JP2018517034A - 付加造形用液状ハイブリッドＵＶ／ｖｉｓ線硬化性樹脂組成物 - Google Patents

付加造形用液状ハイブリッドＵＶ／ｖｉｓ線硬化性樹脂組成物 Download PDF

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Publication number
JP2018517034A
JP2018517034A JP2017560959A JP2017560959A JP2018517034A JP 2018517034 A JP2018517034 A JP 2018517034A JP 2017560959 A JP2017560959 A JP 2017560959A JP 2017560959 A JP2017560959 A JP 2017560959A JP 2018517034 A JP2018517034 A JP 2018517034A
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Japan
Prior art keywords
additive
component
curable composition
liquid
vis
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Japanese (ja)
Inventor
タイ イオン リー，
タイ イオン リー，
ルーク クウィズネック，
ルーク クウィズネック，
ヨハン ヤンセン，
ヨハン ヤンセン，
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DSM IP Assets BV
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DSM IP Assets BV
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F16/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
    • C08F16/12—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/10—Homopolymers or copolymers of unsaturated ethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2017560959A 2015-06-08 2016-06-08 付加造形用液状ハイブリッドＵＶ／ｖｉｓ線硬化性樹脂組成物 Pending JP2018517034A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562172489P 2015-06-08 2015-06-08
US62/172,489 2015-06-08
PCT/US2016/036483 WO2016200972A1 (fr) 2015-06-08 2016-06-08 Compositions de résines liquides durcissables par un rayonnement hybride uv/vis pour une fabrication additive

Related Child Applications (1)

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JP2020011783A Division JP2020090679A (ja) 2015-06-08 2020-01-28 付加造形用液状ハイブリッドＵＶ／ｖｉｓ線硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
JP2018517034A true JP2018517034A (ja) 2018-06-28

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Application Number Title Priority Date Filing Date
JP2017560959A Pending JP2018517034A (ja) 2015-06-08 2016-06-08 付加造形用液状ハイブリッドＵＶ／ｖｉｓ線硬化性樹脂組成物
JP2020011783A Pending JP2020090679A (ja) 2015-06-08 2020-01-28 付加造形用液状ハイブリッドＵＶ／ｖｉｓ線硬化性樹脂組成物
JP2022010953A Pending JP2022070865A (ja) 2015-06-08 2022-01-27 付加造形用液状ハイブリッドＵＶ／ｖｉｓ線硬化性樹脂組成物
JP2023149521A Pending JP2024016018A (ja) 2015-06-08 2023-09-14 付加造形用液状ハイブリッドＵＶ／ｖｉｓ線硬化性樹脂組成物

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JP2022010953A Pending JP2022070865A (ja) 2015-06-08 2022-01-27 付加造形用液状ハイブリッドＵＶ／ｖｉｓ線硬化性樹脂組成物
JP2023149521A Pending JP2024016018A (ja) 2015-06-08 2023-09-14 付加造形用液状ハイブリッドＵＶ／ｖｉｓ線硬化性樹脂組成物

Country Status (5)

Country Link
EP (1) EP3294780A4 (fr)
JP (4) JP2018517034A (fr)
KR (1) KR20180016505A (fr)
CN (1) CN107636025B (fr)
WO (1) WO2016200972A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019077835A (ja) * 2017-10-26 2019-05-23 川崎化成工業株式会社 アントラセン系光ラジカル重合増感剤およびナフタレン系光ラジカル重合増感助剤を含む光ラジカル重合性組成物

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108778688B (zh) * 2016-03-14 2022-05-13 科思创(荷兰)有限公司 具有改善韧性耐高温性的加成法制造用可辐射固化组合物
CN107629705A (zh) * 2017-10-17 2018-01-26 烟台信友新材料股份有限公司 一种高活性低收缩单组份光热双固胶及其制备方法
EP3628697A1 (fr) * 2018-09-27 2020-04-01 Université de Haute Alsace Photopolyaddition éther-amine cyclique ultrarapide et ses utilisations
US11110649B2 (en) * 2019-01-04 2021-09-07 Carbon, Inc. Additively manufactured products having a matte surface finish
CN109880434B (zh) * 2019-02-25 2022-04-19 中钞印制技术研究院有限公司 一种可固化组合物及其用途
US20200373279A1 (en) * 2019-05-24 2020-11-26 Applied Materials, Inc. Color Conversion Layers for Light-Emitting Devices
WO2021042013A1 (fr) * 2019-08-30 2021-03-04 Dsm Ip Assets B.V. Compositions de résine liquides durcissables par rayonnement uv/vis hybride pour la fabrication additive
US20220251287A1 (en) * 2020-01-27 2022-08-11 Hitachi Energy Switzerland Ag Photo radiation curable epoxy for electrical components
CN115485620A (zh) * 2020-05-14 2022-12-16 3M创新有限公司 氟化光引发剂和使用其制备的氟化(共)聚合物层
CN116034117A (zh) 2020-07-24 2023-04-28 应用材料公司 具有用于uv-led固化的基于硫醇的交联剂的量子点配方
US11646397B2 (en) 2020-08-28 2023-05-09 Applied Materials, Inc. Chelating agents for quantum dot precursor materials in color conversion layers for micro-LEDs
EP4049841A1 (fr) 2021-02-26 2022-08-31 Cubicure GmbH Composition de résine hybride
EP4369098A1 (fr) 2022-11-14 2024-05-15 Cubicure GmbH Composition de résine

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0228261A (ja) * 1988-07-15 1990-01-30 Asahi Denka Kogyo Kk 光学的造形用樹脂組成物
JPH0820728A (ja) * 1994-07-05 1996-01-23 Asahi Denka Kogyo Kk 光学的立体造形用樹脂組成物及びこれを用いた光学的立体造形法
JPH11199647A (ja) * 1998-01-13 1999-07-27 Teijin Seiki Co Ltd 光学的造形用樹脂組成物
US6100007A (en) * 1998-04-06 2000-08-08 Ciba Specialty Chemicals Corp. Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures
JP2002520449A (ja) * 1998-07-10 2002-07-09 デー エス エム エヌ．ヴェー． ポリエチレン様物品製造用のソリッドイメージング組成物
JP2004204228A (ja) * 2002-12-13 2004-07-22 Daicel Chem Ind Ltd 硬化性エポキシ樹脂組成物および硬化物
JP2009531485A (ja) * 2006-03-30 2009-09-03 ディーエスエム アイピー アセッツ ビー．ブイ． 陽イオン系組成物およびその製造方法および使用
JP2014518171A (ja) * 2011-06-28 2014-07-28 ガルフ・フィルトレイション・システムズ・インコーポレイテッド ３次元物体を線形凝固を用いて形成するための装置および方法

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2830927A1 (de) 1978-07-14 1980-01-31 Basf Ag Acylphosphinoxidverbindungen und ihre verwendung
US4575330A (en) 1984-08-08 1986-03-11 Uvp, Inc. Apparatus for production of three-dimensional objects by stereolithography
DE3443221A1 (de) 1984-11-27 1986-06-05 ESPE Fabrik pharmazeutischer Präparate GmbH, 8031 Seefeld Bisacylphosphinoxide, ihre herstellung und verwendung
US5434196A (en) 1988-02-19 1995-07-18 Asahi Denka Kogyo K.K. Resin composition for optical molding
US5047568A (en) 1988-11-18 1991-09-10 International Business Machines Corporation Sulfonium salts and use and preparation thereof
ZA941879B (en) 1993-03-18 1994-09-19 Ciba Geigy Curing compositions containing bisacylphosphine oxide photoinitiators
US5380923A (en) 1993-04-29 1995-01-10 Minnesota Mining And Manufacturing Company Polymeric sulfonium salts and method of preparation thereof
US5418112A (en) 1993-11-10 1995-05-23 W. R. Grace & Co.-Conn. Photosensitive compositions useful in three-dimensional part-building and having improved photospeed
US5665792A (en) 1995-06-07 1997-09-09 E. I. Du Pont De Nemours And Company Stabilizers for use with photoacid precursor formulations
CH691970A5 (de) 1996-03-04 2001-12-14 Ciba Sc Holding Ag Alkylphenylbisacylphosphinoxide und Photoinitiatormischungen.
SG53043A1 (en) 1996-08-28 1998-09-28 Ciba Geigy Ag Molecular complex compounds as photoinitiators
JP4204113B2 (ja) * 1997-12-04 2009-01-07 株式会社Ａｄｅｋａ 新規な芳香族スルホニウム化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光造形用樹脂組成物ならびに光学的立体造形法
SE9904080D0 (sv) 1998-12-03 1999-11-11 Ciba Sc Holding Ag Fotoinitiatorberedning
DE60006210T2 (de) 1999-12-08 2004-07-15 Ciba Specialty Chemicals Holding Inc. Neues Photoinitiatorsystem aus Phosphinoxidverbindungen und wenig gefärbte härtbare Zusammensetzungen
SG98433A1 (en) * 1999-12-21 2003-09-19 Ciba Sc Holding Ag Iodonium salts as latent acid donors
US6610759B1 (en) * 2000-03-06 2003-08-26 Curators Of The University Of Missouri Cationically polymerizable adhesive composition containing an acidic component and methods and materials employing same
CN100482694C (zh) * 2002-04-19 2009-04-29 西巴特殊化学品控股有限公司 等离子体诱发的涂层固化
EP1557413B1 (fr) 2002-09-25 2012-08-01 Adeka Corporation Nouveau compose de sel de sulfonium aromatique, generateur photo-acide le comprenant et composition photopolymerisable le contenant, composition de resine pour la mise en forme tridimensionnelle optique et procede correspondant
EP1583740B1 (fr) 2002-12-23 2010-05-26 STX Aprilis, Inc. Generateurs photo-acides au fluoroarylsulfonium
EP1477511A1 (fr) * 2003-05-15 2004-11-17 DSM IP Assets B.V. Compositions à base de polyène et de polythiol durcissables sous irradiation
US7230122B2 (en) 2003-11-04 2007-06-12 National Starch And Chemical Investment Holding Corporation Sulfonium salt photinitiators and use thereof
US7678528B2 (en) 2005-11-16 2010-03-16 Az Electronic Materials Usa Corp. Photoactive compounds
WO2007124911A1 (fr) * 2006-05-01 2007-11-08 Dsm Ip Assets B.V. Composition de résine durcissable par rayonnement et procédé d'imagerie tridimensionnelle rapide utilisant celle-ci
JP5168860B2 (ja) * 2006-09-14 2013-03-27 株式会社スリーボンド 光重合性組成物
US20080103226A1 (en) * 2006-10-31 2008-05-01 Dsm Ip Assets B.V. Photo-curable resin composition
EP2137576B1 (fr) * 2007-04-13 2018-08-29 3D Systems Incorporated Photoinitiateur double, composition photodurcissable, utilisation de ceux-ci et procédé de production d'un article tridimensionnel
WO2009069428A1 (fr) 2007-11-28 2009-06-04 Sumitomo Seika Chemicals Co., Ltd. Générateur de photoacides et composition photoréactive
JP5208573B2 (ja) 2008-05-06 2013-06-12 サンアプロ株式会社 スルホニウム塩、光酸発生剤、光硬化性組成物及びこの硬化体
US9005871B2 (en) 2008-10-20 2015-04-14 Basf Se Sulfonium derivatives and the use therof as latent acids
US8617787B2 (en) 2009-02-20 2013-12-31 San-Apro, Ltd. Sulfonium salt, photo-acid generator, and photosensitive resin composition
US8501033B2 (en) * 2009-03-13 2013-08-06 Dsm Ip Assets B.V. Radiation curable resin composition and rapid three-dimensional imaging process using the same
JP5849350B2 (ja) * 2009-12-17 2016-01-27 ディーエスエム アイピー アセッツ ビー．ブイ． 基材を用いた積層造形法
EP2502728B1 (fr) * 2011-03-23 2017-01-04 DSM IP Assets B.V. Articles tridimensionnels légers et résistants pouvant être produits par des procédés de fabrication additive
JP5530470B2 (ja) * 2012-03-09 2014-06-25 チェイル インダストリーズ インコーポレイテッド 偏光板用接着剤
WO2014109303A1 (fr) * 2013-01-11 2014-07-17 川崎化成工業株式会社 Composé anthracène et son utilisation comme sensibilisateur de photopolymérisation
EP2842980B1 (fr) * 2013-08-09 2021-05-05 DSM IP Assets B.V. Compositions de résine pour moule aligneur dentaire durcissable par rayonnement liquide de faible viscosité de fabrication additive
EP3266815B1 (fr) * 2013-11-05 2021-11-03 Covestro (Netherlands) B.V. Compositions stabilisées de résine durcissables par rayonnement liquide de matrice chargée pour fabrication additive
JP6807531B2 (ja) * 2016-12-20 2021-01-06 岡本化学工業株式会社 光学的立体造形用組成物及びこれを用いた立体造形物の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0228261A (ja) * 1988-07-15 1990-01-30 Asahi Denka Kogyo Kk 光学的造形用樹脂組成物
JPH0820728A (ja) * 1994-07-05 1996-01-23 Asahi Denka Kogyo Kk 光学的立体造形用樹脂組成物及びこれを用いた光学的立体造形法
JPH11199647A (ja) * 1998-01-13 1999-07-27 Teijin Seiki Co Ltd 光学的造形用樹脂組成物
US6100007A (en) * 1998-04-06 2000-08-08 Ciba Specialty Chemicals Corp. Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures
JP2002510748A (ja) * 1998-04-06 2002-04-09 バンティコ アクチエンゲゼルシャフト 特に高熱撓み温度を有するステレオリソグラフ法による柔軟な硬化物品を製造するための液体放射線硬化性組成物
JP2002520449A (ja) * 1998-07-10 2002-07-09 デー エス エム エヌ．ヴェー． ポリエチレン様物品製造用のソリッドイメージング組成物
JP2004204228A (ja) * 2002-12-13 2004-07-22 Daicel Chem Ind Ltd 硬化性エポキシ樹脂組成物および硬化物
JP2009531485A (ja) * 2006-03-30 2009-09-03 ディーエスエム アイピー アセッツ ビー．ブイ． 陽イオン系組成物およびその製造方法および使用
JP2014518171A (ja) * 2011-06-28 2014-07-28 ガルフ・フィルトレイション・システムズ・インコーポレイテッド ３次元物体を線形凝固を用いて形成するための装置および方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019077835A (ja) * 2017-10-26 2019-05-23 川崎化成工業株式会社 アントラセン系光ラジカル重合増感剤およびナフタレン系光ラジカル重合増感助剤を含む光ラジカル重合性組成物
JP7145362B2 (ja) 2017-10-26 2022-10-03 エア・ウォーター・パフォーマンスケミカル株式会社 アントラセン系光ラジカル重合増感剤およびナフタレン系光ラジカル重合増感助剤を含む光ラジカル重合性組成物

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