JP2018523734A - 高導電性組成物の堆積による電磁干渉シールド保護の達成 - Google Patents

高導電性組成物の堆積による電磁干渉シールド保護の達成 Download PDF

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JP2018523734A
JP2018523734A JP2018505734A JP2018505734A JP2018523734A JP 2018523734 A JP2018523734 A JP 2018523734A JP 2018505734 A JP2018505734 A JP 2018505734A JP 2018505734 A JP2018505734 A JP 2018505734A JP 2018523734 A JP2018523734 A JP 2018523734A
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ジャンボ ガオ、
ジャンボ ガオ、
チージュオ ジュオ、
チージュオ ジュオ、
シンペイ カオ、
シンペイ カオ、
グレンダ カスタネーダ、
グレンダ カスタネーダ、
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ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング
ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング
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    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/32—Radiation-absorbing paints
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    • H01—ELECTRIC ELEMENTS
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    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
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    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09D133/10—Homopolymers or copolymers of methacrylic acid esters
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    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
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    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
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    • C09D7/68—Particle size between 100-1000 nm
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    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
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    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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  • Chemical & Material Sciences (AREA)
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  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2018505734A 2015-08-03 2016-07-29 高導電性組成物の堆積による電磁干渉シールド保護の達成 Pending JP2018523734A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562200267P 2015-08-03 2015-08-03
US62/200,267 2015-08-03
PCT/US2016/044700 WO2017023747A1 (en) 2015-08-03 2016-07-29 Achieving electromagnetic interference shielding protection by deposition of highly conductive compositions

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JP2018523734A true JP2018523734A (ja) 2018-08-23

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US (1) US10858523B2 (zh)
EP (1) EP3331943A4 (zh)
JP (1) JP2018523734A (zh)
KR (1) KR102633369B1 (zh)
CN (1) CN108602976A (zh)
TW (1) TWI797061B (zh)
WO (1) WO2017023747A1 (zh)

Cited By (2)

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JP2020139019A (ja) * 2019-02-27 2020-09-03 ナミックス株式会社 電磁波シールド用スプレー塗布剤
JP2020143225A (ja) * 2019-03-07 2020-09-10 ナミックス株式会社 電磁波シールド用スプレー塗布剤

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JP5985785B1 (ja) * 2014-09-30 2016-09-06 タツタ電線株式会社 電子部品のパッケージのシールド用導電性塗料及びそれを用いたシールドパッケージの製造方法
WO2017070843A1 (en) * 2015-10-27 2017-05-04 Henkel Ag & Co. Kgaa A conductive composition for low frequency emi shielding
WO2019009124A1 (ja) * 2017-07-07 2019-01-10 タツタ電線株式会社 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法
KR102428873B1 (ko) * 2017-10-13 2022-08-02 타츠타 전선 주식회사 차폐 패키지
WO2019198336A1 (ja) * 2018-04-10 2019-10-17 タツタ電線株式会社 導電性塗料及び該導電性塗料を用いたシールドパッケージの製造方法
JP6521138B1 (ja) * 2018-04-19 2019-05-29 東洋インキＳｃホールディングス株式会社 成形フィルム用導電性組成物、成形フィルム、成形体およびその製造方法
CN111326280A (zh) * 2020-03-20 2020-06-23 广州新视界光电科技有限公司 一种石墨烯导电薄膜及其制备方法和应用
CN111334165A (zh) * 2020-05-08 2020-06-26 滨州学院 一种适用于雷击大电流导电涂料及其制备方法
TW202204552A (zh) * 2020-07-23 2022-02-01 位元奈米科技股份有限公司 抗電磁干擾薄膜及其製作方法
US11882673B1 (en) * 2020-11-25 2024-01-23 Advanced Cooling Technologies, Inc. Heat spreader having conduction enhancement with EMI shielding
GB202020709D0 (en) * 2020-12-30 2021-02-10 Ams Sensors Singapore Pte Ltd Method of shielding electronic modules from radio frequency electromagnetic radiation
CN113025160B (zh) * 2021-03-12 2021-11-23 东莞市德聚胶接技术有限公司 一种耐高温电磁屏蔽涂料及其应用

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JP2011076866A (ja) * 2009-09-30 2011-04-14 Mitsuboshi Belting Ltd 積層体、この積層体を用いた導電性基材及びその製造方法
JP2011187194A (ja) * 2010-03-05 2011-09-22 Sumitomo Bakelite Co Ltd 導電性ペースト
JP2013114837A (ja) * 2011-11-28 2013-06-10 Kyoto Elex Kk 加熱硬化型導電性ペースト組成物
JP2013159805A (ja) * 2012-02-02 2013-08-19 Toda Kogyo Corp 銀微粒子の製造法及び該銀微粒子の製造法によって得られた銀微粒子並びに該銀微粒子を含有する導電性ペースト
JP2014049380A (ja) * 2012-09-03 2014-03-17 Ishihara Sangyo Kaisha Ltd 金属ペースト及びそれを用いて形成した印刷パターン
JP2014181316A (ja) * 2013-03-21 2014-09-29 Gunze Ltd 導電性ペースト、それを用いた電磁波シールド材及びタッチパネル
JP2014216089A (ja) * 2013-04-23 2014-11-17 京都エレックス株式会社 加熱硬化型導電性ペースト組成物
JP2015076233A (ja) * 2013-10-08 2015-04-20 東洋紡株式会社 導電性ペースト、及び金属薄膜

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020139019A (ja) * 2019-02-27 2020-09-03 ナミックス株式会社 電磁波シールド用スプレー塗布剤
JP7164181B2 (ja) 2019-02-27 2022-11-01 ナミックス株式会社 電磁波シールド用スプレー塗布剤
JP2020143225A (ja) * 2019-03-07 2020-09-10 ナミックス株式会社 電磁波シールド用スプレー塗布剤
JP7185289B2 (ja) 2019-03-07 2022-12-07 ナミックス株式会社 電磁波シールド用スプレー塗布剤

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EP3331943A4 (en) 2019-03-06
CN108602976A (zh) 2018-09-28
TW201716518A (zh) 2017-05-16
US20180163063A1 (en) 2018-06-14
TWI797061B (zh) 2023-04-01
WO2017023747A1 (en) 2017-02-09
KR102633369B1 (ko) 2024-02-06
KR20180036985A (ko) 2018-04-10
US10858523B2 (en) 2020-12-08
EP3331943A1 (en) 2018-06-13

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