JP2019062207A - 電磁エネルギー異常検出部及び処理部を有する集積回路 - Google Patents
電磁エネルギー異常検出部及び処理部を有する集積回路 Download PDFInfo
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- 238000012545 processing Methods 0.000 title claims abstract description 80
- 238000001514 detection method Methods 0.000 title claims abstract description 31
- 230000005856 abnormality Effects 0.000 title abstract description 5
- 238000012544 monitoring process Methods 0.000 claims abstract description 28
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 6
- 230000002265 prevention Effects 0.000 claims abstract description 4
- 230000006866 deterioration Effects 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 26
- 230000008859 change Effects 0.000 claims description 15
- 238000005516 engineering process Methods 0.000 claims description 11
- 230000015556 catabolic process Effects 0.000 claims description 6
- 238000006731 degradation reaction Methods 0.000 claims description 6
- 238000010884 ion-beam technique Methods 0.000 claims description 5
- 238000013500 data storage Methods 0.000 claims description 3
- 230000005670 electromagnetic radiation Effects 0.000 abstract description 7
- 238000004891 communication Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 230000004048 modification Effects 0.000 abstract description 4
- 238000012986 modification Methods 0.000 abstract description 3
- 230000004075 alteration Effects 0.000 abstract 2
- 238000012360 testing method Methods 0.000 description 20
- 230000005855 radiation Effects 0.000 description 17
- 238000004422 calculation algorithm Methods 0.000 description 14
- 238000004458 analytical method Methods 0.000 description 13
- 238000005259 measurement Methods 0.000 description 12
- 230000006870 function Effects 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 10
- 230000004044 response Effects 0.000 description 10
- 230000035945 sensitivity Effects 0.000 description 9
- 238000007689 inspection Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000013528 artificial neural network Methods 0.000 description 7
- 238000005286 illumination Methods 0.000 description 7
- 239000013598 vector Substances 0.000 description 7
- 230000002159 abnormal effect Effects 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000032683 aging Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 238000013459 approach Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000012216 screening Methods 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 3
- 238000004220 aggregation Methods 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 230000001976 improved effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 229910052701 rubidium Inorganic materials 0.000 description 2
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 241000191291 Abies alba Species 0.000 description 1
- 102000005717 Myeloma Proteins Human genes 0.000 description 1
- 108010045503 Myeloma Proteins Proteins 0.000 description 1
- 208000003443 Unconsciousness Diseases 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000012872 hydroxylapatite chromatography Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000009420 retrofitting Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
- H04B1/26—Circuits for superheterodyne receivers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
- G06F21/44—Program or device authentication
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/71—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure computing or processing of information
- G06F21/76—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure computing or processing of information in application-specific integrated circuits [ASIC] or field-programmable devices, e.g. field-programmable gate arrays [FPGA] or programmable logic devices [PLD]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/86—Secure or tamper-resistant housings
- G06F21/87—Secure or tamper-resistant housings by means of encapsulation, e.g. for integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/576—Protection from inspection, reverse engineering or tampering using active circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Abstract
Description
本特許出願は、2011年3月2日に出願された米国仮特許出願第61/464,262号及び2011年7月29日に出願された米国仮特許出願第61/574,250号に関連し、それらの優先権を主張するものであり、それら仮特許出願は、参考として本明細書で援用される。本出願は、更に、「SYSTEM AND METHOD FOR PHYSICALLY DETECTING COUNTERFEIT ELECTRONICS(偽造電子装置を物理的に検出するシステム及び方法)」と題する同時係属中の米国出願第13/410,797号に密接に関連している。本出願は、本発明の譲受人に譲渡されており、当該同時係属中の出願の開示内容は参考として本明細書で援用される。
連邦政府による資金提供を受けた研究開発の記載
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シーケンスリスト、表、又はコンピュータプラグラムリストコンパクトディスク付属物の参照
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発明分野
本発明は、概して、集積回路に関し、より具体的には、本発明は、電磁エネルギー異常検出部及び処理部を有する集積回路に関する。
異常な回路特性の検出は、品質管理および信頼できる演算の両方のドメインである。これは、ある用途で使用されるデバイスが意図されたデバイスであることを保証するための技術的トレンドである。加えて、異常回路特性の検出は、異なるモダリティを使用して達成され得、且つこれらのモダリティの幾つかは、この目的では記述が無い。
本発明は、意図されない放射物を利用して、微細化及び集積化態様において意図的に(例えば、本物の又は正真の部品を偽造部品で交換すること;本物のデバイスを改ざんして非許可の機能を導入すること;本物の機能面を代用の機能面で置き換えること)又は自然な又は意図的に導入されたプロセスによる部品の経時変化、環境的に又は特別な事象に起因して導入され得る部品劣化のような非意図的に引き起こされ得る異常な回路特性を検出する新規な用途を開示する。微細化と集積化がよりうまくいくと、以前は使用不能であった未使用スペースを利用することによってこの追加能力が新たなデバイスに込み込まれ、この一定の監視能力が既存のデバイスに追加され得る。また、微細化は、部品を経時変化、環境の影響及び逆極性、稲妻等のような事象からの損傷に対してより敏感にし、被保護デバイスと保護デバイスの両方が微細になるので、この技術をより重要にする。
従って、本発明の目的は、電磁エネルギー異常検出及び処理部を有する集積回路を提供することである。
本発明のより詳細な説明に進む前に、分かり易いように、理解し易いように、同一の機能を有する同一のコンポーネントは、図面に示す幾つかの図を通して同一の参照番号によって識別されていると述べておく。
Claims (24)
- 集積回路であって、
(a)半導体材料から製造されるダイと、
(b)前記ダイ上に又は前記ダイ内に配置され、且つ少なくとも受信機および処理手段を含むRFエネルギー収集及び処理手段と、
(c)前記RFエネルギー収集及び処理手段に電力を供給するように構成される入力と、
(d)前記RFエネルギー収集及び処理手段による動作上通信するための出力と、を備え
る集積回路。 - 前記出力は、前記RFエネルギー収集及び処理手段の2つの状態を指示するように構成され、それによって、第1の状態は、所定の標準と実質的に整合するRFエネルギーシグネチャを指示し、第2の状態は、前記所定の標準から逸脱する前記RFエネルギーシグネチャを指示する請求項1に記載の集積回路。
- 更に、前記RFエネルギー収集及び処理手段の動作をプログラムするように構成される他の入力を含む請求項1に記載の集積回路。
- 更に、前記ダイ及び他のダイの一方に配置された少なくとも1つの回路と少なくとも1つのディスクリートコンポーネントを含み、前記RFエネルギー収集及び処理手段は、前記少なくとも1つの回路と少なくとも1つのディスクリートコンポーネントの少なくとも一方によって放射されたRFエネルギーに応答する請求項1に記載の集積回路。
- 前記RFエネルギー収集及び処理手段は、集束イオンビーム技術によって、前記少なくとも1つの回路と少なくとも1つのディスクリートコンポーネントの改ざんを検出するように構成される請求項4に記載の集積回路。
- 前記RFエネルギー収集及び処理手段は、集束イオンビーム技術によって、改ざんされた他の集積回路の前記ダイの改ざんを検出するように構成される請求項4に記載の集積回路。
- 前記RFエネルギー収集及び処理手段は、同じ物理コンポーネントパッケージに一体化され且つ包まれる他の集積回路の少なくとも前記ダイの改ざんを検出するように構成される請求項4に記載の集積回路。
- 前記RFエネルギー収集及び処理手段は、前記集積回路内で動作するソフトウェアとファームウェアの変更及び改ざんの少なくとも一方を検出するように構成される請求項4に記載の集積回路。
- 前記RFエネルギー収集及び処理手段は、前記少なくとも1つの回路と少なくとも1つのディスクリートコンポーネントの少なくとも1つの改ざんと偽造の少なくとも一方を検出するように構成される請求項4に記載の集積回路。
- 前記RFエネルギー収集及び処理手段は、前記ダイの改ざんを検出するように構成される請求項4に記載の集積回路。
- 回路基板アセンブリ内に取り付けられ、且つ前記RFエネルギー収集及び処理手段が前記回路基板アセンブリ上の少なくとも1つのコンポーネントによって放射されたRFエネルギーに応答する請求項1に記載の集積回路。
- 前記RFエネルギー収集及び処理手段は、前記回路基板アセンブリ上の前記少なくとも1つのコンポーネントの改ざんと偽造の少なくとも一方を検出するように構成される請求項11に記載の集積回路。
- 前記RFエネルギー収集及び処理手段は、前記少なくとも1つのコンポーネントの劣化を検出するように構成される請求項11に記載の集積回路。
- 少なくとも1つの回路基板アセンブリを含む電気デバイスに取り付けられ、且つ前記RFエネルギー収集及び処理手段が前記少なくとも1つの回路、又はそれに設けられる少なくとも1つのコンポーネントの改ざんと偽造の少なくとも一方を検出するように構成される請求項1に記載の集積回路。
- 前記RFエネルギー収集及び処理手段は、前記回路基板アセンブリ内に取り付けられた前記集積回路を有する前記回路基板アセンブリ内に取り付けられた前記少なくとも1つのコンポーネントの稼働状況の監視を行うように構成される請求項13に記載の集積回路。
- 更に、前記RFエネルギー収集及び処理手段と動作上結合されているアンテナを含む請求項1に記載の集積回路。
- 前記アンテナは、前記ダイの上又は前記ダイの中に配置される請求項16に記載の集積回路。
- ダイ、集積回路、電子コンポーネント、回路基板、幾つかの回路基板のアセンブリ又は完全に組み立てられた製品の少なくとも1つの中の少なくとも1つの電磁シグネチャ異常を検出するように構成される請求項1に記載の集積回路。
- 前記少なくとも1つの電磁シグネチャ異常は、ハードウェアに対する変更、ファームウェアに対する変更及びソフトウェアに対する変更の少なくとも1つの結果である請求項18に記載の集積回路。
- デバイスであって、
(a)少なくとも1つのアンテナと、
(b)基板上に配置され、且つ受信機、処理手段及びデータ記憶手段を含むRFエネルギー収集及び処理手段で構成される集積回路のダイと、
(c)その上に配置された他の集積回路を有する少なくとも1つの他のダイと、
(d)前記ダイと前記他のダイを前記集積回路上の適切な接続入力と出力ピンにインターフェース接続するために必要な相互接続部と、を備えるデバイス。 - 前記RFエネルギー収集及び処理手段を含む前記ダイは、前記他の集積回路の前記他のダイのRFエネルギー放射物、及び前記RFエネルギー収集及び処理手段によって収集された前記放射物の特性を変化する何らかの要因に起因する前記RFエネルギー放射物に対する何らかの変化を連続して監視する請求項20に記載のデバイス。
- 改ざん検出、改ざん防止監視、劣化監視、稼働状況の監視、偽造検出、ソフトウェア変更監視、ファームウェア変更監視及び前記デバイスの故障の少なくとも1つを行うように構成される請求項20に記載のデバイス。
- 前記デバイスは、前記デバイスの前記ダイと前記他のダイの少なくとも一方の残存耐用年数(RUL)を自己予測するように構成される請求項22に記載のデバイス。
- 更に、ハードウェア、ファームウェア又はソフトウェア改ざんの少なくとも1つの事象において、前記デバイスの動作を無効にするための手段を含む請求項22に記載のデバイス。
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Application Number | Priority Date | Filing Date | Title |
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US201161464262P | 2011-03-02 | 2011-03-02 | |
US201161574250P | 2011-07-29 | 2011-07-29 | |
US13/410,909 US9059189B2 (en) | 2011-03-02 | 2012-03-02 | Integrated circuit with electromagnetic energy anomaly detection and processing |
US13/410,909 | 2012-03-02 |
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US (2) | US9059189B2 (ja) |
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US20120223403A1 (en) | 2012-09-06 |
JP2015511768A (ja) | 2015-04-20 |
EP2820675A1 (en) | 2015-01-07 |
EP2820675B1 (en) | 2020-06-24 |
WO2013131031A1 (en) | 2013-09-06 |
US20160112083A1 (en) | 2016-04-21 |
US9059189B2 (en) | 2015-06-16 |
US9887721B2 (en) | 2018-02-06 |
EP2820675A4 (en) | 2015-03-25 |
JP6779270B2 (ja) | 2020-11-04 |
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