JP2018519659A - 磁気トンネル接合をパターニングするためのハードマスク - Google Patents
磁気トンネル接合をパターニングするためのハードマスク Download PDFInfo
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- H—ELECTRICITY
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10N50/00—Galvanomagnetic devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Abstract
【選択図】図7
Description
Claims (15)
- 磁気トンネル接合層と、
前記磁気トンネル接合層上に配置された誘電体キャップ層と、
前記誘電体キャップ層上に配置されたエッチング停止層と、
前記エッチング停止層上に配置された導電性ハードマスク層と、
前記導電性ハードマスク層上に配置された誘電体ハードマスク層と、
前記誘電体ハードマスク層上に配置されたスピンオンカーボン層と、
前記スピンオンカーボン層上に配置された反射防止被覆層と
を備える、膜スタック。 - 底部電極を備える基板であって、前記膜スタックの前記磁気トンネル接合層が前記基板上に配置されている基板をさらに備える、請求項1に記載の膜スタック。
- 前記反射防止被覆層上に配置されたフォトレジスト層をさらに備える、請求項2に記載の膜スタック。
- 前記誘電体キャップ層は、酸化マグネシウム材料、酸化アルミニウム材料、酸化亜鉛材料、酸化チタン材料、酸化タンタル材料、窒化タンタル材料、並びにこれらの組み合わせ及び混合物のうちの1つ以上から形成されている、請求項1に記載の膜スタック。
- 前記エッチング停止層は、ルテニウム含有材料、タングステン含有材料、タンタル含有材料、白金含有材料、ニッケル含有材料、コバルト含有材料、並びにこれらの組み合わせ及び混合物のうちの1つ以上から形成されている、請求項1に記載の膜スタック。
- 前記導電性ハードマスク層は、タンタル含有材料、窒化タンタル含有材料、チタン含有材料、窒化チタン含有材料、タングステン含有材料、窒化タングステン含有材料、並びにこれらの組み合わせ及び混合物のうちの1つ以上から形成されている、請求項1に記載の膜スタック。
- 前記誘電体ハードマスク層は、酸化ケイ素含有材料、酸化アルミニウム含有材料、窒化ケイ素含有材料、並びにこれらの組み合わせ及び混合物のうちの1つ以上から形成されている、請求項1に記載の膜スタック。
- 前記誘電体キャップ層は、前記膜スタック内の他の層からの金属イオンの拡散から前記磁気トンネル接合層を保護するように構成されている、請求項1に記載の膜スタック。
- 磁気トンネル接合層と、
前記磁気トンネル接合層上に配置された、5Åと20Åの間の厚さを有する誘電体キャップ層と、
前記誘電体キャップ層上に配置された、5Åと50Åの間の厚さを有するエッチング停止層と、
前記エッチング停止層上に配置された、400Åと1000Åの間の厚さを有する導電性ハードマスク層と、
前記導電性ハードマスク層上に配置された誘電体ハードマスク層と、
前記誘電体ハードマスク層上に配置されたスピンオンカーボン層と、
前記スピンオンカーボン層上に配置された反射防止被覆層と
を備える、膜スタック。 - 前記誘電体ハードマスク層は、約400Åと約1000Åの間の厚さを有する、請求項9に記載の膜スタック。
- 前記スピンオンカーボン層は、約500Åと約2500Åの間の厚さを有する、請求項9に記載の膜スタック。
- 前記導電性ハードマスク層の前記側壁は、水平基準面に対して85°よりも大きい側壁角を有する、請求項9に記載の膜スタック。
- 前記側壁角は、100nmと400nmの間のピッチを有する磁気トンネル接合デバイス上で達成される、請求項12に記載の膜スタック。
- 膜スタックをエッチングする方法であって、
フォトレジスト層をパターニングして膜スタックの反射防止被覆層をエッチングすることと、
前記反射防止被覆層を第1のマスクとして用いて前記膜スタックのスピンオンカーボン層をエッチングすることと、
前記スピンオンカーボン層を第2のマスクとして用いて前記膜スタックの誘電体ハードマスク層をエッチングすることと、
前記誘電体ハードマスク層を第3のマスクとして用いて前記膜スタックの導電性ハードマスク層をエッチングすることと、
前記導電性ハードマスク層を第4のマスクとして用いて前記膜スタックのエッチング停止層をエッチングし、前記膜スタックの誘電体キャップ層を露出することとを含み、前記誘電体キャップ層は磁気トンネル接合層上に配置されている、方法。 - 前記導電性ハードマスク層を前記エッチングすることによって、前記導電性ハードマスク層の側壁が、水平基準面に対して85°よりも大きい側壁角を有する結果となる、請求項14に記載の方法。
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US14/755,964 US20160351799A1 (en) | 2015-05-30 | 2015-06-30 | Hard mask for patterning magnetic tunnel junctions |
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KR (1) | KR102578718B1 (ja) |
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KR20180004303A (ko) | 2018-01-10 |
JP2021184473A (ja) | 2021-12-02 |
TW201709576A (zh) | 2017-03-01 |
KR102578718B1 (ko) | 2023-09-15 |
TW202205706A (zh) | 2022-02-01 |
TWI737607B (zh) | 2021-09-01 |
CN107660315A (zh) | 2018-02-02 |
US20160351799A1 (en) | 2016-12-01 |
WO2016195946A1 (en) | 2016-12-08 |
JP7032139B2 (ja) | 2022-03-08 |
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