JP2018523734A - 高導電性組成物の堆積による電磁干渉シールド保護の達成 - Google Patents
高導電性組成物の堆積による電磁干渉シールド保護の達成 Download PDFInfo
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PCT/US2016/044700 WO2017023747A1 (en) | 2015-08-03 | 2016-07-29 | Achieving electromagnetic interference shielding protection by deposition of highly conductive compositions |
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WO2017070843A1 (en) * | 2015-10-27 | 2017-05-04 | Henkel Ag & Co. Kgaa | A conductive composition for low frequency emi shielding |
WO2019009124A1 (ja) * | 2017-07-07 | 2019-01-10 | タツタ電線株式会社 | 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法 |
KR102428873B1 (ko) * | 2017-10-13 | 2022-08-02 | 타츠타 전선 주식회사 | 차폐 패키지 |
WO2019198336A1 (ja) * | 2018-04-10 | 2019-10-17 | タツタ電線株式会社 | 導電性塗料及び該導電性塗料を用いたシールドパッケージの製造方法 |
JP6521138B1 (ja) * | 2018-04-19 | 2019-05-29 | 東洋インキScホールディングス株式会社 | 成形フィルム用導電性組成物、成形フィルム、成形体およびその製造方法 |
CN111326280A (zh) * | 2020-03-20 | 2020-06-23 | 广州新视界光电科技有限公司 | 一种石墨烯导电薄膜及其制备方法和应用 |
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TW202204552A (zh) * | 2020-07-23 | 2022-02-01 | 位元奈米科技股份有限公司 | 抗電磁干擾薄膜及其製作方法 |
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GB202020709D0 (en) * | 2020-12-30 | 2021-02-10 | Ams Sensors Singapore Pte Ltd | Method of shielding electronic modules from radio frequency electromagnetic radiation |
CN113025160B (zh) * | 2021-03-12 | 2021-11-23 | 东莞市德聚胶接技术有限公司 | 一种耐高温电磁屏蔽涂料及其应用 |
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EP3331943A4 (en) | 2019-03-06 |
CN108602976A (zh) | 2018-09-28 |
TW201716518A (zh) | 2017-05-16 |
US20180163063A1 (en) | 2018-06-14 |
TWI797061B (zh) | 2023-04-01 |
WO2017023747A1 (en) | 2017-02-09 |
KR102633369B1 (ko) | 2024-02-06 |
KR20180036985A (ko) | 2018-04-10 |
US10858523B2 (en) | 2020-12-08 |
EP3331943A1 (en) | 2018-06-13 |
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