JP2018517801A - 粘着テープ及びその製造方法 - Google Patents
粘着テープ及びその製造方法 Download PDFInfo
- Publication number
- JP2018517801A JP2018517801A JP2017555517A JP2017555517A JP2018517801A JP 2018517801 A JP2018517801 A JP 2018517801A JP 2017555517 A JP2017555517 A JP 2017555517A JP 2017555517 A JP2017555517 A JP 2017555517A JP 2018517801 A JP2018517801 A JP 2018517801A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensitive adhesive
- adhesive tape
- temperature
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 108
- 239000011148 porous material Substances 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000000203 mixture Substances 0.000 claims abstract description 34
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 27
- 230000035699 permeability Effects 0.000 claims description 29
- 239000000178 monomer Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 21
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- 239000004088 foaming agent Substances 0.000 claims description 19
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- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 11
- 239000004094 surface-active agent Substances 0.000 claims description 11
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- NBOCQTNZUPTTEI-UHFFFAOYSA-N 4-[4-(hydrazinesulfonyl)phenoxy]benzenesulfonohydrazide Chemical compound C1=CC(S(=O)(=O)NN)=CC=C1OC1=CC=C(S(=O)(=O)NN)C=C1 NBOCQTNZUPTTEI-UHFFFAOYSA-N 0.000 description 2
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- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
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- IEQWWMKDFZUMMU-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethyl)butanedioic acid Chemical compound OC(=O)CC(C(O)=O)CCOC(=O)C=C IEQWWMKDFZUMMU-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- 125000006176 2-ethylbutyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(C([H])([H])*)C([H])([H])C([H])([H])[H] 0.000 description 1
- UXTGJIIBLZIQPK-UHFFFAOYSA-N 3-(2-prop-2-enoyloxyethyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(CCOC(=O)C=C)=C1C(O)=O UXTGJIIBLZIQPK-UHFFFAOYSA-N 0.000 description 1
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- ICGLPKIVTVWCFT-UHFFFAOYSA-N 4-methylbenzenesulfonohydrazide Chemical compound CC1=CC=C(S(=O)(=O)NN)C=C1 ICGLPKIVTVWCFT-UHFFFAOYSA-N 0.000 description 1
- LIFHMKCDDVTICL-UHFFFAOYSA-N 6-(chloromethyl)phenanthridine Chemical compound C1=CC=C2C(CCl)=NC3=CC=CC=C3C2=C1 LIFHMKCDDVTICL-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
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- SXHLENDCVBIJFO-UHFFFAOYSA-M sodium;2-[2-(2-dodecoxyethoxy)ethoxy]ethyl sulfate Chemical compound [Na+].CCCCCCCCCCCCOCCOCCOCCOS([O-])(=O)=O SXHLENDCVBIJFO-UHFFFAOYSA-M 0.000 description 1
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- 229920001169 thermoplastic Polymers 0.000 description 1
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- 239000012942 water-based acrylic adhesive Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D5/00—Rigid or semi-rigid containers of polygonal cross-section, e.g. boxes, cartons or trays, formed by folding or erecting one or more blanks made of paper
- B65D5/42—Details of containers or of foldable or erectable container blanks
- B65D5/70—Break-in flaps, or members adapted to be torn-off, to provide pouring openings
- B65D5/708—Separate tearable flexible elements covering a discharge opening of a container, e.g. adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
- C09J125/02—Homopolymers or copolymers of hydrocarbons
- C09J125/04—Homopolymers or copolymers of styrene
- C09J125/08—Copolymers of styrene
- C09J125/14—Copolymers of styrene with unsaturated esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C09J2400/20—Presence of organic materials
- C09J2400/24—Presence of a foam
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Abstract
Description
以下、本発明を具体的に説明するために実施例を挙げて詳細に説明することにする。但し、本発明に係る実施例は色々な他の形態に変形することができるものであって、本発明の範囲が下記に記述する実施例に限定されるものではない。本明細書の実施例は当業界で平均的な知識を有する者に本発明をより完全に説明するために提供されるものである。
アクリル酸(AA)、メチル(メタ)アクリレート(MMA)、エチルヘキシルアクリレート(EHA)、エチルアクリレート(EA)、ブチルアクリレート(BA)、水及びポリ(エチレングリコール)ノニルフェニルテトラアンモニウムスルフェート乳化剤を共重合させて重量平均分子量10,000,000g/molのアクリル系樹脂を得た。各成分の含量は下記の表1のとおりである。
第1〜第4温度、熟成時の温度及び時間、及び巻取り構造の製作可否を異にしたことを除いては、前記実施例と同様の方法により粘着テープを製造した。
ASTM E96の条件に従ってwater methodによって測定した。具体的には、各々の粘着シートを切って46mm直径を有する円形のサンプルを準備し、前記各サンプルを恒温除湿チャンバーに入れる前の重さである初期重さを測定し、その次に恒温除湿チャンバーで40℃及び相対湿度20%の条件下に24時間放置した後の重さである後期重さを測定して、下記の式1により透湿度を計算した。
[式1]
透湿度(g/m2・day)=(初期重さ−後期重さ)/面積
前記実施例により製造された粘着テープの表面を光学顕微鏡(Huvitz社、HRM300、10倍対物レンズ)を使って撮影し、それを図2に示す。前記粘着テープの表面に現れた気孔の大きさを画像処理プログラムを用いて算術平均直径として測定した。
前記表2を参照すれば、本発明の一実施態様による発泡及び熱硬化条件、ロール形態の製作条件、熟成条件を全て満たす実施例の場合、透湿度3500g/m2・dayの結果を示した。
20 基材
100 粘着テープ
Claims (15)
- 基材、及び
前記基材の一面上に備えられ、水性アクリル系粘着剤組成物の硬化物を含む粘着シートを含み、
前記粘着シートは気孔を含む多孔性構造であり、
透湿度が温度40℃及び相対湿度20%の条件で3,000g/m2・day以上5,000g/m2・day以下である粘着テープ。 - 前記気孔の大きさは0.5μm以上200μm以下である、請求項1に記載の粘着テープ。
- 前記粘着シートの厚さは10μm以上100μm以下である、請求項1に記載の粘着テープ。
- 前記粘着シートの気孔の面積比率は10cm×10cmの単位面積に対して10%以上60%以下である、請求項1に記載の粘着テープ。
- 前記水性アクリル系粘着剤組成物は、
アクリル系樹脂、及び
熱発泡剤、硬化剤及び界面活性剤からなる群より選択される1種以上の添加剤を含む、請求項1に記載の粘着テープ。 - 前記アクリル系樹脂は、(メタ)アクリル酸エステル系単量体及び極性官能基含有単量体の重合体である、請求項5に記載の粘着テープ。
- 前記極性官能基含有単量体の含量は、(メタ)アクリル酸エステル系単量体100重量部に対して0.7重量部以上2重量部以下である、請求項6に記載の粘着テープ。
- (a)離型フィルム上に水性アクリル系粘着剤組成物を塗布するステップ、
(b)前記塗布された粘着剤組成物に対して順次第1温度(T1)、第2温度(T2)、第3温度(T3)及び第4温度(T4)で発泡及び熱硬化を行って前記離型フィルム上に粘着シートを形成するステップ、
(c)前記粘着シート上に基材を貼り付けるステップ、
(d)前記(c)ステップの結果物を熟成するステップ、及び
(e)前記熟成するステップ後に前記離型フィルムを除去し、前記粘着シートが備えられた基材を巻取りするステップを含む粘着テープの製造方法。 - 前記粘着テープの製造方法は、前記(e)ステップの結果物を巻き出すステップをさらに含む、請求項8に記載の粘着テープの製造方法。
- 前記第1温度は0℃以上30℃以下である、請求項8に記載の粘着テープの製造方法。
- 前記第2温度は150℃以上200℃以下である、請求項8に記載の粘着テープの製造方法。
- 前記第3温度は90℃以上120℃以下である、請求項8に記載の粘着テープの製造方法。
- 前記第4温度は40℃以上80℃以下である、請求項8に記載の粘着テープの製造方法。
- 前記熟成するステップは40℃以上60℃以下の温度で行われる、請求項8に記載の粘着テープの製造方法。
- 前記熟成するステップは20時間以上30時間以下の時間の間行われる、請求項8に記載の粘着テープの製造方法。
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KR20230054144A (ko) * | 2021-10-15 | 2023-04-24 | 주식회사 영우 | 수용성 점착 드레싱재 |
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