載の発光デバイス。
- 前記透明プレートはガラスを有し、前記密封材は、溶融されて前記透明プレートを前記基板に取り付けるガラスを有する、請求項1に記載の発光デバイス。
- 前記密封材は金属はんだ材料を有し、前記発光ダイオードは、同じ金属はんだ材料から形成された導電接合で、前記基板上の電極に接合されている、請求項1に記載の発光デバイス。
- 前記透明プレートは、前記発光ダイオードによって又は前記波長変換材料によって放射された光を向け直すフィーチャを有する、請求項1に記載の発光デバイス。
- 動作時に、前記発光ダイオードによって生成される熱が、前記基板、前記密封材、及び前記透明プレートを通じての熱伝導によって少なくとも部分的に除去され、前記波長変換材料の温度が、前記発光ダイオードの温度よりも低い、請求項1に記載の発光デバイス。
- 前記透明プレートは、前記透明プレートの外縁周りに平坦な側壁端部を有し、
前記基板は、前記基板の外縁周りに平坦な側壁端部を有し、
前記透明プレートの前記平坦な側壁端部が前記基板の前記平坦な側壁端部と一致する、
請求項1に記載の発光デバイス。 - 前記波長変換材料が前記キャビティを充填している、請求項1に記載の発光デバイス。
- 前記キャビティは前記基板内にあり、
動作時に、前記発光ダイオードによって生成される熱が、前記基板、前記密封材、及び前記透明プレートを通じての熱伝導によって少なくとも部分的に除去され、前記波長変換材料の温度が、前記発光ダイオードの温度よりも低い、
請求項1に記載の発光デバイス。 - 前記透明プレートは、前記キャビティの上に位置する開口を有する、請求項10に記載の発光デバイス。
- 前記開口は気密シールされている、請求項11に記載の発光デバイス。
- 前記透明プレートは、前記透明プレートの外縁周りに平坦な側壁端部を有し、
前記基板は、前記基板の外縁周りに平坦な側壁端部を有し、
前記透明プレートの前記平坦な側壁端部が前記基板の前記平坦な側壁端部と一致する、
請求項11に記載の発光デバイス。
Applications Claiming Priority (2)
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US201361763081P | 2013-02-11 | 2013-02-11 | |
US61/763,081 | 2013-02-11 |
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JP2015556606A Division JP2016507162A (ja) | 2013-02-11 | 2014-02-10 | 波長変換材料の気密シールを有するledモジュール |
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JP2015556606A Ceased JP2016507162A (ja) | 2013-02-11 | 2014-02-10 | 波長変換材料の気密シールを有するledモジュール |
JP2019182604A Pending JP2019220726A (ja) | 2013-02-11 | 2019-10-03 | 波長変換材料の気密シールを有するledモジュール |
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US (3) | US10002855B2 (ja) |
EP (1) | EP2954566B1 (ja) |
JP (2) | JP2016507162A (ja) |
KR (1) | KR20150119179A (ja) |
CN (2) | CN104969371A (ja) |
TW (1) | TWI645583B (ja) |
WO (1) | WO2014122626A1 (ja) |
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Also Published As
Publication number | Publication date |
---|---|
JP2016507162A (ja) | 2016-03-07 |
TWI645583B (zh) | 2018-12-21 |
CN104969371A (zh) | 2015-10-07 |
WO2014122626A1 (en) | 2014-08-14 |
US20200328194A1 (en) | 2020-10-15 |
CN110010742A (zh) | 2019-07-12 |
EP2954566B1 (en) | 2020-04-08 |
US20150371975A1 (en) | 2015-12-24 |
KR20150119179A (ko) | 2015-10-23 |
EP2954566A1 (en) | 2015-12-16 |
CN110010742B (zh) | 2021-11-12 |
US10700044B2 (en) | 2020-06-30 |
US20180366451A1 (en) | 2018-12-20 |
US10002855B2 (en) | 2018-06-19 |
US11081471B2 (en) | 2021-08-03 |
TW201442294A (zh) | 2014-11-01 |
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