JP2018532293A5 - - Google Patents

Download PDF

Info

Publication number
JP2018532293A5
JP2018532293A5 JP2018509503A JP2018509503A JP2018532293A5 JP 2018532293 A5 JP2018532293 A5 JP 2018532293A5 JP 2018509503 A JP2018509503 A JP 2018509503A JP 2018509503 A JP2018509503 A JP 2018509503A JP 2018532293 A5 JP2018532293 A5 JP 2018532293A5
Authority
JP
Japan
Prior art keywords
substrate
sensor
tiles
array
imaging apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2018509503A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018532293A (ja
Filing date
Publication date
Priority claimed from US14/828,772 external-priority patent/US9599723B2/en
Application filed filed Critical
Publication of JP2018532293A publication Critical patent/JP2018532293A/ja
Publication of JP2018532293A5 publication Critical patent/JP2018532293A5/ja
Ceased legal-status Critical Current

Links

JP2018509503A 2015-08-18 2016-07-26 タイル張りの画像センサを用いた方法および装置 Ceased JP2018532293A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/828,772 US9599723B2 (en) 2015-08-18 2015-08-18 Method and apparatus with tiled image sensors
US14/828,772 2015-08-18
PCT/US2016/043962 WO2017030751A1 (en) 2015-08-18 2016-07-26 Method and apparatus with tiled image sensors

Publications (2)

Publication Number Publication Date
JP2018532293A JP2018532293A (ja) 2018-11-01
JP2018532293A5 true JP2018532293A5 (enExample) 2019-09-12

Family

ID=56682254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018509503A Ceased JP2018532293A (ja) 2015-08-18 2016-07-26 タイル張りの画像センサを用いた方法および装置

Country Status (7)

Country Link
US (2) US9599723B2 (enExample)
EP (1) EP3338111A1 (enExample)
JP (1) JP2018532293A (enExample)
KR (1) KR20180074660A (enExample)
CN (1) CN108291972A (enExample)
TW (1) TW201724548A (enExample)
WO (1) WO2017030751A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107850678B (zh) * 2015-07-17 2021-05-18 模拟技术公司 用于辐射成像模态装置的探测器阵列的探测器单元
US9599723B2 (en) * 2015-08-18 2017-03-21 Carestream Health, Inc. Method and apparatus with tiled image sensors
US10686003B2 (en) * 2015-12-31 2020-06-16 General Electric Company Radiation detector assembly
WO2018202465A1 (en) * 2017-05-01 2018-11-08 Koninklijke Philips N.V. Multi-layer radiation detector
US11156510B2 (en) * 2017-05-26 2021-10-26 Shenzhen New Degree Technology Co., Ltd. Key unit and key array
CN107361858A (zh) * 2017-08-29 2017-11-21 蒙显章 一次性手术定位膜及定位膜包
US11942503B2 (en) 2018-05-08 2024-03-26 Eastern Blue Technologies, Inc. Module and methods of assembly for large area flat panel detectors
KR102393910B1 (ko) * 2019-03-22 2022-05-03 아크소프트 코포레이션 리미티드 타일형 이미지 센서
US11869912B2 (en) 2020-07-15 2024-01-09 Semiconductor Components Industries, Llc Method for defining a gap height within an image sensor package
CN114520239B (zh) * 2020-11-20 2025-05-13 京东方科技集团股份有限公司 X射线平板探测器及其制作方法、探测装置、成像系统
US12261186B2 (en) 2021-03-25 2025-03-25 Raytheon Company Mosaic focal plane array
CN115201236B (zh) * 2021-04-14 2025-10-24 佳能医疗系统株式会社 放射线检测器模块、放射线检测器及x射线ct装置
JP2024065926A (ja) * 2022-10-31 2024-05-15 キヤノン株式会社 放射線検出装置、その製造方法、センサモジュール及びct装置

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3707760A (en) 1971-05-19 1973-01-02 Sieburg Ind Inc Method and device for article working such as fracturing of semiconductor slices and separating semiconductor chips
US4617420A (en) 1985-06-28 1986-10-14 The Standard Oil Company Flexible, interconnected array of amorphous semiconductor photovoltaic cells
US4942405A (en) 1988-10-11 1990-07-17 Hewlett-Packard Company Light emitting diode print head assembly
US5072074A (en) 1990-07-24 1991-12-10 Interflex Corporation High yield combined rigid and flexible printed circuits and method of manufacture
US5453145A (en) 1991-03-04 1995-09-26 Eastman Kodak Company Z-axis dimensional control in manufacturing an LED printhead
US5254480A (en) 1992-02-20 1993-10-19 Minnesota Mining And Manufacturing Company Process for producing a large area solid state radiation detector
FR2693033B1 (fr) 1992-06-30 1994-08-19 Commissariat Energie Atomique Dispositif d'imagerie de grande dimension.
US5693947A (en) 1993-04-28 1997-12-02 The University Of Surrey Radiation detectors
US5670009A (en) 1995-02-28 1997-09-23 Eastman Kodak Company Assembly technique for an image sensor array
JP3235717B2 (ja) * 1995-09-28 2001-12-04 キヤノン株式会社 光電変換装置及びx線撮像装置
JP3805031B2 (ja) 1995-10-20 2006-08-02 キヤノン株式会社 光電変換装置
US5909244A (en) 1996-04-15 1999-06-01 Massachusetts Institute Of Technology Real time adaptive digital image processing for dynamic range remapping of imagery including low-light-level visible imagery
GB2315157B (en) 1996-07-11 1998-09-30 Simage Oy Imaging apparatus
US5827757A (en) 1996-07-16 1998-10-27 Direct Radiography Corp. Fabrication of large area x-ray image capturing element
US5834782A (en) 1996-11-20 1998-11-10 Schick Technologies, Inc. Large area image detector
JP3285815B2 (ja) 1998-03-12 2002-05-27 松下電器産業株式会社 リードフレーム,樹脂封止型半導体装置及びその製造方法
WO2001048831A1 (en) 1999-12-24 2001-07-05 Bae Systems Information And Electronic Systems Integration, Inc. Multi-color, multi-focal plane optical detector
JP3637826B2 (ja) 2000-01-21 2005-04-13 セイコーエプソン株式会社 半導体記憶装置
US6426991B1 (en) 2000-11-16 2002-07-30 Koninklijke Philips Electronics N.V. Back-illuminated photodiodes for computed tomography detectors
US6510195B1 (en) 2001-07-18 2003-01-21 Koninklijke Philips Electronics, N.V. Solid state x-radiation detector modules and mosaics thereof, and an imaging method and apparatus employing the same
US6782076B2 (en) 2001-12-07 2004-08-24 Bede Scientific Instruments Limited X-ray topographic system
US7868665B2 (en) 2002-03-05 2011-01-11 Nova R&D, Inc. Integrated circuit and sensor for imaging
US6946661B2 (en) 2002-12-23 2005-09-20 Ge Medical Systems Global Technology Company, Llc Methods and apparatus for X-ray image detector assemblies
US7379528B2 (en) 2003-01-06 2008-05-27 Koninklijke Philips Electronics N.V. Radiation detector with shielded electronics for computed tomography
CN1973214B (zh) * 2003-11-10 2010-09-15 江苏康众数字医疗设备有限公司 使用电互连的平铺光电传感器阵列的平板检测器
US20050098732A1 (en) 2003-11-10 2005-05-12 Ls Technologies, Inc. Flat-panel detector utilizing electrically interconnecting tiled photosensor arrays
US7067817B2 (en) 2004-01-29 2006-06-27 Hamamatsu Photonics K.K. Radiation image sensor and making method of same
CN101006362A (zh) 2004-08-13 2007-07-25 皇家飞利浦电子股份有限公司 固态辐射探测器封装技术
US7539284B2 (en) 2005-02-11 2009-05-26 Besson Guy M Method and system for dynamic low dose X-ray imaging
US20060192087A1 (en) 2005-02-28 2006-08-31 Real Time Radiography Ltd. Two-dimensional CMOS-based flat panel imaging sensor
CN101278208A (zh) 2005-10-05 2008-10-01 皇家飞利浦电子股份有限公司 使用薄电路的计算机断层摄影探测器
RU2408110C2 (ru) 2006-03-30 2010-12-27 Конинклейке Филипс Электроникс, Н.В. Матрица детекторов излучения
US7692709B2 (en) 2006-05-12 2010-04-06 Ricoh Co., Ltd. End-to-end design of electro-optic imaging systems with adjustable optical cutoff frequency
WO2008003351A1 (en) 2006-07-04 2008-01-10 Mario Caria Imaging system with tiled sensor chips having partially overlapping active areas
US7450683B2 (en) 2006-09-07 2008-11-11 General Electric Company Tileable multi-layer detector
GB2446185A (en) 2006-10-30 2008-08-06 Sensl Technologies Ltd Optical assembly and method of assembly
RU2510520C2 (ru) 2008-11-21 2014-03-27 Трикселль Способ сборки ячеистого радиационного детектора
JP5665494B2 (ja) * 2010-06-24 2015-02-04 キヤノン株式会社 放射線検出装置及び放射線撮像システム
US9012262B2 (en) 2011-04-19 2015-04-21 Teledyne Rad-Icon Imaging Corp. Method of direct tiling of an image sensor array
US9012859B2 (en) 2012-05-18 2015-04-21 General Electric Company Tiled X-ray imager panel and method of forming the same
JP6000680B2 (ja) * 2012-06-20 2016-10-05 キヤノン株式会社 放射線検出装置、その製造方法及び撮像システム
EA021593B1 (ru) 2012-11-21 2015-07-30 Закрытое Акционерное Общество "Импульс" Детектор рентгеновского изображения, способ изготовления фоточувствительного элемента и способ изготовления детектора
US9599723B2 (en) * 2015-08-18 2017-03-21 Carestream Health, Inc. Method and apparatus with tiled image sensors

Similar Documents

Publication Publication Date Title
JP2018532293A5 (enExample)
US12254147B2 (en) Electronic device display with array of discrete light-emitting diodes
CN107491215B (zh) 一种压力触控显示面板、其检测方法及显示装置
JP2014513279A5 (enExample)
EP3270419A3 (en) Image sensor and electronic device including the same
JP2015055896A5 (enExample)
US20160111604A1 (en) Method for expanding spacings in light-emitting element array and light-emitting element array unit
EP3220433A3 (en) Display device
WO2009016407A3 (en) Tiled light sensing array
JP2017101982A5 (enExample)
JP2018523848A5 (enExample)
JP2015169711A5 (enExample)
JP2010517432A5 (enExample)
EP2228826A3 (en) Solid-state image pickup device and a method of manufacturing the same
JP2013186030A5 (enExample)
GB0915145D0 (en) Packaging methods for imager devices
JP2017097096A5 (enExample)
JP2015528133A5 (enExample)
TW201724548A (zh) 使用分片式影像感測器之方法及設備
TWI449005B (zh) 功能性膜片貼合方法、貼合機台及膜片貼合對位方法
WO2008063551A3 (en) Gauge to measure distortion in glass sheet
JP6004123B2 (ja) 圧電センサの製造方法
KR20170037503A (ko) 유기 발광 표시 장치 및 그 제조 방법, 상기 유기 발광 표시 장치를 사용한 전자 기기
CN104361832A (zh) 显示面板及其制造方法
CN105094399A (zh) 弧形触控显示装置及其制作方法