SG11201706207QA - 3d printed chamber components configured for lower film stress and lower operating temperature - Google Patents

3d printed chamber components configured for lower film stress and lower operating temperature

Info

Publication number
SG11201706207QA
SG11201706207QA SG11201706207QA SG11201706207QA SG11201706207QA SG 11201706207Q A SG11201706207Q A SG 11201706207QA SG 11201706207Q A SG11201706207Q A SG 11201706207QA SG 11201706207Q A SG11201706207Q A SG 11201706207QA SG 11201706207Q A SG11201706207Q A SG 11201706207QA
Authority
SG
Singapore
Prior art keywords
operating temperature
components configured
film stress
chamber components
lower film
Prior art date
Application number
SG11201706207QA
Inventor
Kadthala R Narendrnath
Govinda Raj
Goichi Yoshidome
Bopanna Ichettira Vasantha
Umesh M Kelkar
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201706207QA publication Critical patent/SG11201706207QA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3288—Maintenance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211—Antennas, e.g. particular shapes of coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32467—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32807—Construction (includes replacing parts of the apparatus)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32871—Means for trapping or directing unwanted particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/10—Formation of a green body
    • B22F10/14—Formation of a green body by jetting of binder onto a bed of metal powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/10—Formation of a green body
    • B22F10/18—Formation of a green body by mixing binder with metal in filament form, e.g. fused filament fabrication [FFF]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/25—Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/32—Process control of the atmosphere, e.g. composition or pressure in a building chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/70—Gas flow means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Push-Button Switches (AREA)
  • Ink Jet (AREA)
  • Printing Methods (AREA)
  • Braking Systems And Boosters (AREA)
SG11201706207QA 2015-02-06 2016-01-15 3d printed chamber components configured for lower film stress and lower operating temperature SG11201706207QA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562112649P 2015-02-06 2015-02-06
US201562184114P 2015-06-24 2015-06-24
PCT/US2016/013583 WO2016126403A1 (en) 2015-02-06 2016-01-15 3d printed chamber components configured for lower film stress and lower operating temperature

Publications (1)

Publication Number Publication Date
SG11201706207QA true SG11201706207QA (en) 2017-08-30

Family

ID=56564502

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201907105SA SG10201907105SA (en) 2015-02-06 2016-01-15 3d printed chamber components configured for lower film stress and lower operating temperature
SG11201706207QA SG11201706207QA (en) 2015-02-06 2016-01-15 3d printed chamber components configured for lower film stress and lower operating temperature

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201907105SA SG10201907105SA (en) 2015-02-06 2016-01-15 3d printed chamber components configured for lower film stress and lower operating temperature

Country Status (9)

Country Link
US (1) US10777391B2 (en)
EP (1) EP3254305B1 (en)
JP (1) JP6917894B2 (en)
KR (1) KR102467442B1 (en)
CN (1) CN107210179B (en)
DE (1) DE202016009201U1 (en)
SG (2) SG10201907105SA (en)
TW (1) TWI725950B (en)
WO (1) WO2016126403A1 (en)

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WO2018052533A1 (en) 2016-09-13 2018-03-22 Applied Materials, Inc. Textured skin for chamber components
WO2019007488A1 (en) * 2017-07-04 2019-01-10 Cleanpart Group Gmbh Process chamber component and method of forming a surface texture
DE102017126624A1 (en) * 2017-11-13 2019-05-16 Trumpf Laser- Und Systemtechnik Gmbh LAYERED LIGHT EXPOSURE IN GENERATIVE MANUFACTURING
US11685990B2 (en) 2017-12-08 2023-06-27 Applied Materials, Inc. Textured processing chamber components and methods of manufacturing same
WO2019117814A1 (en) * 2017-12-14 2019-06-20 Nanyang Technological University Directed polymerization method to generate complex, three dimensional (3d) structures in soft materials
JP7319425B2 (en) * 2018-05-15 2023-08-01 東京エレクトロン株式会社 Plasma processing equipment and parts for plasma processing equipment
JP7138474B2 (en) * 2018-05-15 2022-09-16 東京エレクトロン株式会社 Parts repair method and substrate processing system
JP7068921B2 (en) * 2018-05-15 2022-05-17 東京エレクトロン株式会社 Parts forming method and plasma processing equipment
DE102019113001A1 (en) * 2019-05-16 2020-11-19 Wipotec Gmbh Monolithic weighing block
JP7467062B2 (en) * 2019-10-15 2024-04-15 東京エレクトロン株式会社 Method and apparatus for manufacturing silicon parts
US11739411B2 (en) * 2019-11-04 2023-08-29 Applied Materials, Inc. Lattice coat surface enhancement for chamber components
KR102340823B1 (en) * 2020-07-06 2021-12-20 주식회사 케이제이테크 METHOD FOR MANUFACTURING SiC FOCUS RING FOR DRY ETCHING EQUIPMENT OF SEMICONDUCTOR MANUFACTURING PRECESS

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DE4031545A1 (en) * 1990-10-05 1992-04-09 Hell Rudolf Dr Ing Gmbh METHOD AND DEVICE FOR PRODUCING A TEXTURE ROLL
US5614071A (en) * 1995-06-28 1997-03-25 Hmt Technology Corporation Sputtering shield
KR20000069523A (en) * 1997-01-16 2000-11-25 보텀필드 레인, 에프. Vapor deposition components and corresponding methods
US7116366B1 (en) 1999-08-31 2006-10-03 Micron Technology, Inc. CMOS aps pixel sensor dynamic range increase
JP2002319520A (en) * 2001-04-20 2002-10-31 Murata Mfg Co Ltd Inductor and method of manufacturing it
US6777045B2 (en) * 2001-06-27 2004-08-17 Applied Materials Inc. Chamber components having textured surfaces and method of manufacture
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KR20060023115A (en) 2003-06-11 2006-03-13 허니웰 인터내셔널 인코포레이티드 Traps for particle entrapment in deposition chambers
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Also Published As

Publication number Publication date
TW201636192A (en) 2016-10-16
EP3254305B1 (en) 2023-05-10
TWI725950B (en) 2021-05-01
US20160233060A1 (en) 2016-08-11
JP2018507327A (en) 2018-03-15
KR102467442B1 (en) 2022-11-14
EP3254305A4 (en) 2018-10-03
CN107210179B (en) 2019-10-18
JP6917894B2 (en) 2021-08-11
SG10201907105SA (en) 2019-09-27
CN107210179A (en) 2017-09-26
US10777391B2 (en) 2020-09-15
EP3254305A1 (en) 2017-12-13
WO2016126403A1 (en) 2016-08-11
KR20170115599A (en) 2017-10-17
DE202016009201U1 (en) 2024-01-18

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