JP2019064118A - 基板加工装置 - Google Patents
基板加工装置 Download PDFInfo
- Publication number
- JP2019064118A JP2019064118A JP2017191502A JP2017191502A JP2019064118A JP 2019064118 A JP2019064118 A JP 2019064118A JP 2017191502 A JP2017191502 A JP 2017191502A JP 2017191502 A JP2017191502 A JP 2017191502A JP 2019064118 A JP2019064118 A JP 2019064118A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- brittle material
- belt
- material substrate
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Robotics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017191502A JP2019064118A (ja) | 2017-09-29 | 2017-09-29 | 基板加工装置 |
KR1020180115818A KR20190038416A (ko) | 2017-09-29 | 2018-09-28 | 기판 가공 장치 |
CN201811145215.7A CN109571789A (zh) | 2017-09-29 | 2018-09-28 | 基板加工装置 |
TW107134282A TW201921476A (zh) | 2017-09-29 | 2018-09-28 | 基板加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017191502A JP2019064118A (ja) | 2017-09-29 | 2017-09-29 | 基板加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2019064118A true JP2019064118A (ja) | 2019-04-25 |
Family
ID=65920160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017191502A Pending JP2019064118A (ja) | 2017-09-29 | 2017-09-29 | 基板加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2019064118A (ko) |
KR (1) | KR20190038416A (ko) |
CN (1) | CN109571789A (ko) |
TW (1) | TW201921476A (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111430279A (zh) * | 2020-04-30 | 2020-07-17 | 瑞安市荣海机电有限公司 | 一种准分子激光退火设备用基板支撑装置 |
JP2021115723A (ja) * | 2020-01-23 | 2021-08-10 | 三星ダイヤモンド工業株式会社 | 基板把持機構および基板加工装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3918792B2 (ja) | 2003-09-17 | 2007-05-23 | 松下電器産業株式会社 | 炊飯器 |
-
2017
- 2017-09-29 JP JP2017191502A patent/JP2019064118A/ja active Pending
-
2018
- 2018-09-28 CN CN201811145215.7A patent/CN109571789A/zh active Pending
- 2018-09-28 TW TW107134282A patent/TW201921476A/zh unknown
- 2018-09-28 KR KR1020180115818A patent/KR20190038416A/ko unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021115723A (ja) * | 2020-01-23 | 2021-08-10 | 三星ダイヤモンド工業株式会社 | 基板把持機構および基板加工装置 |
JP7098172B2 (ja) | 2020-01-23 | 2022-07-11 | 三星ダイヤモンド工業株式会社 | 基板把持機構および基板加工装置 |
CN111430279A (zh) * | 2020-04-30 | 2020-07-17 | 瑞安市荣海机电有限公司 | 一种准分子激光退火设备用基板支撑装置 |
Also Published As
Publication number | Publication date |
---|---|
CN109571789A (zh) | 2019-04-05 |
TW201921476A (zh) | 2019-06-01 |
KR20190038416A (ko) | 2019-04-08 |
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