JP2018185343A - Ｉｃチップテスト装置、ｉｃチップテスト方法、及びｉｃチップテストシステム - Google Patents

Ｉｃチップテスト装置、ｉｃチップテスト方法、及びｉｃチップテストシステム Download PDF

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Publication number
JP2018185343A
JP2018185343A JP2018148438A JP2018148438A JP2018185343A JP 2018185343 A JP2018185343 A JP 2018185343A JP 2018148438 A JP2018148438 A JP 2018148438A JP 2018148438 A JP2018148438 A JP 2018148438A JP 2018185343 A JP2018185343 A JP 2018185343A
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JP
Japan
Prior art keywords
scan
shift frequency
test
pattern
chip
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Pending
Application number
JP2018148438A
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English (en)
Japanese (ja)
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JP2018185343A5 (ja
Inventor
ソン、ジャエフーン
Jae Hoon Song
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Innotio Inc
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Innotio Inc
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Filing date
Publication date
Priority claimed from KR1020170053361A external-priority patent/KR101848480B1/ko
Application filed by Innotio Inc filed Critical Innotio Inc
Publication of JP2018185343A publication Critical patent/JP2018185343A/ja
Publication of JP2018185343A5 publication Critical patent/JP2018185343A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318544—Scanning methods, algorithms and patterns
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318544—Scanning methods, algorithms and patterns
    • G01R31/318547—Data generators or compressors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318583—Design for test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318594—Timing aspects

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Power Engineering (AREA)
JP2018148438A 2014-10-29 2018-08-07 Ｉｃチップテスト装置、ｉｃチップテスト方法、及びｉｃチップテストシステム Pending JP2018185343A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
KR20140148443 2014-10-29
KR1020160052368A KR20170049357A (ko) 2014-10-29 2016-04-28 칩 테스트 시간 최소화 방법 및 그 장치
KR10-2016-0052368 2016-04-28
KR1020170053361A KR101848480B1 (ko) 2016-04-28 2017-04-26 Ic 칩 테스트 장치, ic 칩 테스트 방법, 및 ic 칩 테스트 시스템
KR1020170053344A KR20170123260A (ko) 2016-04-28 2017-04-26 Ic 칩 테스트 장치, ic 칩 테스트 방법, 및 ic 칩 테스트 시스템
KR10-2017-0053361 2017-04-26
KR10-2017-0053344 2017-04-26

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2017172831A Division JP2018010005A (ja) 2014-10-29 2017-09-08 Ｉｃチップテスト装置、ｉｃチップテスト方法、及びｉｃチップテストシステム

Publications (2)

Publication Number Publication Date
JP2018185343A true JP2018185343A (ja) 2018-11-22
JP2018185343A5 JP2018185343A5 (ja) 2020-06-11

Family

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Family Applications (1)

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JP2018148438A Pending JP2018185343A (ja) 2014-10-29 2018-08-07 Ｉｃチップテスト装置、ｉｃチップテスト方法、及びｉｃチップテストシステム

Country Status (3)

Country Link
JP (1) JP2018185343A (zh)
KR (6) KR101618822B1 (zh)
CN (1) CN109061432B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
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CN112526319A (zh) * 2020-11-25 2021-03-19 海光信息技术股份有限公司 芯片测试方法、装置、处理器芯片及服务器
KR20220050017A (ko) * 2020-10-15 2022-04-22 (주)큐랩스 설계된 회로도에서의 회로 및 부품 검증 시스템 및 방법
CN114850080A (zh) * 2022-04-29 2022-08-05 上海艾为电子技术股份有限公司 一种量产测试方法、系统和存储介质
CN116581043A (zh) * 2023-04-20 2023-08-11 深圳市晶存科技有限公司 芯片分类方法、装置、电子设备及计算机可读存储介质
CN116953490A (zh) * 2023-09-19 2023-10-27 西安智多晶微电子有限公司 一种测量fpga芯片内部电压降的方法、装置和系统

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JP6209299B1 (ja) * 2016-04-28 2017-10-04 イノチオ インクＩｎｎｏｔｉｏ Ｉｎｃ． Ｉｃチップテスト装置、ｉｃチップテスト方法、及びｉｃチップテストシステム
KR20210119422A (ko) 2019-01-31 2021-10-05 텍트로닉스 인코포레이티드 고속 입력/출력 마진 테스팅을 위한 시스템, 방법 및 디바이스
US11940483B2 (en) 2019-01-31 2024-03-26 Tektronix, Inc. Systems, methods and devices for high-speed input/output margin testing
CN113740701B (zh) * 2020-05-28 2024-03-08 第一检测有限公司 环境控制设备及芯片测试系统
TWI809570B (zh) * 2020-11-24 2023-07-21 美商泰克特洛尼克斯公司 用於高速輸入／輸出裕度測試的系統、方法和裝置
CN113075487A (zh) * 2021-03-31 2021-07-06 读书郎教育科技有限公司 一种工厂控制老化测试时长的方法
KR102373560B1 (ko) * 2021-08-18 2022-03-14 (주)이노티오 Ic 칩 스캔 테스트를 위한 테스트 데이터의 사용 가능한 쉬프트 주파수를 찾기 위한 검색용 데이터를 생성하는 방법 및 그 장치
US20230184821A1 (en) * 2021-12-09 2023-06-15 Nanya Technology Corporation Appratus for performing multiple tests on a device under test
TWI813481B (zh) * 2022-10-25 2023-08-21 瑞昱半導體股份有限公司 用來測試具有除錯功能之晶片上時脈控制器的測試裝置

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JP2006064395A (ja) * 2004-08-24 2006-03-09 Seiko Epson Corp クリティカルパステスト方法、集積回路装置、クリティカルパステスト方式及び集積回路装置の製造方法
JP4820560B2 (ja) * 2005-03-07 2011-11-24 株式会社アドバンテスト 試験装置、試験方法、電子デバイスの生産方法、試験シミュレータ、及び試験シミュレーション方法
US7805648B2 (en) * 2008-04-07 2010-09-28 Open-Silicon Inc. Shift-frequency scaling
KR20100002357A (ko) * 2008-06-30 2010-01-07 삼성전자주식회사 멀티 번인 테스트 방법
CN103018661A (zh) * 2009-09-01 2013-04-03 新诺普系统公司 扫描测试系统
KR101170433B1 (ko) 2010-09-10 2012-08-07 주식회사 윈탑 번인 보드 테스트 장치 및 방법, 이를 이용한 번인 보드 실장 장치
KR20120102876A (ko) 2011-03-09 2012-09-19 삼성전자주식회사 반도체 장치 및 이를 포함하는 테스트 시스템
KR101309079B1 (ko) 2012-02-29 2013-09-17 주식회사 유니테스트 번인 테스터
JP2014001937A (ja) 2012-06-15 2014-01-09 Renesas Electronics Corp スキャンテスト方法、プログラムおよびスキャンテスト回路
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JP6491507B2 (ja) * 2015-03-20 2019-03-27 ルネサスエレクトロニクス株式会社 半導体装置、電子装置および半導体装置の自己診断方法

Cited By (8)

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Publication number Priority date Publication date Assignee Title
KR20220050017A (ko) * 2020-10-15 2022-04-22 (주)큐랩스 설계된 회로도에서의 회로 및 부품 검증 시스템 및 방법
KR102486624B1 (ko) 2020-10-15 2023-01-11 (주)큐랩스 설계된 회로도에서의 회로 및 부품 검증 시스템 및 방법
CN112526319A (zh) * 2020-11-25 2021-03-19 海光信息技术股份有限公司 芯片测试方法、装置、处理器芯片及服务器
CN114850080A (zh) * 2022-04-29 2022-08-05 上海艾为电子技术股份有限公司 一种量产测试方法、系统和存储介质
CN116581043A (zh) * 2023-04-20 2023-08-11 深圳市晶存科技有限公司 芯片分类方法、装置、电子设备及计算机可读存储介质
CN116581043B (zh) * 2023-04-20 2023-12-12 深圳市晶存科技有限公司 芯片分类方法、装置、电子设备及计算机可读存储介质
CN116953490A (zh) * 2023-09-19 2023-10-27 西安智多晶微电子有限公司 一种测量fpga芯片内部电压降的方法、装置和系统
CN116953490B (zh) * 2023-09-19 2023-12-26 西安智多晶微电子有限公司 一种测量fpga芯片内部电压降的方法、装置和系统

Also Published As

Publication number Publication date
CN109061432B (zh) 2020-09-04
KR20160051491A (ko) 2016-05-11
KR20170049357A (ko) 2017-05-10
KR20160067815A (ko) 2016-06-14
KR20160052348A (ko) 2016-05-12
KR101649708B1 (ko) 2016-08-23
CN109061432A (zh) 2018-12-21
KR101618822B1 (ko) 2016-05-18
KR101923142B1 (ko) 2018-11-28
KR20180006480A (ko) 2018-01-17

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