JP2019064118A - 基板加工装置 - Google Patents

基板加工装置 Download PDF

Info

Publication number
JP2019064118A
JP2019064118A JP2017191502A JP2017191502A JP2019064118A JP 2019064118 A JP2019064118 A JP 2019064118A JP 2017191502 A JP2017191502 A JP 2017191502A JP 2017191502 A JP2017191502 A JP 2017191502A JP 2019064118 A JP2019064118 A JP 2019064118A
Authority
JP
Japan
Prior art keywords
substrate
brittle material
belt
material substrate
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017191502A
Other languages
English (en)
Japanese (ja)
Inventor
平道 谷垣内
Hiramichi Yakaito
平道 谷垣内
勝喜 中田
Katsuyoshi Nakata
勝喜 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2017191502A priority Critical patent/JP2019064118A/ja
Priority to CN201811145215.7A priority patent/CN109571789A/zh
Priority to TW107134282A priority patent/TW201921476A/zh
Priority to KR1020180115818A priority patent/KR20190038416A/ko
Publication of JP2019064118A publication Critical patent/JP2019064118A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP2017191502A 2017-09-29 2017-09-29 基板加工装置 Pending JP2019064118A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017191502A JP2019064118A (ja) 2017-09-29 2017-09-29 基板加工装置
CN201811145215.7A CN109571789A (zh) 2017-09-29 2018-09-28 基板加工装置
TW107134282A TW201921476A (zh) 2017-09-29 2018-09-28 基板加工裝置
KR1020180115818A KR20190038416A (ko) 2017-09-29 2018-09-28 기판 가공 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017191502A JP2019064118A (ja) 2017-09-29 2017-09-29 基板加工装置

Publications (1)

Publication Number Publication Date
JP2019064118A true JP2019064118A (ja) 2019-04-25

Family

ID=65920160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017191502A Pending JP2019064118A (ja) 2017-09-29 2017-09-29 基板加工装置

Country Status (4)

Country Link
JP (1) JP2019064118A (ko)
KR (1) KR20190038416A (ko)
CN (1) CN109571789A (ko)
TW (1) TW201921476A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111430279A (zh) * 2020-04-30 2020-07-17 瑞安市荣海机电有限公司 一种准分子激光退火设备用基板支撑装置
JP2021115723A (ja) * 2020-01-23 2021-08-10 三星ダイヤモンド工業株式会社 基板把持機構および基板加工装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3918792B2 (ja) 2003-09-17 2007-05-23 松下電器産業株式会社 炊飯器

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021115723A (ja) * 2020-01-23 2021-08-10 三星ダイヤモンド工業株式会社 基板把持機構および基板加工装置
JP7098172B2 (ja) 2020-01-23 2022-07-11 三星ダイヤモンド工業株式会社 基板把持機構および基板加工装置
CN111430279A (zh) * 2020-04-30 2020-07-17 瑞安市荣海机电有限公司 一种准分子激光退火设备用基板支撑装置

Also Published As

Publication number Publication date
TW201921476A (zh) 2019-06-01
CN109571789A (zh) 2019-04-05
KR20190038416A (ko) 2019-04-08

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