JP2018207040A - シールドケース - Google Patents

シールドケース Download PDF

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Publication number
JP2018207040A
JP2018207040A JP2017113543A JP2017113543A JP2018207040A JP 2018207040 A JP2018207040 A JP 2018207040A JP 2017113543 A JP2017113543 A JP 2017113543A JP 2017113543 A JP2017113543 A JP 2017113543A JP 2018207040 A JP2018207040 A JP 2018207040A
Authority
JP
Japan
Prior art keywords
shield case
heat transfer
transfer member
lid
frame body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017113543A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018207040A5 (enExample
Inventor
智和 湯淺
Tomokazu Yuasa
智和 湯淺
英雄 白坂
Hideo Shirasaka
英雄 白坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Dynabook Inc
Original Assignee
Toshiba Corp
Toshiba Client Solutions Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Client Solutions Co Ltd filed Critical Toshiba Corp
Priority to JP2017113543A priority Critical patent/JP2018207040A/ja
Priority to US15/953,682 priority patent/US10405468B2/en
Publication of JP2018207040A publication Critical patent/JP2018207040A/ja
Publication of JP2018207040A5 publication Critical patent/JP2018207040A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2017113543A 2017-06-08 2017-06-08 シールドケース Pending JP2018207040A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017113543A JP2018207040A (ja) 2017-06-08 2017-06-08 シールドケース
US15/953,682 US10405468B2 (en) 2017-06-08 2018-04-16 Shield case and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017113543A JP2018207040A (ja) 2017-06-08 2017-06-08 シールドケース

Publications (2)

Publication Number Publication Date
JP2018207040A true JP2018207040A (ja) 2018-12-27
JP2018207040A5 JP2018207040A5 (enExample) 2020-07-16

Family

ID=64563869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017113543A Pending JP2018207040A (ja) 2017-06-08 2017-06-08 シールドケース

Country Status (2)

Country Link
US (1) US10405468B2 (enExample)
JP (1) JP2018207040A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021174964A (ja) * 2020-04-30 2021-11-01 株式会社デンソー レーダ装置
DE112020003220T5 (de) 2019-07-05 2022-03-24 Denso Corporation Radarvorrichtung

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10736246B2 (en) * 2018-09-28 2020-08-04 Apple Inc. Electromagnetic interference shielding having a magnetically attracted shield arm
JP7272146B2 (ja) 2019-07-05 2023-05-12 株式会社デンソー レーダ装置
CN111465172B (zh) * 2020-04-11 2021-06-15 万安裕维电子有限公司 一种阻燃pcb板

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09172283A (ja) * 1995-12-18 1997-06-30 Alps Electric Co Ltd シールドケース
JP2001274590A (ja) * 2000-03-27 2001-10-05 Mitsumi Electric Co Ltd 電子機器のシールドケース
JP2001326492A (ja) * 2000-05-17 2001-11-22 Casio Comput Co Ltd 熱および電磁ノイズ兼用対策部品、および電子機器
JP2002280776A (ja) * 2001-03-19 2002-09-27 Denso Corp 発熱素子の実装構造
JP2003174270A (ja) * 2001-12-06 2003-06-20 Alps Electric Co Ltd チューナユニット
JP2007158216A (ja) * 2005-12-08 2007-06-21 Yamaha Corp 半導体装置
US20070210082A1 (en) * 2006-03-09 2007-09-13 English Gerald R EMI shielding and thermal management assemblies including frames and covers with multi-position latching
JP2007335672A (ja) * 2006-06-15 2007-12-27 Murata Mfg Co Ltd シールド構造体
JP2010199340A (ja) * 2009-02-25 2010-09-09 Kyocera Corp 電子機器

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02170593A (ja) 1988-12-23 1990-07-02 Canon Inc Ｉｃの放熱構造
EP0866648B1 (en) * 1997-03-19 2005-01-05 Telefonaktiebolaget LM Ericsson (publ) A two-part electromagnetic radiation shielding device for mounting on a printed circuit board
JP2002368481A (ja) 2001-06-11 2002-12-20 Canon Inc 電子機器
US6872880B2 (en) * 2003-06-17 2005-03-29 Delphi Technologies, Inc. Two-piece solderless EMC/EMI shield
TWI351918B (en) * 2004-01-29 2011-11-01 Laird Technologies Inc Ultra-low height electromagnetic interference shie
US7724542B2 (en) * 2006-12-30 2010-05-25 Intel Corporation Reworkable RF shield
JP5216342B2 (ja) 2008-01-29 2013-06-19 京セラ株式会社 シールドケース及び電子機器
CN101662924A (zh) * 2008-08-26 2010-03-03 深圳富泰宏精密工业有限公司 电磁屏蔽盖
US7876579B1 (en) * 2009-09-23 2011-01-25 Ezconn Corporation Anti-electromagnetic interference corner shield unit for a shielding device
CN102036540A (zh) * 2009-09-30 2011-04-27 莱尔德技术股份有限公司 屏蔽外壳
JP5625339B2 (ja) * 2009-12-01 2014-11-19 富士通株式会社 シールドケース、及び、通信装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09172283A (ja) * 1995-12-18 1997-06-30 Alps Electric Co Ltd シールドケース
JP2001274590A (ja) * 2000-03-27 2001-10-05 Mitsumi Electric Co Ltd 電子機器のシールドケース
JP2001326492A (ja) * 2000-05-17 2001-11-22 Casio Comput Co Ltd 熱および電磁ノイズ兼用対策部品、および電子機器
JP2002280776A (ja) * 2001-03-19 2002-09-27 Denso Corp 発熱素子の実装構造
JP2003174270A (ja) * 2001-12-06 2003-06-20 Alps Electric Co Ltd チューナユニット
JP2007158216A (ja) * 2005-12-08 2007-06-21 Yamaha Corp 半導体装置
US20070210082A1 (en) * 2006-03-09 2007-09-13 English Gerald R EMI shielding and thermal management assemblies including frames and covers with multi-position latching
JP2007335672A (ja) * 2006-06-15 2007-12-27 Murata Mfg Co Ltd シールド構造体
JP2010199340A (ja) * 2009-02-25 2010-09-09 Kyocera Corp 電子機器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112020003220T5 (de) 2019-07-05 2022-03-24 Denso Corporation Radarvorrichtung
JP2021174964A (ja) * 2020-04-30 2021-11-01 株式会社デンソー レーダ装置

Also Published As

Publication number Publication date
US20180359884A1 (en) 2018-12-13
US10405468B2 (en) 2019-09-03

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