JP2018507327A5 - - Google Patents

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Publication number
JP2018507327A5
JP2018507327A5 JP2017541314A JP2017541314A JP2018507327A5 JP 2018507327 A5 JP2018507327 A5 JP 2018507327A5 JP 2017541314 A JP2017541314 A JP 2017541314A JP 2017541314 A JP2017541314 A JP 2017541314A JP 2018507327 A5 JP2018507327 A5 JP 2018507327A5
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JP
Japan
Prior art keywords
macro
component
features
chamber
engineered
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JP2017541314A
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English (en)
Japanese (ja)
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JP6917894B2 (ja
JP2018507327A (ja
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Priority claimed from PCT/US2016/013583 external-priority patent/WO2016126403A1/en
Publication of JP2018507327A publication Critical patent/JP2018507327A/ja
Publication of JP2018507327A5 publication Critical patent/JP2018507327A5/ja
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Publication of JP6917894B2 publication Critical patent/JP6917894B2/ja
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JP2017541314A 2015-02-06 2016-01-15 膜応力低減および動作温度低減用に構成された3d印刷されたチャンバ部品 Active JP6917894B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562112649P 2015-02-06 2015-02-06
US62/112,649 2015-02-06
US201562184114P 2015-06-24 2015-06-24
US62/184,114 2015-06-24
PCT/US2016/013583 WO2016126403A1 (en) 2015-02-06 2016-01-15 3d printed chamber components configured for lower film stress and lower operating temperature

Publications (3)

Publication Number Publication Date
JP2018507327A JP2018507327A (ja) 2018-03-15
JP2018507327A5 true JP2018507327A5 (enExample) 2019-02-28
JP6917894B2 JP6917894B2 (ja) 2021-08-11

Family

ID=56564502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017541314A Active JP6917894B2 (ja) 2015-02-06 2016-01-15 膜応力低減および動作温度低減用に構成された3d印刷されたチャンバ部品

Country Status (9)

Country Link
US (1) US10777391B2 (enExample)
EP (1) EP3254305B1 (enExample)
JP (1) JP6917894B2 (enExample)
KR (1) KR102467442B1 (enExample)
CN (1) CN107210179B (enExample)
DE (1) DE202016009201U1 (enExample)
SG (2) SG11201706207QA (enExample)
TW (1) TWI725950B (enExample)
WO (1) WO2016126403A1 (enExample)

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CN210156345U (zh) 2016-09-13 2020-03-17 应用材料公司 用于处理腔室的腔室部件、用于处理腔室的屏蔽的设计膜以及处理腔室
US10434604B2 (en) 2016-10-14 2019-10-08 Applied Materials, Inc. Texturizing a surface without bead blasting
WO2019007488A1 (en) * 2017-07-04 2019-01-10 Cleanpart Group Gmbh TREATMENT CHAMBER COMPONENT AND METHOD FOR FORMING SURFACE TEXTURE
DE102017126624A1 (de) * 2017-11-13 2019-05-16 Trumpf Laser- Und Systemtechnik Gmbh Schichtselektive belichtung im überhangbereich bei der generativen fertigung
US11685990B2 (en) * 2017-12-08 2023-06-27 Applied Materials, Inc. Textured processing chamber components and methods of manufacturing same
CN111788058B (zh) * 2017-12-14 2022-10-25 南洋理工大学 用于在软材料中生成复杂的三维(3d)结构的定向聚合方法
WO2019203978A1 (en) * 2018-04-17 2019-10-24 Applied Materials, Inc. Texturizing a surface without bead blasting
JP7138474B2 (ja) * 2018-05-15 2022-09-16 東京エレクトロン株式会社 部品の修復方法及び基板処理システム
JP7319425B2 (ja) * 2018-05-15 2023-08-01 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理装置用部品
JP7068921B2 (ja) * 2018-05-15 2022-05-17 東京エレクトロン株式会社 部品の形成方法及びプラズマ処理装置
DE102019113001A1 (de) * 2019-05-16 2020-11-19 Wipotec Gmbh Monolithischer Wägeblock
JP7467062B2 (ja) * 2019-10-15 2024-04-15 東京エレクトロン株式会社 シリコン部材の製造方法及び造形装置
US11739411B2 (en) * 2019-11-04 2023-08-29 Applied Materials, Inc. Lattice coat surface enhancement for chamber components
KR102340823B1 (ko) * 2020-07-06 2021-12-20 주식회사 케이제이테크 반도체제조공정 건식식각장치의 SiC 포커스링 제조방법
US11450514B1 (en) * 2021-03-17 2022-09-20 Applied Materials, Inc. Methods of reducing particles in a physical vapor deposition (PVD) chamber

Family Cites Families (20)

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DE4031545A1 (de) * 1990-10-05 1992-04-09 Hell Rudolf Dr Ing Gmbh Verfahren und vorrichtung zur herstellung einer texturwalze
US5614071A (en) * 1995-06-28 1997-03-25 Hmt Technology Corporation Sputtering shield
KR20000069523A (ko) * 1997-01-16 2000-11-25 보텀필드 레인, 에프. 기상 증착 요소 및 기상 증착 방법
US7116366B1 (en) 1999-08-31 2006-10-03 Micron Technology, Inc. CMOS aps pixel sensor dynamic range increase
JP2002319520A (ja) * 2001-04-20 2002-10-31 Murata Mfg Co Ltd インダクタ及びその製造方法
US6777045B2 (en) * 2001-06-27 2004-08-17 Applied Materials Inc. Chamber components having textured surfaces and method of manufacture
US6933508B2 (en) * 2002-03-13 2005-08-23 Applied Materials, Inc. Method of surface texturizing
US6812471B2 (en) * 2002-03-13 2004-11-02 Applied Materials, Inc. Method of surface texturizing
US20040206804A1 (en) * 2002-07-16 2004-10-21 Jaeyeon Kim Traps for particle entrapment in deposition chambers
US6955748B2 (en) * 2002-07-16 2005-10-18 Honeywell International Inc. PVD target constructions comprising projections
WO2005001918A1 (en) * 2003-06-11 2005-01-06 Honeywell International Inc. Traps for particle entrapment in deposition chambers
CN1806316A (zh) * 2003-06-11 2006-07-19 霍尼韦尔国际公司 沉积室中用于捕集粒子的阱
TWI342582B (en) * 2003-07-17 2011-05-21 Applied Materials Inc Method of surface texturizing
US20060292310A1 (en) * 2005-06-27 2006-12-28 Applied Materials, Inc. Process kit design to reduce particle generation
US7943434B2 (en) * 2008-03-21 2011-05-17 Occam Portfolio Llc Monolithic molded flexible electronic assemblies without solder and methods for their manufacture
PL2156941T3 (pl) * 2008-08-21 2013-06-28 Ge Avio Srl Proces wytwarzania filtra, w szczególności dla separatora obrotowego oraz filtr otrzymany w tym procesie
EP2556015B1 (en) * 2010-04-09 2016-08-10 Frank Niklaus Free form printing of silicon micro- and nanostructures
US20120258280A1 (en) * 2011-04-11 2012-10-11 Applied Materials, Inc. Extended life textured chamber components and method for fabricating same
JP5989593B2 (ja) * 2012-04-27 2016-09-07 日本碍子株式会社 半導体製造装置用部材
US9099575B2 (en) * 2013-07-16 2015-08-04 Cree, Inc. Solid state lighting devices and fabrication methods including deposited light-affecting elements

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