JP2019194939A - セラミックスヒータ - Google Patents
セラミックスヒータ Download PDFInfo
- Publication number
- JP2019194939A JP2019194939A JP2018087990A JP2018087990A JP2019194939A JP 2019194939 A JP2019194939 A JP 2019194939A JP 2018087990 A JP2018087990 A JP 2018087990A JP 2018087990 A JP2018087990 A JP 2018087990A JP 2019194939 A JP2019194939 A JP 2019194939A
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- JP
- Japan
- Prior art keywords
- resistance
- electrode
- heating resistor
- resistance portion
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
抵抗体30との上下2層の発熱抵抗体を備えるものに限定されない。例えば、本発明のセラミックスヒータは、下側発熱抵抗体40より下側にさらに位置する発熱抵抗体、下側発熱抵抗体40と上側発熱抵抗体30との間に位置する発熱抵抗体、上側発熱抵抗体30より上側にさらに位置する発熱抵抗体の何れかが、少なくとも1つ備わるものであってもよい。
Claims (3)
- セラミックスからなり、上面及び下面を有する円板状のセラミックス基材と、
前記セラミックス基材に埋設されている静電吸着用電極又は高周波発生用電極としての平面状の電極と、
前記電極よりも前記下面側において前記セラミックス基材に埋設されている第1発熱抵抗体と、
前記第1発熱抵抗体よりも前記下面側において前記セラミックス基材に埋設されている第2発熱抵抗体とを備えたセラミックスヒータであって、
上面視において、前記第1発熱抵抗体は、前記電極の最外周の輪郭線により画定される仮想円の内側領域に設けられた平面状の第1抵抗部と、前記内側領域内であって、前記第1抵抗部よりも前記セラミックス基材の径方向の外側に設けられ前記セラミックス基材の円周方向に沿って延在する線状又は帯状の第2抵抗部と、前記第1抵抗部及び前記第2抵抗部を接続する接続部とを有し、
上面視において、前記第2発熱抵抗体は、前記第2抵抗部の最内周の輪郭線により画定される仮想円よりも内側に配置されることを特徴とするセラミックスヒータ。 - 前記第1抵抗部は、上面視において、前記セラミック基材と同心の円の外周に沿った輪郭線を有する複数の部分を含み、
前記第1抵抗部の複数の部分が、前記第2抵抗部及び前記接続部を介して電気的に接続されていることを特徴とする請求項1に記載のセラミックスヒータ。 - 前記第1抵抗部は、上面視において、前記第1抵抗部の最外周の輪郭線によって画定される仮想円の面積を100%としたときに、前記第1抵抗部の合計面積が50%以上であることを特徴とする請求項1又は2に記載のセラミックスヒータ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018087990A JP7025278B2 (ja) | 2018-05-01 | 2018-05-01 | セラミックスヒータ |
KR1020190039104A KR102274098B1 (ko) | 2018-05-01 | 2019-04-03 | 세라믹스 히터 |
TW108114441A TWI713408B (zh) | 2018-05-01 | 2019-04-25 | 陶瓷加熱器 |
US16/395,587 US10879089B2 (en) | 2018-05-01 | 2019-04-26 | Ceramic heater |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018087990A JP7025278B2 (ja) | 2018-05-01 | 2018-05-01 | セラミックスヒータ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019194939A true JP2019194939A (ja) | 2019-11-07 |
JP7025278B2 JP7025278B2 (ja) | 2022-02-24 |
Family
ID=68385467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018087990A Active JP7025278B2 (ja) | 2018-05-01 | 2018-05-01 | セラミックスヒータ |
Country Status (4)
Country | Link |
---|---|
US (1) | US10879089B2 (ja) |
JP (1) | JP7025278B2 (ja) |
KR (1) | KR102274098B1 (ja) |
TW (1) | TWI713408B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022031124A (ja) * | 2020-08-05 | 2022-02-18 | ウォニク アイピーエス カンパニー リミテッド | 基板支持台及びそれを含む基板処理装置 |
WO2022264729A1 (ja) * | 2021-06-17 | 2022-12-22 | 日本特殊陶業株式会社 | セラミックスヒータおよび保持部材 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102608397B1 (ko) * | 2018-10-16 | 2023-12-01 | 주식회사 미코세라믹스 | 미들 영역 독립 제어 세라믹 히터 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017076580A (ja) * | 2015-10-16 | 2017-04-20 | 日本特殊陶業株式会社 | 加熱部材、静電チャック、及びセラミックヒータ |
JP2017188262A (ja) * | 2016-04-04 | 2017-10-12 | 日本特殊陶業株式会社 | セラミックスヒータ |
JP2018005999A (ja) * | 2016-06-27 | 2018-01-11 | 日本特殊陶業株式会社 | セラミックスヒータ |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6884972B2 (en) * | 1999-12-09 | 2005-04-26 | Ibiden Co., Ltd. | Ceramic plate for a semiconductor producing/inspecting apparatus |
US20040035846A1 (en) * | 2000-09-13 | 2004-02-26 | Yasuji Hiramatsu | Ceramic heater for semiconductor manufacturing and inspecting equipment |
JP2002313781A (ja) * | 2001-04-11 | 2002-10-25 | Sumitomo Electric Ind Ltd | 基板処理装置 |
JP2004296254A (ja) * | 2003-03-27 | 2004-10-21 | Sumitomo Electric Ind Ltd | セラミックスヒータおよびそれを搭載した半導体あるいは液晶製造装置 |
JP4761723B2 (ja) * | 2004-04-12 | 2011-08-31 | 日本碍子株式会社 | 基板加熱装置 |
KR20080037879A (ko) * | 2006-10-27 | 2008-05-02 | 주식회사 코미코 | 히터 및 이의 제조방법 |
JP6530701B2 (ja) * | 2015-12-01 | 2019-06-12 | 日本特殊陶業株式会社 | 静電チャック |
JP6664660B2 (ja) | 2016-03-25 | 2020-03-13 | 住友電気工業株式会社 | マルチゾーンに区分された加熱ヒータ |
US10679873B2 (en) * | 2016-09-30 | 2020-06-09 | Ngk Spark Plug Co., Ltd. | Ceramic heater |
-
2018
- 2018-05-01 JP JP2018087990A patent/JP7025278B2/ja active Active
-
2019
- 2019-04-03 KR KR1020190039104A patent/KR102274098B1/ko active IP Right Grant
- 2019-04-25 TW TW108114441A patent/TWI713408B/zh active
- 2019-04-26 US US16/395,587 patent/US10879089B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017076580A (ja) * | 2015-10-16 | 2017-04-20 | 日本特殊陶業株式会社 | 加熱部材、静電チャック、及びセラミックヒータ |
JP2017188262A (ja) * | 2016-04-04 | 2017-10-12 | 日本特殊陶業株式会社 | セラミックスヒータ |
JP2018005999A (ja) * | 2016-06-27 | 2018-01-11 | 日本特殊陶業株式会社 | セラミックスヒータ |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022031124A (ja) * | 2020-08-05 | 2022-02-18 | ウォニク アイピーエス カンパニー リミテッド | 基板支持台及びそれを含む基板処理装置 |
JP7175348B2 (ja) | 2020-08-05 | 2022-11-18 | ウォニク アイピーエス カンパニー リミテッド | 基板支持台及びそれを含む基板処理装置 |
WO2022264729A1 (ja) * | 2021-06-17 | 2022-12-22 | 日本特殊陶業株式会社 | セラミックスヒータおよび保持部材 |
Also Published As
Publication number | Publication date |
---|---|
JP7025278B2 (ja) | 2022-02-24 |
KR102274098B1 (ko) | 2021-07-06 |
TWI713408B (zh) | 2020-12-11 |
US20190341279A1 (en) | 2019-11-07 |
TW201946492A (zh) | 2019-12-01 |
US10879089B2 (en) | 2020-12-29 |
KR20190126238A (ko) | 2019-11-11 |
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